EP2SGX60EFI1152 vs EP2SGX60EF1152I3N Comparison

Detailed side-by-side comparison of EP2SGX60EFI1152 by Intel and EP2SGX60EF1152I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX60EFI1152 EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 Obsolete

Specification Comparison

Parameter EP2SGX60EFI1152 EP2SGX60EF1152I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $1,195.00
Manufacturer Intel β€”
Product Type Field Programmable Gate Array (FPGA) β€”
Family Stratix II GX Stratix II GX
Configuration Type Enhanced Configuration (EPC) device β€”
Logic Elements 60,440 β€”
Configuration-related Memory 2,544,192 bits β€”
User I/O 534 β€”
LAB Count 3,022 LABs β€”
Package 1,152-ball FineLine BGA β€”
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature [DATA_NEEDED: operating temperature range] β€”
Speed Grade [DATA_NEEDED: speed grade] β€”
Supply Voltage [DATA_NEEDED: supply voltage] β€”
Transceiver Count [DATA_NEEDED: transceiver count] β€”
Package Dimensions [DATA_NEEDED: package dimensions] β€”
RoHS Status unknown Compliant
REACH Status unknown β€”
AEC-Q100 Qualification unknown β€”
Lead-free Status unknown β€”
Halogen-free Status unknown β€”
Device Type β€” Field-Programmable Gate Array (FPGA)
Logic Elements (LEs) β€” 60,440
Configurable Logic Blocks (CLBs) β€” 60,440
Embedded Memory Bits β€” 2,544,192 bits
Internal Frequency (max) β€” 717 MHz
Process Technology β€” 90 nm
Core Voltage β€” 1.2 V
Package Type β€” 1152-ball FC-FBGA
Package Size β€” 35 x 35 mm (1 mm ball pitch)
Number of Terminals β€” 1152
Terminal Form β€” Ball
Temperature Grade β€” Industrial (-40C to +100C junction)
Lead-Free β€” Yes
MSL Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

Browse All Products Create BOM Request Quote