EP2SGX60EF1152I5N - 60K Logic Cells FPGA | Intel | Industrial
MPN: EP2SGX60EF1152I5N ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
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| 1,000 | $0 | $0.00 |
EP2SGX60EF1152I5N Overview
A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, routing resources, and input/output structures. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside complex programmable logic devices, and is used when designers need hardware-level parallelism, rapid design changes, or high-speed digital signal processing.
The principal verified feature of EP2SGX60EF1152I5N is its 60,440-cell Stratix II GX architecture. The device uses 90 nm CMOS technology and is specified for industrial temperature operation. The part is listed as a 1.2 V FPGA, while the verified package data indicates a 1 mm terminal pitch and 1152 ball terminals. These characteristics make it relevant to high-density digital systems where programmable logic and transceiver-oriented integration are required.
The Stratix II GX family is intended for demanding logic, signal-processing, and communications-oriented designs. A 60,440-cell array can support substantial combinational and sequential logic, while the reported 609.76 MHz to 717 MHz internal frequency indicates the performance class expected from this family. The exact frequency value can vary with the source and design context, so timing closure should be performed using the manufacturer timing model and the selected configuration.
Typical applications include industrial communications equipment, networking hardware, image-processing systems, and high-speed test or instrumentation equipment. Its BGA package supports dense board-level interconnect, while the industrial temperature grade is suitable for controlled industrial environments. The part may also be considered for legacy or existing designs that already use Stratix II GX silicon.
Designers should verify the complete ball map, power rails, configuration interface, signal-integrity constraints, and thermal solution from the manufacturer documentation. The verified data does not provide sufficient detail for every electrical, timing, or mechanical parameter, so missing values must not be inferred from family-level assumptions. This page consolidates exact verified specifications, sourcing information, and clearly marked data gaps for engineering review.
Drop-in alternatives for EP2SGX60EF1152I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60EF1152I5N (same form factor and footprint) — differing in Package, Operating Temperature, Mounting Type, RoHS Status, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60EF1152I5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$178 / Unit
View Datasheet →EP2SGX60EF1152I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP2SGX60EF1152C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3300 / Unit
View Datasheet →EP2SGX60EF1152C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1350 / Unit
View Datasheet →EP2SGX60DF780I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1310 / Unit
View Datasheet →EP2SGX60EF1152I5N Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix II GX |
| Logic Cells | 60,440 |
| Logic Blocks | 60,440 |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Internal Frequency | 717 MHz |
| Reported Internal Frequency | 609.76 MHz |
| Maximum Clock Frequency | 622.08 MHz |
| Operating Temperature Range | -40 °C to 85 °C |
| Package | 1152-ball BGA |
| Package Type | FC-FBGA |
| Package Dimensions | 23 x 23 mm |
| Terminal Pitch | 1 mm |
| Number of Terminals | 1152 |
| Terminal Form | Ball |
| Temperature Grade | Industrial |
| RoHS Status | unknown |
| REACH Status | unknown |
EP2SGX60EF1152I5N 23 x 23 mm Pin Configuration Guide
Pin configuration for EP2SGX60EF1152I5N (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60EF1152I5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60EF1152I5N is suitable for 6 applications: Industrial Communications Equipment, Networking and Packet Processing, High-Speed Test and Measurement, Image and Video Processing, Industrial Control Systems, Legacy Digital Platform Modernization.
Industrial Communications Equipment
EP2SGX60EF1152I5N fits industrial communications equipment because it combines 60,440 logic cells with a Stratix II GX FPGA architecture and an industrial temperature range of -40 °C to 85 °C. The device can be used for protocol processing, traffic management, control logic, and high-speed digital functions in a compact programmable platform. Its reported 1.2 V supply and 90 nm CMOS process are relevant to power-rail and thermal planning. The 1152-ball BGA package provides dense interconnect, but designers must confirm the exact ball map and apply appropriate signal-integrity constraints. This makes the part suitable for existing industrial systems that already specify Stratix II GX devices and require configurable logic rather than a fixed-function implementation.
Recommended
Networking and Packet Processing
EP2SGX60EF1152I5N is relevant to networking and packet-processing designs that benefit from parallel programmable logic. The 60,440 logic cells provide substantial capacity for packet classification, buffering control, interface adaptation, and line-rate decision logic. Its Stratix II GX family identity and reported high-frequency performance make it a candidate for systems requiring configurable digital processing, while the 1.2 V supply should be incorporated into a low-noise power-distribution design. The 1152-ball BGA format supports dense board-level routing, so controlled impedance, return-path continuity, and power-plane integrity are important. Exact packet throughput cannot be calculated from the supplied data because I/O count, memory resources, and timing constraints are not specified.
Recommended
High-Speed Test and Measurement
EP2SGX60EF1152I5N can serve in high-speed test and measurement equipment where programmable logic is used to capture, route, filter, and process digital signals. Its 60,440 logic cells provide a useful resource base for custom timing, control, and data-reduction functions, while the reported 609.76 MHz to 717 MHz internal-frequency values indicate a high-performance device class. The industrial temperature range of -40 °C to 85 °C supports equipment deployed in controlled industrial environments. However, actual acquisition performance depends on the complete I/O interface, memory configuration, clock implementation, and timing closure. The 1152-ball BGA package requires careful fan-out, decoupling, and thermal validation before release.
Recommended
Image and Video Processing
EP2SGX60EF1152I5N can support image and video processing systems that need parallel datapaths and configurable control logic. The 60,440 logic cells allow designers to implement pixel pipelines, frame handling, filtering, and interface functions, while the FPGA format permits design changes without a new custom silicon mask set. Its reported 90 nm CMOS process and 1.2 V supply are useful inputs for system-level power and thermal analysis. The device is listed in a 1152-ball BGA package with 1 mm pitch, which supports dense integration but places strict demands on PCB fabrication, escape routing, and signal integrity. Image throughput and supported resolution cannot be specified without verified memory and I/O information.
Recommended
Industrial Control Systems
EP2SGX60EF1152I5N is suitable for industrial control systems requiring configurable sequencing, state machines, sensor aggregation, and real-time digital processing. The industrial temperature specification of -40 °C to 85 °C is a direct fit for controlled factory and automation environments, while the 60,440 logic cells provide enough architecture density for multiple control functions on one programmable device. Its 1.2 V supply requires a stable, low-noise power implementation, and the BGA package requires controlled assembly. The verified data does not state the number of user I/Os, embedded memory, transceiver resources, or power dissipation, so control-system suitability must be confirmed through the full manufacturer documentation and design-specific timing analysis.
Recommended
Legacy Digital Platform Modernization
EP2SGX60EF1152I5N is most practical in legacy digital-platform programs that already use Stratix II GX FPGAs and need a controlled replacement or continuation part. The verified MPN identifies 60,440 logic cells, 90 nm CMOS technology, a 1.2 V supply, and a 1152-ball BGA package. That combination is valuable when an existing board, firmware flow, or intellectual-property block depends on the Stratix II GX family. The industrial temperature grade extends deployment options, but modernization should include comparison of configuration files, power sequencing, pin assignments, and tool compatibility. Because the supplied data does not confirm lifecycle status or a verified substitute, procurement and redesign teams should validate availability and obsolescence planning with the manufacturer.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60EF1152I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152I5 | EP2SGX60EF1152I4N | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N | EP2SGX60DF780I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball BGA | 1152-ball BGA | 1152-ball BGA | 1152-ball BGA | 1152-ball BGA | 780-ball BGA |
| Logic Cells | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Industrial | Industrial | Industrial | Commercial | Commercial | Industrial |
| Exact Pin Compatibility | Target pinout requires manufacturer ball map | Not verified | Not verified | Not verified | Not verified | Not verified; package differs |
Key Differentiators
- High verified logic density (vs EP2SGX60EF1152I4N)
- Industrial temperature specification (vs EP2SGX60EF1152C5N)
- Large high-density BGA integration (vs EP2SGX60DF780I4N)
Design Notes
EP2SGX60EF1152I5N is verified with a 1.2 V supply requirement, but the supplied data does not provide current consumption, power dissipation, or recommended decoupling values. Before schematic release, obtain the official power-supply connection diagram and use the design-specific configuration, clock rate, I/O activity, and utilization to estimate worst-case current. Keep the high-current path and return path compact, and place local bulk and high-frequency capacitors according to the manufacturer power-delivery guidance rather than copying values from an unrelated Stratix design.
The target is identified as a 1152-ball BGA with a 1 mm pitch and a 23 x 23 mm package. Use the official ball map and package drawing before routing, because the verified search snippets do not provide pin names or ball assignments. Check escape-routing density, via-in-pad requirements, solder-mask geometry, and the manufacturer assembly rules. Maintain continuous reference planes and controlled-impedance routing for high-speed I/O, and verify the actual package nomenclature against the ordering-code drawing before fabrication.
The device is specified for -40 °C to 85 °C operation, but no verified thermal-resistance or maximum-junction-temperature data is provided. Estimate thermal performance from the actual configuration, 1.2 V supply, switching activity, and board airflow, then validate the assembled board under worst-case ambient and I/O loading. The large BGA package should be evaluated with realistic copper coverage, thermal vias, and enclosure conditions. Do not convert the industrial ambient rating into a junction-temperature rating without the missing thermal data.
Do not treat the reported 609.76 MHz, 622.08 MHz, and 717 MHz figures as one guaranteed system-clock specification. They come from different search results and may refer to different internal or maximum-frequency conditions. Similarly, do not assume that an I5, I4, or C-family ordering code is a drop-in replacement solely because it appears in a related family list. Confirm the exact MPN, package, ball map, temperature grade, configuration interface, timing model, and tool compatibility before substitution.
Compliance Information
No verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals statement is present in the supplied data. The part is not identified as an AEC-Q100 qualified device.
