EP3C10E144I7N vs EP3C10F256C6 Comparison
Detailed side-by-side comparison of EP3C10E144I7N by Intel and EP3C10F256C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10E144I7N | EP3C10F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $39.92 | $36.75 |
| Series | Cycloneยฎ III | โ |
| Family | Cyclone III (EP3C) | Cyclone III |
| Logic Elements (LE) | 10,320 | 10,320 |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | โ |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded Memory Blocks | 46 M9K blocks | โ |
| Embedded Multipliers (18x18) | 23 | โ |
| PLLs | 2 | 2 |
| User I/O Pins | 94 | โ |
| Maximum Operating Frequency | 472.5 MHz | โ |
| Process Technology | 65 nm CMOS | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | 1.2 V to 3.3 V (bank-dependent) |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | -40ยฐC to +100ยฐC (industrial, 'I7' grade) | -40 C to +125 C (industrial, suffix 'C') |
| RoHS Status | Compliant (lead-free, 'N' suffix) | Compliant (lead-free FBGA) |
| Embedded 18x18 Multipliers | โ | 23 |
| Maximum User I/Os | โ | 182 |
| Configuration Memory | โ | SRAM-based (external EPCS flash required) |
| Speed Grade | โ | 6 |
| MSL Level | โ | 3 (168 hours) |