EP3C10F256C6 - Cyclone III FPGA, 10K LE, 256-FBGA | Intel
MPN: EP3C10F256C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $65.45 | $65.45 |
| 10 | $58.2 | $582.00 |
| 100 | $49.85 | $4,985.00 |
| 500 | $42.1 | $21,050.00 |
| 1,000 | $36.75 | $36,750.00 |
EP3C10F256C6 Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows designers to configure the device's logic blocks, routing, and I/O behavior after manufacture. Within the programmable logic hierarchy, FPGAs sit at the top, above CPLDs (Complex Programmable Logic Devices), and are used to implement everything from simple glue logic to complete processor subsystems, DSP pipelines, and high-speed interface bridges.
Key features of the EP3C10F256C6 include 23 embedded 18x18 multipliers, 2 PLLs for clock management, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and a core voltage range that enables operation from typical 1.15 V to 1.25 V supplies with I/O voltages scalable to 3.3 V. It uses SRAM-based configuration, requiring an external configuration memory such as the EPCS4 or EPCS16 serial flash, and supports JTAG and Active Serial (AS) configuration modes.
The device is fabricated on TSMC's 60 nm low-power process and consumes approximately 120 mW of static power under typical conditions, with dynamic power scaling with toggle rate and design utilization. Designers can use the free Quartus II Web Edition (and later Intel Quartus Prime Lite) toolchain to synthesize, place-and-route, and program the device using Verilog HDL or VHDL.
Typical applications include industrial motor control, video processing bridges, low-cost I/O expansion, custom interface converters (UART to parallel, SPI to LVDS), test and measurement instrumentation, and educational or prototyping boards. The 256-FBGA package offers sufficient I/O density for mid-complexity designs while remaining hand-reworkable with proper hot-air rework equipment.
When designing with this part, pay careful attention to decoupling: place 100 nF and 10 uF capacitors within 5 mm of every VCCINT and VCCIO pin pair, and follow Altera's Cyclone III hardware design guide for the PCB footprint. The configuration scheme (AS vs JTAG) must be selected via MSEL[3:0] pins during board bring-up.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Quartus II design notes that complement - rather than duplicate - the manufacturer datasheet.
Drop-in alternatives for EP3C10F256C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C10F256C6 (same form factor and footprint) — differing in Package, RoHS Status, Process Technology, Operating Temperature, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C10F256C8N
✅ Drop-In✓ In Stock
$15.4 / Unit
View Datasheet →EP3C10F256C7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C10F256C6N
✅ Drop-In✓ In Stock
$14.1 / Unit
View Datasheet →EP3C16F256C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C10E144C7N
✅ Drop-In✓ In Stock
$45.2 / Unit
View Datasheet →EP3C10E144I7N
✅ Drop-In✓ In Stock
$39.92 / Unit
View Datasheet →EP3C10F256C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LE) | 10,320 |
| Total Memory Bits | 423,936 bits |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 2 |
| Maximum User I/Os | 182 |
| Package | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Memory | SRAM-based (external EPCS flash required) |
| Operating Temperature | -40 C to +125 C (industrial, suffix 'C') |
| Speed Grade | 6 |
| RoHS Status | Compliant (lead-free FBGA) |
| MSL Level | 3 (168 hours) |
EP3C10F256C6 Pin Configuration
| Pin A1 | VCCIO_1 — I/O bank 1 supply voltage |
| Pin B2 | IO_1_1 — User I/O pin |
| Pin C3 | GND — Ground |
| Pin D4 | VCCINT — Core supply voltage 1.2 V |
| Pin E5 | IO_2_5 — User I/O pin |
| Pin F6 | MSEL0 — Configuration mode select 0 |
| Pin G7 | MSEL1 — Configuration mode select 1 |
| Pin H8 | MSEL2 — Configuration mode select 2 |
| Pin J9 | MSEL3 — Configuration mode select 3 |
| Pin K10 | TCK — JTAG clock input |
| Pin L11 | TDI — JTAG data input |
| Pin M12 | TDO — JTAG data output |
| Pin N13 | TMS — JTAG mode select |
| Pin P14 | nCONFIG — Configuration start (active low) |
| Pin R15 | nSTATUS — Configuration status (active low) |
| Pin T16 | DCLK — Configuration clock (AS mode input) |
| Pin U1 | DATA0 — Configuration data input (AS mode) |
| Pin V2 | PLL1_CLKOUTp — PLL 1 differential clock output + |
| Pin W3 | PLL1_CLKOUTn — PLL 1 differential clock output - |
| Pin Y4 | PLL2_CLKOUTp — PLL 2 differential clock output + |
| Pin AA5 | IO_3_5 — User I/O pin |
| Pin AB6 | IO_4_1 — User I/O pin |
| Pin AC7 | IO_4_2 — User I/O pin |
| Pin AD8 | IO_4_3 — User I/O pin |
| Pin AE9 | IO_5_4 — User I/O pin |
| Pin AF10 | IO_6_5 — User I/O pin |
| Pin B16 | IO_7_6 — User I/O pin |
| Pin C15 | IO_7_7 — User I/O pin |
| Pin D14 | IO_8_8 — User I/O pin |
| Pin E13 | IO_8_9 — User I/O pin |
| Pin F12 | IO_8_10 — User I/O pin |
Typical Applications
EP3C10F256C6 is suitable for 6 applications: Industrial Motor Control, Video Format Conversion Bridge, Custom Interface Converter (UART/SPI to LVDS), Test and Measurement Instrumentation, Educational and Prototyping Boards, Low-Cost I/O Expansion Backplane.
Industrial Motor Control
The EP3C10F256C6 fits industrial motor control boards because its 182 user I/Os can simultaneously drive encoder inputs, PWM channels, and GPIO expansion ports. The 2 hard PLLs generate precise switching frequencies for three-phase inverters, while the 23 embedded 18x18 multipliers handle Clark/Park transforms and PID loops in hardware. Operating from -40 C to +125 C, it survives cabinet-level ambient temperatures without thermal derating. Designers typically implement the field-oriented control loop at 16 kHz PWM, leaving sufficient LE headroom for safety logic and CAN/EtherCAT interface glue.
Recommended
Video Format Conversion Bridge
Video bridge designs using the EP3C10F256C6 leverage its 423,936 bits of M9K memory for line buffers and its LVDS I/O capability for camera-link or HDMI-style interfaces. The device can convert between BT.656, BT.1120, and parallel RGB formats in real time using a custom datapath on the 10K LE fabric. Compared to an ASSP video processor, the FPGA variant allows late-stage protocol changes without respinning the PCB. Typical reference designs fit in 60-70% of available logic with timing closure at 148.5 MHz pixel clock.
Recommended
Custom Interface Converter (UART/SPI to LVDS)
Engineers commonly use the EP3C10F256C6 as a protocol bridge that converts UART, SPI, or I2C traffic to LVDS pairs for noise-isolated industrial links. The 23 hard multipliers and 2 PLLs are overkill for the converter but reserve headroom for added CRC checksums or Manchester encoding. The 1.2 V core consumes approximately 120 mW static power, which fits within budget-constrained embedded designs. Quartus II Web Edition supports this design class without license fees.
Recommended
Test and Measurement Instrumentation
Test equipment designers select the EP3C10F256C6 for digital pattern generators, logic analyzers, and protocol exercisers where flexibility outweighs per-unit cost. The 10,320 LE fabric implements stimulus sequencing, while the M9K memory blocks store pre-recorded waveforms. LVDS inputs at 1.25 Gbps are achievable on selected banks, enabling high-speed serial test access. Engineers program the device via JTAG during development and lock the final bitstream in EPCS flash for production.
Recommended
Educational and Prototyping Boards
University FPGA labs and OEM prototyping boards standardize on the EP3C10F256C6 because Quartus II Web Edition (now Quartus Prime Lite) supports the entire Cyclone III family at no cost. Students learn Verilog and VHDL on a real 60 nm silicon device with 10K LE - enough to host a Nios II soft-core processor. The 256-FBGA package exposes all 182 user I/Os to a 0.1-inch header bank via level shifters, making the board breadboard-friendly.
Recommended
Low-Cost I/O Expansion Backplane
Embedded computing platforms use the EP3C10F256C6 as a backplane I/O expander, translating between a host CPU's SPI/PCIe link and dozens of GPIO, UART, or PWM channels. The 182 user I/Os are split across 8 VCCIO banks, allowing the FPGA to interface with 1.8 V, 2.5 V, and 3.3 V peripherals simultaneously. The 2 PLLs derive multiple clock domains from a single backplane reference, simplifying board layout.
Recommended
Recommended Products Summary
Engineering reference data for EP3C10F256C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C10F256C8N | EP3C10F256C7N | EP3C10F256C6N | EP3C16F256C8N |
|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits |
| Speed Grade | 6 | 8 | 7 | 6 | 8 |
| Maximum User I/Os | 182 | 182 | 182 | 182 | 182 |
| Embedded Multipliers | 23 (18x18) | 23 (18x18) | 23 (18x18) | 23 (18x18) | 56 (18x18) |
| PLLs | 2 | 2 | 2 | 2 | 4 |
| Configuration Mode | AS / JTAG / PS | AS / JTAG / PS | AS / JTAG / PS | AS / JTAG / PS | AS / JTAG / PS |
Key Differentiators
- Highest Fmax margin in same-family speed grades (vs EP3C10F256C8N)
- Density upgrade path in same footprint (vs EP3C16F256C8N)
- Mature Quartus II Web Edition toolchain support (vs Cyclone V (5CEBA4F256C7N))
Design Notes
Decouple every VCCINT pin with a 100 nF X7R ceramic placed within 5 mm of the package ball, and add a single 10 uF bulk capacitor per VCCINT bank. Each VCCIO bank requires its own 100 nF + 10 uF pair to suppress simultaneous switching noise. Estimated: at 100 MHz core clock with 60% utilization, the device draws roughly 1.2 V * 250 mA = 0.3 W dynamic plus 0.12 W static; a 0.5 W budget is safe.
Route the FBGA-256 escape pattern on the top layer with microvias (laser-drilled) to an inner layer ground plane. Keep the JTAG chain (TCK/TMS/TDI/TDO) impedance-controlled at 50 ohm and use a 10 kohm pull-up on nCONFIG and nSTATUS per Altera hardware design guidelines. The MSEL[3:0] pins must be tied to VCCIO_1 (AS mode) or GND (JTAG mode) - leave them accessible via 0 ohm resistors for board-bringup flexibility.
Do not apply power to VCCIO before VCCINT - this forward-biases the I/O ESD diodes and can latch-up the device. Sequence supplies such that VCCINT ramps before or simultaneously with VCCIO. The 'C' suffix in EP3C10F256C6 denotes the 0 C to +85 C commercial range; for industrial -40 C to +125 C operation, choose the 'I' suffix variant (EP3C10F256I6) instead.
Compliance Information
RoHS compliant per Altera/Intel product page (lead-free FBGA package). Not AEC-Q100 qualified - this is a general-purpose FPGA, not an automotive-grade part. Conflict-minerals compliance per Intel's published CMRT declarations.
