EP2SGX90FF1508C3ES vs EP2SGX130GF1508C3 Comparison
Detailed side-by-side comparison of EP2SGX90FF1508C3ES by Intel and EP2SGX130GF1508C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES Obsolete
Specification Comparison
| Parameter | EP2SGX90FF1508C3ES | EP2SGX130GF1508C3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,340.00 | $1,380.00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 132,540 |
| Logic Array Blocks (LABs) | 4,828 | 6,627 |
| Embedded Memory (TriMatrix) | 4,520,448 bits | β |
| Total RAM Bits | 4,520,448 | β |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | β |
| Maximum Internal Frequency | 816.9 MHz | 717 MHz |
| DSP Blocks | Yes (dedicated multiplier blocks) | β |
| Embedded Transceivers | Up to 3.125 Gbps multi-gigabit transceivers | β |
| Global Clock Networks | Up to 16 | β |
| Regional Clock Networks | Up to 32 per device region | β |
| Package | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Interface | JTAG / EPCS serial flash / Passive parallel | β |
| Operating Temperature Grade | Commercial / Industrial (per part suffix) | Commercial (C3 speed grade) |
| RoHS Status | [DATA_NEEDED: rohs] | Contains lead / RoHS non-compliant |
| Total Memory Bits | β | 6,748,860 |
| Maximum User I/O | β | 734 |
| Number of I/O Banks | β | 12 |
| Transceiver Channels | β | Up to 20 |
| Core Voltage | β | 1.2 V |
| MSL Level | β | [DATA_NEEDED: MSL rating] |