EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA
MPN: EP2SGX90EF1152C3N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1560 | $156,000.00 |
| 500 | $1395 | $697,500.00 |
| 1,000 | $1280 | $1,280,000.00 |
EP2SGX90EF1152C3N Overview
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard-IP such as transceivers, block RAM, and DSP blocks. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs - offering ASIC-class parallelism and throughput while preserving full post-production reprogrammability. Stratix II GX is Intel's (formerly Altera's) high-end transceiver-equipped family, positioned for serial connectivity, video processing, and communications infrastructure where parallel DSP and high I/O count are required.
Key features of the EP2SGX90EF1152C3N include up to 12 transceivers supporting SERDES rates commonly used in the Stratix II GX family, dedicated embedded multiplier blocks for DSP, distributed and block RAM, and on-chip PLLs. The 1152-ball flip-chip BGA package provides the high-pin-count escape routing required to bring 558 user I/Os off-die while supporting the high-power transceivers. A rich configuration options set (Fast Passive Parallel, Active Serial, JTAG) makes the part deployable in production and in-field update scenarios.
Typical applications include 10G/1G Ethernet line cards, wireless baseband processing, broadcast video routers, high-speed serial protocol bridging (PCI Express, Serial RapidIO, XAUI), and military/aerospace signal processing. The high logic density combined with embedded transceivers allows single-chip implementation of multi-channel data-path designs that previously required an FPGA plus an external PHY.
When designing with this device, pay close attention to transceiver reference-clock jitter, PCB stack-up for BGA escape, and power-rail sequencing on the 1.2V core. Thermal management is critical because the FC-FBGA package concentrates heat from the transceiver channels. Use the Quartus II design software (or its supported successors) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package variants, and design considerations that go beyond the manufacturer datasheet - giving procurement and engineering teams a single authoritative reference for the EP2SGX90EF1152C3N.
Drop-in alternatives for EP2SGX90EF1152C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152C3N (same form factor and footprint) β differing in Package, Speed Grade, Total RAM Bits, Transceivers, Core Voltage.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1152C3ES
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP2SGX90EF1152C3
β Drop-Inβ In Stock
$1180 / Unit
View Datasheet βEP2SGX90EF1152I4N
β Drop-Inβ In Stock
$1550 / Unit
View Datasheet βEP2SGX90EF1152I3N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2SGX60EF1152C3N
β Drop-Inβ In Stock
$2195 / Unit
View Datasheet βEP2SGX90EF1152C3N Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Family | Stratix II GX |
| Logic Elements (LE) | 90960 |
| Number of LABs/CLBs | 4548 |
| Total Memory Bits | 4520448 |
| User I/Os | 558 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Operating Frequency (max) | 816.9 MHz |
| Operating Temperature | 0C to +85C (Commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | 1152 balls |
| Package Dimensions | 34 mm x 34 mm |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) |
| Speed Grade | EF |
| Temperature Grade | C3 (Commercial) |
EP2SGX90EF1152C3N 34 mm x 34 mm Pin Configuration Guide
Pin configuration for EP2SGX90EF1152C3N (34 mm x 34 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152C3N is suitable for 6 applications: 10 Gigabit Ethernet Line Cards, Wireless Baseband Processing, Broadcast Video Routers and Switchers, High-Speed Serial Protocol Bridging, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
10 Gigabit Ethernet Line Cards
The EP2SGX90EF1152C3N's 90,960 logic elements and embedded Stratix II GX transceivers make it well suited for 10G Ethernet MAC-to-PHY bridging and packet processing. The 558 user I/Os support parallel SFI/XAUI bus expansion plus fabric-side packet header inspection at line rate. With 4.5 Mbits of embedded block RAM, designers can stage packet buffers and lookup tables without external SRAM, reducing board complexity. Compared to ASIC implementations, the FPGA allows late-stage protocol revisions (e.g., adding new header parsing or encryption offload) without respin. Per Stratix II GX reference designs, the part supports XAUI, SFI-4.2, and 10GBASE-R interfacing in a single chip. Power consumption on the transceiver-heavy core requires careful PCB stack-up and thermal management.
Recommended
Wireless Baseband Processing
The EP2SGX90EF1152C3N serves as a baseband processor in LTE, WiMAX, and proprietary wireless systems where the combination of high logic density, embedded multipliers for DSP, and SERDES transceivers enables single-chip PHY implementations. The 4,548 LABs and ~90K LE allow multiple antennas' worth of channel estimation, FFT/iFFT, and turbo-decoding logic in one device, while the embedded multipliers accelerate complex-MAC operations. Transceivers connect to ADCs/DACs and to CPRI/OBSAI backhaul links. The 1.2V core at 90nm process delivers predictable power consumption for the carrier-grade temperature range (industrial -I variants are recommended for outdoor base stations). Per the Stratix II GX handbook, the device supports enough DSP blocks to process multi-antenna 4x4 MIMO waveforms.
Recommended
Broadcast Video Routers and Switchers
The 558 user I/Os and high logic count make the EP2SGX90EF1152C3N a strong fit for broadcast video routers that need to fan out uncompressed SDI/HD-SDI/3G-SDI streams to many destinations. Embedded transceiers handle SMPTE 424M/425M serial video at 2.97 Gbps, while the FPGA fabric performs matrix switching, embedding/de-embedding, and frame-sync functions. The 4.5 Mbit block RAM supports line buffers for up/down/cross conversion. Compared to ASIC SDI crosspoint switches, the FPGA-based design is reconfigurable as broadcast standards evolve (e.g., adding UHD-SDI 12G support via IP cores). Per broadcast OEM designs, the part is used in mid-density routing matrices of 64x64 to 256x256.
Recommended
High-Speed Serial Protocol Bridging
The Stratix II GX transceivers in the EP2SGX90EF1152C3N operate at rates commonly used in PCI Express Gen1 (2.5 Gbps), Serial RapidIO, XAUI, and proprietary backplanes. Combined with the 90K LE of fabric, the device implements root-complex or endpoint logic, protocol-aware DMA engines, and bridge state machines in a single chip. This eliminates the need for an external PHY plus companion FPGA in protocol-conversion cards (e.g., PCIe-to-RapidIO, SRIO-to-Ethernet). The 1152-BGA package supports the high pin count required to bring multiple transceiver channels plus parallel system buses off-die.
Recommended
Military and Aerospace Signal Processing
The EP2SGX90EF1152C3N family supports extended temperature grades (industrial I-grade) and is used in defense and aerospace signal-processing subsystems such as radar front-end preprocessing, electronic warfare, and software-defined radio. The 90K LE and embedded transceivers enable real-time FFT, beamforming, and channelization across wide-bandwidth ADC interfaces. When used in a conduction-cooled VPX or VME chassis, the FC-FBGA package offers a robust thermal path through the PCB. Designers targeting DO-160 or MIL-STD-810 environments typically select the I-grade variant and apply component-level derating per MIL-HDBK-1547.
Recommended
Test and Measurement Instrumentation
The combination of 558 I/Os, embedded transceivers, and 4.5 Mbits of block RAM makes the EP2SGX90EF1152C3N a flexible platform for high-end oscilloscopes, logic analyzers, and protocol analyzers. The transceivers capture high-speed serial traffic (PCIe, USB 3.0, SATA) at line rate, while the FPGA fabric performs state-based triggering, protocol decoding, and deep trace memory management. The 1152-BGA package's high I/O count is required to interface to multiple ADC/DAC channels and high-bandwidth memory (DDR2/QDR). Per the Stratix II GX handbook, the part supports sufficient memory bandwidth for state-of-the-art protocol analyzers.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152C3ES | EP2SGX90EF1152C3 | EP2SGX90EF1152I4N | EP2SGX90EF1152I3N | EP2SGX60EF1152C3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BGA (FC-FBGA, 34x34 mm) | 1152-BGA (FC-FBGA, 34x34 mm) - same | 1152-BGA (FC-FBGA, 34x34 mm) - same | 1152-BGA (FC-FBGA, 34x34 mm) - same | 1152-BGA (FC-FBGA, 34x34 mm) - same | 1152-BGA (FC-FBGA, 34x34 mm) - same |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 90960 | 60440 (-34%) |
| User I/Os | 558 | 558 | 558 | 558 | 558 | 558 |
| Total Memory Bits | 4520448 | 4520448 | 4520448 | 4520448 | 4520448 | approx 2544192 (estimated -44%) |
| Temperature Grade | C3 (Commercial, 0C to +85C) | C3 (Commercial) - same | C3 (Commercial) - same | I4 (Industrial, -40C to +100C) | I3 (Industrial, -40C to +100C) | C3 (Commercial) - same |
| RoHS / Lead-Free | Yes (N suffix) | Yes (ES suffix, lead-free) | No (non-N, legacy leaded) | Yes | Yes | Yes |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V - same | 90 nm / 1.2 V - same | 90 nm / 1.2 V - same | 90 nm / 1.2 V - same | 90 nm / 1.2 V - same |
Key Differentiators
- Highest-density drop-in in 1152-BGA Stratix II GX family (vs EP2SGX60EF1152C3N)
- C3 commercial temperature grade (vs EP2SGX90EF1152I4N)
- Lead-free N-suffix finish (vs EP2SGX90EF1152C3)
Design Notes
Estimated: at 1.2V core and a worst-case 90K LE utilization plus 12 active transceivers, the Stratix II GX family can dissipate 10-15W, with the FC-FBGA package concentrating heat at the die center. Use a 12-layer (or more) PCB with a continuous ground/power plane stack-up and thermal vias under the BGA thermal balls. A heatsink with thermal interface material is recommended when the junction-to-ambient thermal resistance exceeds the design's 60-70C max-junction budget. For chassis-cooled designs, conduction-cool the BGA via the PCB to a cold wall.
The 1152-ball FC-FBGA has a 1.0 mm ball pitch (typical for the Stratix II GX package), requiring 4-6 mil traces and microvia-in-pad PCB technology (or HDI stack-up). Match BGA escape lengths within each transceiver group within 150 mil to avoid skew-induced jitter on multi-gigabit serial links. Per the Stratix II GX handbook, dedicate at least 2 PCB layers to ground and 1 to the 1.2V core, and place decoupling capacitors (0.1uF, 1uF, 10uF) on the BGA's power balls within 100 mils of each ball.
Transceiver reference-clock jitter is the dominant factor in SERDES link BER. Per Stratix II GX reference designs, use a low-jitter differential crystal oscillator (e.g., 100-156.25 MHz LVDS) with a dedicated PLL filter and isolated ground pour. Maintain 100-ohm differential impedance on transceiver lanes, and avoid routing them across PCB splits. Use the Quartus II Transceiver Toolkit for eye-diagram validation during bring-up. Series AC-coupling capacitors (0.1uF) on each lane must be placed near the FPGA side to be effective.
Do not assume the C3 commercial temperature grade is sufficient for outdoor or industrial deployments - select the I3 or I4 industrial variants for -40C to +100C operation. Verify the 'ES' or 'N' suffix against your qualification requirements: the ES (engineering sample) suffix is not for production; the N suffix confirms lead-free / RoHS finish. Do not mix 1.2V core supply with non-Intel-recommended regulators - the Stratix II GX requires specific power-up sequencing (VCCINT before VCCPD, with monotonic ramps) to prevent latch-up.
Place the configuration flash (EPCS) within 2 inches of the FPGA's MSEL[2:0] and DCLK pins to avoid configuration failures. For multi-FPGA configurations, daisy-chain the DCLK/DATA lines with proper series termination. Use the Quartus II Pin Planner to assign pins before PCB layout to avoid re-spins - especially for the transceiver channels, which have fixed pin assignments on the 1152-BGA. Reserve at least 4 GPIO for JTAG (TCK, TMS, TDI, TDO) and bring them out to a 0.1-inch header for boundary-scan debugging.
Compliance Information
RoHS compliant per N suffix in order code. AEC-Q100 not applicable for FPGAs. Halogen-free status not explicitly stated in verified data; consult Intel product declaration. Conflict-minerals compliance per Intel's published CMRT.
