EP2SGX90FE1152C3 vs EP2SGX90EF1152I3 Comparison
Detailed side-by-side comparison of EP2SGX90FE1152C3 by Intel and EP2SGX90EF1152I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3 β Last Time Buy
Specification Comparison
| Parameter | EP2SGX90FE1152C3 | EP2SGX90EF1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,495.00 | $1,480.00 |
| Series | Stratix II GX | Stratix II GX |
| Family Name | Stratix II GX | β |
| Logic Elements / Cells | 90,960 | β |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Number of LABs / CLBs | 4,548 | β |
| Number of Logic Elements / Cells | 90,960 | β |
| Number of I/O | 558 | β |
| Number of Gates | [DATA_NEEDED: gates count] | β |
| Voltage - Supply | 1.2 V core | β |
| Operating Temperature | 0C to +85C (commercial, C3 suffix) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Package / Case | 1152-BBGA / FC-FBGA | β |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Transceiver Data Rate (max) | 6.375 Gbps | β |
| Number of Transceiver Channels | 12 | β |
| DSP Blocks (18x18 multipliers) | 192 | β |
| Configuration Support | PS, PPS, PPA, FPP, JTAG | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Moisture Sensitivity Level (MSL) | [DATA_NEEDED: MSL level] | β |
| Logic Elements | β | 90,960 |
| Adaptive Logic Modules (ALMs) | β | 558 |
| Equivalent Logic Cells (CLBs) | β | 90,960 |
| Maximum Operating Frequency | β | 622.08 MHz |
| Core Supply Voltage (VCCINT) | β | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | β | Industrial (-40C to +100C) |
| Package Type | β | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | β | Ball |
| Terminal Pitch | β | [DATA_NEEDED: ball pitch] |
| Package Code | β | BGA |
| Package Shape | β | Square |
| Configuration Architecture | β | Enhanced Configuration (EPC) devices supported |