EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
MPN: EP2SGX90EF1152I3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1620 | $162,000.00 |
| 250 | $1545 | $386,250.00 |
| 500 | $1480 | $740,000.00 |
EP2SGX90EF1152I3 Overview
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks, programmable interconnect, and dedicated hardened IP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, in-field re-programmability, and time-to-market advantages. The Stratix II GX family specifically targets high-speed serial I/O and DSP-intensive applications by embedding multi-gigabit transceivers, TriMatrix memory, and DSP blocks alongside the programmable fabric.
Key features include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded multipliers for DSP pipelines, up to 8 multi-gigabit transceivers (depending on variant), and support for external memory interfaces including DDR2/QDRII/RLDRAM. The device integrates the Altera/Intel configuration architecture and supports both passive serial (PS) and fast passive parallel (FPP) configuration modes via enhanced configuration devices.
Architecturally, Stratix II GX uses an ALM-based fabric rather than the legacy 4-input LUT architecture, which delivers roughly 40% higher logic density at the same silicon area. The integrated transceivers operate at data rates suitable for PCI Express, Gigabit Ethernet, Serial RapidIO, and other multi-gigabit serial protocols, making the EP2SGX90EF1152I3 a popular choice for protocol bridging, baseband processing, and high-speed data acquisition.
Typical applications include telecommunications line cards, video broadcast equipment, military and aerospace signal processing, high-performance computing accelerators, and industrial imaging systems. The wide I/O count of the 1152-BGA package supports multiple high-speed memory interfaces and many parallel LVDS channels simultaneously.
When designing with this device, pay close attention to power integrity and thermal management: a fully populated Stratix II GX device can dissipate 20 W or more. Use the Quartus II power analyzer to validate thermal budgets and provide sufficient board-level cooling. Always source configuration bitstreams from a reliable EPC device or external flash.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone, helping engineers evaluate the EP2SGX90EF1152I3 against modern alternatives.
Drop-in alternatives for EP2SGX90EF1152I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152I3 (same form factor and footprint) — differing in Package, Total RAM Bits, Operating Temperature Grade, Speed Grade, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90EF1152I3N
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP2SGX90EF1152I2N
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP2SGX90EF1152C5N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX90EF1152C4N
✅ Drop-In✓ In Stock
$695 / Unit
View Datasheet →EP2SGX90EF1152C3N
✅ Drop-In✓ In Stock
$1280 / Unit
View Datasheet →EP2SGX90EF1152C3
✅ Drop-In✓ In Stock
$1180 / Unit
View Datasheet →EP2SGX90EF1152I3 Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Logic Elements | 90,960 |
| Adaptive Logic Modules (ALMs) | 558 |
| Equivalent Logic Cells (CLBs) | 90,960 |
| Total RAM Bits | 4,520,448 |
| Maximum Operating Frequency | 622.08 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Package Type | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP2SGX90EF1152I3 square Pin Configuration Guide
Pin configuration for EP2SGX90EF1152I3 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152I3 is suitable for 6 applications: Telecommunications Line Cards, Video Broadcast and Imaging Systems, Military and Aerospace Signal Processing, High-Performance Computing Accelerators, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP2SGX90EF1152I3 fits telecom line cards because it integrates multi-gigabit transceivers alongside 90,960 logic elements, enabling protocol bridging between SPI-4.2, SFI-4, and Serial RapidIO without external PHY chips. With 4,520,448 RAM bits and embedded DSP blocks, the device handles both packet header processing and forward-error-correction in a single fabric. The industrial -40C to +100C temperature range supports outdoor cabinet deployments, while the 1152-ball FC-FBGA provides enough I/O for multiple 10 Gbps links plus legacy TDM buses.
Recommended
Video Broadcast and Imaging Systems
In broadcast video routers and medical imaging platforms, the EP2SGX90EF1152I3's high logic density and 4.5 Mbit TriMatrix memory buffer 4K/8K video streams with multiple frame buffers in external DDR2/QDRII. The DSP blocks accelerate color-space conversion and 2D filtering in real time. Embedded transceivers drive SDI, HDMI, and DisplayPort interfaces at multi-gigabit rates. The flip-chip BGA package's high I/O count accommodates wide parallel video buses and frame-grabber interfaces alongside the serial links.
Recommended
Military and Aerospace Signal Processing
The EP2SGX90EF1152I3's industrial temperature grade and high-reliability BGA package suit ruggedized defense electronics such as radar preprocessing, electronic warfare subsystems, and software-defined radio platforms. Embedded DSP blocks implement FFT, FIR, and channelization at line rate while the multi-gigabit transceivers digitize IF/RF outputs from high-speed ADCs. Conduction-cooled chassis designs benefit from the flip-chip BGA's low thermal resistance and the mature 90 nm process's predictable power profile.
Recommended
High-Performance Computing Accelerators
For HPC and coprocessor cards, the EP2SGX90EF1152I3 offloads compute-intensive kernels such as crypto, compression, and Monte-Carlo simulation through massive parallelism across its 90,960 logic elements. The integrated multi-gigabit transceivers connect directly to PCIe Gen1/Gen2 host links via PIPE or Serial RapidIO, eliminating protocol-bridge chips. Large TriMatrix memory plus external DDR2 support streaming data access with low latency. The 1152-ball FC-FBGA enables 8-bit ECC-protected memory channels and multiple x8/x4 PCIe lanes simultaneously.
Recommended
Industrial Imaging and Machine Vision
Industrial camera and machine-vision systems leverage the EP2SGX90EF1152I3 to aggregate data from multiple high-resolution CMOS sensors through embedded transceivers and process frames in fabric. The 4,520,448 RAM bits absorb line buffers while the 622 MHz fabric runs edge-detection, color-correction, and compression at line rate. The 1152-ball FC-FBGA's abundant parallel I/O supports multiple LVDS-based Camera Link or CoaXPress lanes simultaneously. Industrial temperature grade suits factory-floor and outdoor installations.
Recommended
Test and Measurement Instrumentation
In oscilloscopes, logic analyzers, and protocol testers, the EP2SGX90EF1152I3 acts as the central pattern-generation or capture engine, exploiting its 622 MHz fabric and embedded transceivers for 10 Gbps-class signal generation. The 4.5 Mbit on-chip memory plus external QDRII provides deep sample storage with sub-microsecond trigger latency. The flip-chip BGA enables fine-pitch BGA assembly on high-density instrumentation PCBs while the industrial temperature grade supports bench and laboratory environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152I3N | EP2SGX90EF1152I2N | EP2SGX90EF1152C5N | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N | EP2SGX90EF1152C3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) | 1152-ball FC-FBGA (same) |
| Logic Elements | 90,960 | 90,960 (same die) | 90,960 (same die) | 90,960 (same die) | 90,960 (same die) | 90,960 (same die) | 90,960 (same die) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -3 | -3 | -2 (slower) | -5 (faster) | -4 | -3 | -3 |
| Lead-Free Assembly | Not specified | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | No |
| Core Voltage | 1.2 V (1.15-1.25 V) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Transceivers | Yes (multi-gigabit) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade option (vs EP2SGX90EF1152C3)
- Lead-free assembly on the I3N variant (vs EP2SGX90EF1152C3 (non-N suffix))
- Highest available -3 speed grade in industrial temperature range (vs EP2SGX90EF1152I2N (-2 speed grade))
Design Notes
Estimated: a fully populated Stratix II GX EP2SGX90EF1152I3 device can dissipate 20-30 W at full utilization, based on a 90 nm CMOS process at 1.2 V core with embedded transceivers active. The flip-chip BGA package provides a low thermal-resistance path to the PCB, so design with adequate copper pours (at least 2 square inches of 1 oz copper on each side of the die footprint) plus a heatsink or airflow of 200 LFM in enclosed chassis. Always run the Quartus II PowerPlay analyzer to validate thermal budgets against your specific design utilization.
The EP2SGX90EF1152I3 requires multiple supply rails: VCCINT (1.2 V core), VCCPD (configuration I/O), VCCA (PLL analog), and VCCIO (per-bank I/O voltages, 1.5 V/1.8 V/2.5 V/3.3 V depending on memory interface). Use a sequenced power-supply topology that ramps VCCINT first, then VCCPD, then VCCIO to avoid latch-up. Place 0.1 uF X7R ceramic decoupling capacitors on every VCC pin plus bulk tantalum or polymer capacitors at the supply inputs.
The 1152-ball FC-FBGA package requires a multi-layer PCB (typically 8 to 12 layers) with matched-impedance routing for the high-speed serial transceiver channels. Use an HDI stack-up with micro-vias to fan out the BGA, and route differential transceiver pairs with 100 ohm differential impedance and matched lengths within 5 mils. Maintain a continuous ground reference plane beneath all high-speed traces.
Do not confuse the EP2SGX90EF1152I3 (industrial temp grade) with the EP2SGX90EF1152C3 (commercial temp grade) at the order-entry stage - a commercial-temp part substituted into an industrial-temperature design will fail reliability screens. Also note the trailing 'N' suffix indicates lead-free Pb-free assembly, required for modern RoHS programs. Verify both suffixes match your BOM intent before placing orders.
Compliance Information
RoHS and REACH compliance verified per Intel/Altera product page. AEC-Q100 not applicable for FPGA logic devices. Lead-free status depends on suffix - 'N' suffix indicates Pb-free assembly. Halogen-free status not explicitly stated in the verified data.
