EP2SGX90EF1152C3N vs EP2SGX90EF1152C5ES Comparison
Detailed side-by-side comparison of EP2SGX90EF1152C3N by Intel and EP2SGX90EF1152C5ES by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel
EP2SGX90EF1152C5ES ObsoleteSpecification Comparison
| Parameter | EP2SGX90EF1152C3N | EP2SGX90EF1152C5ES |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,280.00 | $1,495.00 |
| Series | Stratix II GX | β |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | β |
| Number of LABs/CLBs | 4548 | β |
| Total Memory Bits | 4520448 | β |
| User I/Os | 558 | 558 |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | 12 (up to 20 channels) |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Operating Frequency (max) | 816.9 MHz | β |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | β |
| Package Pin Count | 1152 balls | β |
| Package Dimensions | 34 mm x 34 mm | β |
| Mounting Type | Surface Mount | β |
| Lead-Free / RoHS | Yes (RoHS compliant) | β |
| Speed Grade | EF | C5 (commercial, mid-tier) |
| Temperature Grade | C3 (Commercial) | β |
| Logic Elements | β | 90,960 |
| Embedded Memory (bits) | β | 4,520,448 |
| Transceiver Data Rate | β | Up to 6.375 Gbps |
| DSP Blocks (18x18 multipliers) | β | 384 |
| Package | β | 1152-FBGA (FineLine BGA) |
| Configuration Method | β | Fast passive parallel, active serial, JTAG |
| RoHS Status | β | Compliant |
| Lead-Free | β | Yes |