EP2SGX130GF1508C3 - Stratix II GX 132K Logic Elements FPGA | Intel
MPN: EP2SGX130GF1508C3 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 50 | $1610 | $80,500.00 |
| 100 | $1495 | $149,500.00 |
| 250 | $1380 | $345,000.00 |
EP2SGX130GF1508C3 Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, transceivers, DSP blocks) on a single die. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose processors (CPUs, MCUs) and application-specific integrated circuits (ASICs): they offer ASIC-class parallelism and throughput while retaining firmware-level reconfigurability. The Stratix II GX family specifically targets high-speed serial I/O and signal-processing workloads, sitting within the broader categories of programmable logic -> logic ICs -> integrated circuits -> semiconductors.
Key features of the EP2SGX130GF1508C3 include 132,540 logic elements, 6,627 LABs (Logic Array Blocks), 717 MHz maximum internal operating frequency, and integrated PCI Express hard IP. The device supports LVDS, LVTTL, LVCMOS, and LVPECL I/O standards across 734 user I/Os distributed in 12 banks, enabling flexible mixed-voltage interfacing. Embedded RAM totals 6,748,860 bits distributed across MRAM and M4K blocks, providing high-bandwidth on-chip storage for packet buffers and DSP coefficient tables.
The 90 nm process node delivers a balance of power efficiency and operating frequency for the Stratix II GX architecture. Up to 20 full-duplex transceiver channels support protocols including PCI Express, XAUI, Serial RapidIO, and custom serial interfaces up to 6.375 Gbps. Cyclone-to-Stratix migration is supported through Quartus II design tools, and the device family is supported by the Altera Quartus II design suite for synthesis, place-and-route, and timing analysis.
Typical applications include high-end telecommunications line cards, military radar and signal processing, medical imaging backplanes, ASIC prototyping, and high-performance computing acceleration. The 1508-ball FBGA package supports high signal-density boards required for multi-gigabit serial designs. The Stratix II GX family is well-suited to wireline backhaul, test and measurement equipment front ends, and custom hardware accelerators where deterministic latency and parallel processing are required.
Design consideration: the 1.2 V core supply requires multiple decoupling capacitors placed adjacent to the dedicated VCC pins per the pin connection guidelines. The 40 x 40 mm package demands controlled-impedance PCB stack-up and matched-length routing for transceiver channels. Junction temperature must remain below the 100 C commercial operating limit for C3 speed grade parts, requiring thermal vias beneath the package thermal pad.
This page synthesizes distributor availability, Stratix II GX family cross-references, and practical design considerations not consolidated in the manufacturer datasheet, supporting faster sourcing decisions for engineers evaluating EP2SGX130-class FPGAs.
Drop-in alternatives for EP2SGX130GF1508C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF1508C3 (same form factor and footprint) β differing in Package, RoHS Status, Logic Elements, Speed Grade, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF1508C5
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$645 / Unit
View Datasheet βEP2SGX130GF1508C4
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$985 / Unit
View Datasheet βEP2SGX130GF1508I3
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2S130F1508C3
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1350 / Unit
View Datasheet βEP2S180F1508C3
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP2SGX130GF1508C3 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total Memory Bits | 6,748,860 |
| Maximum User I/O | 734 |
| Number of I/O Banks | 12 |
| Transceiver Channels | Up to 20 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Commercial (C3 speed grade) |
| Package | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Maximum Internal Frequency | 717 MHz |
| Mounting Type | Surface Mount |
| RoHS Status | Contains lead / RoHS non-compliant |
EP2SGX130GF1508C3 1508-ball fbga (fcbga) 40 x 40 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX130GF1508C3 (1508-ball fbga (fcbga) 40 x 40 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF1508C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF1508C3 is suitable for 6 applications: High-Speed Telecommunications Line Cards, Military Radar and Signal Processing, ASIC Prototyping and Emulation, Medical Imaging Backplanes, Test and Measurement Equipment, High-Performance Computing Acceleration.
High-Speed Telecommunications Line Cards
The EP2SGX130GF1508C3's 20 integrated transceiver channels supporting up to 6.375 Gbps are ideal for wireline backhaul line cards and SONET/SDH framers in telecommunications infrastructure. With 132,540 logic elements and 6.7 Mbit embedded memory, the device handles multi-protocol aggregation including XAUI, Serial RapidIO, and custom serial links without external PHY devices. The 1.2 V core on a 90 nm process balances throughput and power efficiency for densely populated line card designs where 734 user I/Os interface to network processors and framer ASICs.
Recommended
Military Radar and Signal Processing
The Stratix II GX architecture in EP2SGX130GF1508C3 is well-suited to military radar beamforming and signal-processing front ends where deterministic latency and high parallelism are required. With 6,748,860 bits of embedded memory and 132,540 logic elements, the FPGA implements pulse compression, FFT cores, and adaptive beamforming algorithms in real time. The integrated transceivers stream digitized IF data directly to backplane ADCs/DACs at multi-gigabit rates, eliminating external serializer/deserializer components in size-constrained platforms.
Recommended
ASIC Prototyping and Emulation
With 132,540 logic elements and 734 user I/Os, the EP2SGX130GF1508C3 serves as an effective ASIC prototyping platform for designs up to ~10 million gates. The Stratix II GX family supports large multi-FPGA partitioning with high-speed serial links between devices for chip-level verification before tape-out. Quartus II design tools provide synthesis and incremental compile flows that accelerate bring-up of complex SoC prototypes, while the commercial C3 speed grade offers faster compile times than lower-speed bins.
Recommended
Medical Imaging Backplanes
The EP2SGX130GF1508C3 enables real-time image reconstruction in CT, MRI, and ultrasound systems where parallel processing of high-bandwidth data streams is required. 132,540 logic elements implement parallel beamforming and back-projection kernels, while 6.7 Mbit embedded memory stores filter coefficient tables and intermediate frame buffers. The 20 transceiver channels aggregate digitized sensor data from analog front-end boards, reducing PCB complexity in space-constrained scanner chassis.
Recommended
Test and Measurement Equipment
Test and measurement front ends for oscilloscopes, protocol analyzers, and logic analyzers leverage the EP2SGX130GF1508C3's high-speed transceivers and abundant logic capacity. The device implements real-time protocol triggering, deep trace memory buffering via 6.7 Mbit embedded RAM, and high-bandwidth data export over PCI Express or XAUI links. With 717 MHz maximum internal frequency, the FPGA meets timing closure requirements for state machine decoding at multi-gigabit line rates.
Recommended
High-Performance Computing Acceleration
The EP2SGX130GF1508C3 functions as a coprocessor in HPC clusters where 132,540 logic elements accelerate custom algorithms such as genomics search, financial Monte Carlo simulation, or scientific kernels. The integrated transceivers deliver 6.375 Gbps link bandwidth to host CPUs over proprietary interconnect, while embedded memory provides fast scratchpad storage for tiled matrix operations. The C3 commercial speed grade offers the lowest-cost option for accelerator cards deployed in temperature-controlled data center racks.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF1508C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508C5 | EP2SGX130GF1508C4 | EP2SGX130GF1508I3 | EP2S130F1508C3 | EP2S180F1508C3 |
|---|---|---|---|---|---|---|
| Package | 1508-ball FBGA 40x40 mm | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same | 1508-ball FBGA 40x40 mm - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 179,400 (+35%) |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | 0 (no transceivers) | 0 (no transceivers) |
| Speed Grade | C3 (commercial) | C5 (commercial, faster) | C4 (commercial) | I3 (industrial) | C3 (commercial) | C3 (commercial) |
| User I/Os | 734 | 734 | 734 | 734 | 734 | 734 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Embedded Memory Bits | 6,748,860 | 6,748,860 | 6,748,860 | 6,748,860 | 6,748,860 | 9,383,040 (+39%) |
Key Differentiators
- Integrated multi-gigabit transceivers vs Stratix II non-GX variants (vs EP2S130F1508C3)
- Commercial speed grade C3 is the lowest-cost option in this density tier (vs EP2SGX130GF1508C5)
- Same package footprint as other 130K Stratix II GX variants (vs EP2S180F1508C3)
Design Notes
The EP2SGX130GF1508C3 requires multiple supply rails: VCCINT (1.2 V core), VCCIO (per bank, 1.2-3.3 V), VCCA (1.2 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Power sequencing must follow the Stratix II GX handbook guidelines: VCCINT must ramp before or simultaneously with VCCIO, and the POR (power-on-reset) trip point must be respected. Use of a dedicated FPGA power sequencer IC such as the LTC2923 or equivalent is recommended for multi-rail sequencing. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors adjacent to every VCC pin pair, with bulk 100 uF-470 uF polymer or electrolytic capacitors at each supply domain.
Estimated: at full logic utilization with 20 active transceivers, total power consumption may approach 15-20 W. The 1508-ball FBGA package exposes a thermal pad; PCB layout must include a continuous ground plane beneath the package with thermal vias (0.3 mm drill, 0.5 mm pitch) to inner copper layers for heat spreading. Without thermal management, junction temperature can exceed 100 C and trigger thermal protection. Use thermal simulation tools (e.g., ANSYS, FloTHERM) during board design to validate the thermal solution before fabrication.
The 1508-ball FBGA at 1.0 mm pitch requires HDI PCB fabrication with microvia (laser-drilled) technology for inner-layer breakout. Stack-up: minimum 8-layer board with 4 routing layers; recommended 10-12 layers for full transceiver signal integrity. Transceiver channels require 100-ohm differential routing with matched length within 150 mil for data lines and within 25 mil for the differential pair. Use the Stratix II GX handbook High-Speed Board Design Guidelines for reference stack-up, and target an insertion loss below 6 dB at 3 GHz for 6.375 Gbps links.
Common pitfalls when designing with the EP2SGX130GF1508C3: (1) Configuration mode selection (AS, PS, JTAG) must be set correctly via MSEL pins; mismatched settings prevent the device from configuring. (2) Unused transceiver channels must be powered down in Quartus II to avoid excess current draw. (3) JTAG TCK must be slower than the configuration clock for boundary-scan operations. (4) The C3 speed grade has the slowest timing among commercial grades; switching to C7 (industrial) or higher speed grade requires re-running timing analysis. (5) Do not connect pull-up or pull-down resistors to JTAG pins; these pins have internal weak pull-ups per the handbook.
Compliance Information
Per YIC Electronics distributor listing, the EP2SGX130GF1508C3 contains lead and is RoHS non-compliant. This is consistent with Stratix II GX devices manufactured before the RoHS transition. REACH, halogen-free, and conflict minerals status were not stated in available data.
