EP2SGX60EF1152I5N vs EP2SGX60EF1152I5 Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I5N by Intel and EP2SGX60EF1152I5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I5N EP2SGX60EF1152I5
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $178.00
Device Type Field Programmable Gate Array (FPGA) β€”
Family Stratix II GX Stratix II GX
Logic Cells 60,440 β€”
Logic Blocks 60,440 β€”
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V 1.15 V to 1.25 V
Internal Frequency 717 MHz β€”
Reported Internal Frequency 609.76 MHz β€”
Maximum Clock Frequency 622.08 MHz 622.08 MHz
Operating Temperature Range -40 Β°C to 85 Β°C β€”
Package 1152-ball BGA 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch
Package Type FC-FBGA β€”
Package Dimensions 23 x 23 mm β€”
Terminal Pitch 1 mm β€”
Number of Terminals 1152 1152
Terminal Form Ball Ball
Temperature Grade Industrial β€”
Propagation Delay [DATA_NEEDED: propagation delay] β€”
Configuration Memory [DATA_NEEDED: configuration memory type and size] β€”
I/O Count [DATA_NEEDED: user I/O count] β€”
Transceiver Count [DATA_NEEDED: transceiver count] β€”
RoHS Status unknown [DATA_NEEDED: RoHS status]
REACH Status unknown β€”
Logic Elements (LEs) β€” 60,440
Configurable Logic Blocks (CLBs) β€” 60,440
Embedded Memory (bits) β€” 2,544,192
Operating Temperature Grade β€” Industrial (-40 Β°C to +85 Β°C)
Mounting Type β€” Surface Mount (flip-chip BGA)
Package Code β€” BGA
MSL Level β€” [DATA_NEEDED: MSL rating]
Transceivers β€” Integrated multi-gigabit transceivers (per Stratix II GX family)
DSP Blocks β€” Yes, hardware multipliers and DSP blocks (per Stratix II GX family)

Datasheets & Resources

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