EP3C25F256I7N vs EP3C25F324C8 Comparison
Detailed side-by-side comparison of EP3C25F256I7N by Intel and EP3C25F324C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F256I7N | EP3C25F324C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $48.90 | $23.10 |
| Family | Cyclone III | β |
| Device Type | FPGA - Field Programmable Gate Array | β |
| Logic Elements (LEs) | 24,624 | β |
| Logic Array Blocks (LABs) | 1,539 | β |
| Embedded Memory Bits | 608,256 (66 M9K blocks) | β |
| Embedded Multipliers (18x18) | 66 | β |
| Maximum User I/O Pins | 156 | β |
| PLLs | 4 | 4 |
| Process Technology | 65 nm low-power | 65 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V | 1.2 V |
| Package Type | 256-LBGA / 256-FBGA (17x17 mm) | β |
| Operating Temperature Range | -40 C to +125 C (Industrial) | β |
| Speed Grade | 7 | 8 (commercial) |
| RoHS Status | Lead-Free / RoHS Compliant (per F suffix, 7N suffix) | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Series | β | Cyclone III |
| Logic Elements | β | 24,624 LE |
| Logic Array Blocks | β | 1,539 LABs |
| Embedded Memory | β | 608,256 bits |
| Embedded Multipliers | β | 66 (18 x 18) |
| User I/Os | β | 215 |
| Operating Temperature | β | 0 Β°C to +85 Β°C (commercial) |
| Package | β | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Maximum Internal Clock | β | 402 MHz |