EP2SGX90EF1152C4N vs EP2SGX90EF1152C3N Comparison
Detailed side-by-side comparison of EP2SGX90EF1152C4N by Intel and EP2SGX90EF1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N β Last Time Buy
Specification Comparison
| Parameter | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $695.00 | $1,280.00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90,960 | 90960 |
| LABs/CLBs | 4,548 | β |
| Total RAM Bits | 4,520,448 bits | β |
| User I/O Count | 558 | β |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | β |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm | β |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | β |
| Speed Grade | C4 | EF |
| Operating Temperature | Commercial (0C to +85C) | 0C to +85C (Commercial) |
| Package | 1152-BBGA / FC-FBGA-1152 | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | MSL-3 / MS-034AAR-1 (per package outline) | β |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | Yes (RoHS compliant) |
| Series | β | Stratix II GX |
| Number of LABs/CLBs | β | 4548 |
| Total Memory Bits | β | 4520448 |
| User I/Os | β | 558 |
| Number of Transceivers | β | [DATA_NEEDED: transceiver count per family] |
| Process Technology | β | 90 nm |
| Operating Frequency (max) | β | 816.9 MHz |
| Package Type | β | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | β | 1152 balls |
| Package Dimensions | β | 34 mm x 34 mm |
| Temperature Grade | β | C3 (Commercial) |