EP2SGX90EF1152C3ES vs EP2SGX90EF1152C3N Comparison
Detailed side-by-side comparison of EP2SGX90EF1152C3ES by Intel and EP2SGX90EF1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES β Last Time Buy
Specification Comparison
| Parameter | EP2SGX90EF1152C3ES | EP2SGX90EF1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,050.00 | $1,280.00 |
| Family | Stratix II GX | Stratix II GX |
| Process Node | 90 nm | β |
| Logic Elements | 90,960 | β |
| Embedded Memory | 4,520,448 bits (approx. 4.5 Mbit) | β |
| User I/O Pins | 558 | β |
| Package | 1152-BBGA (FineLine BGA, 35x35 mm) | β |
| Speed Grade | C3 | EF |
| Temperature Grade | Commercial Extended (-40 C to +100 C) | C3 (Commercial) |
| Core Voltage | 1.5 V (Enhanced, 'E' suffix) | 1.2 V |
| High-Speed Transceivers | Up to 12 channels (per Stratix II GX family) | β |
| Transceiver Data Rate | Up to 6.375 Gbps per channel (family spec) | β |
| DSP Blocks | Yes, dedicated 18x18 multipliers and accumulators | β |
| PLL Count | [DATA_NEEDED: PLL count for EP2SGX90 variant] | β |
| User I/O Banks | 24 (per package datasheet) | β |
| Configuration | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | β |
| Lead-Free | Yes | β |
| Series | β | Stratix II GX |
| Logic Elements (LE) | β | 90960 |
| Number of LABs/CLBs | β | 4548 |
| Total Memory Bits | β | 4520448 |
| User I/Os | β | 558 |
| Number of Transceivers | β | [DATA_NEEDED: transceiver count per family] |
| Process Technology | β | 90 nm |
| Operating Frequency (max) | β | 816.9 MHz |
| Operating Temperature | β | 0C to +85C (Commercial) |
| Package Type | β | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | β | 1152 balls |
| Package Dimensions | β | 34 mm x 34 mm |
| Lead-Free / RoHS | β | Yes (RoHS compliant) |