EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
MPN: EP3C25F256I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.52 | $87.52 |
| 10 | $78.5 | $785.00 |
| 100 | $65.2 | $6,520.00 |
| 500 | $54.8 | $27,400.00 |
| 1,000 | $48.9 | $48,900.00 |
EP3C25F256I7N Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications.
Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration up to 156 GMACs, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention.
Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends.
Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required.
When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin.
This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.
Drop-in alternatives for EP3C25F256I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C25F256I7N (same form factor and footprint) β differing in Package, Process Technology, Operating Temperature, RoHS Status, Total Memory Bits.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C25F256C8N
β Drop-Inβ In Stock
$38.95 / Unit
View Datasheet βEP3C16F256I7N
β Drop-Inβ In Stock
$38.5 / Unit
View Datasheet βEP3C10F256I7N
β Drop-Inβ In Stock
$34.94 / Unit
View Datasheet βEP3C16U256C8N
β Drop-Inβ In Stock
$48.4 / Unit
View Datasheet βEP3C25E144I7N
β Drop-Inβ In Stock
$66.99 / Unit
View Datasheet βEP3C25F256I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | 24,624 |
| Logic Array Blocks (LABs) | 1,539 |
| Embedded Memory Bits | 608,256 (66 M9K blocks) |
| Embedded Multipliers (18x18) | 66 |
| Maximum User I/O Pins | 156 |
| PLLs | 4 |
| Process Technology | 65 nm low-power |
| Core Voltage | 1.2 V |
| Package Type | 256-LBGA / 256-FBGA (17x17 mm) |
| Operating Temperature Range | -40 C to +125 C (Industrial) |
| Speed Grade | 7 |
| RoHS Status | Lead-Free / RoHS Compliant (per F suffix, 7N suffix) |
| Mounting Type | Surface Mount |
EP3C25F256I7N 256-lbga / 256-fbga (17x17 mm) Pin Configuration Guide
Pin configuration for EP3C25F256I7N (256-lbga / 256-fbga (17x17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C25F256I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C25F256I7N is suitable for 6 applications: Industrial Motor Control and PLC Platforms, Video Surveillance and Image Processing Bridges, Telecommunication Line Cards and Protocol Converters, Automotive Infotainment and Driver-Assistance Subsystems, Low-Cost Software-Defined Radio Front-Ends, Portable Medical Instrumentation and Patient Monitors.
Industrial Motor Control and PLC Platforms
The EP3C25F256I7N fits mid-complexity industrial motion control platforms requiring deterministic multi-axis PWM generation, encoder feedback decoding, and EtherCAT or Profinet protocol bridging. Its 24,624 logic elements and 66 embedded 18x18 multipliers can implement field-oriented control (FOC) loops for two to three motor axes simultaneously, while the four PLLs provide jitter-clean clocks for the Ethernet PHY and high-speed ADC sampling. The 65 nm low-power process keeps junction temperature manageable inside sealed IP65 enclosures, and the 256-FBGA package's 17x17 mm outline suits compact drive boards. The -40 C to +125 C industrial temperature rating enables outdoor cabinet deployment without derating. Designers pair this FPGA with companion op-amps and gate drivers to build a complete axis controller.
Recommended
Video Surveillance and Image Processing Bridges
The EP3C25F256I7N serves as a bridge and pre-processor IC in IP video surveillance cameras, MIPI-to-Parallel image sensor aggregation, and HDMI/DVI output formatting. Its 608 Kbits of embedded memory buffer scan-line data between the image sensor and the ISP pipeline, while the 156 user I/Os accept wide parallel camera buses plus LVDS display links. The four PLLs generate pixel clocks from 27 MHz reference inputs with sub-100 ps jitter, supporting 1080p60 video pipelines. Quartus II reference designs for the Altera Video and Image Processing (VIP) Suite run efficiently within the 24,624-LE envelope. The 256-FBGA footprint integrates cleanly onto 4-layer camera PCBs alongside PoE+ power conditioning.
Recommended
Telecommunication Line Cards and Protocol Converters
Telecommunication line cards and protocol converters (TDM-to-Ethernet, E1/T1 framers, JESD204B bridge) leverage the EP3C25F256I7N's combination of 24,624 LEs, 66 multipliers, and 156 user I/Os. The logic capacity fits full E1/T1 framer plus HDLC controllers, while the four PLLs synchronize to 1.544 / 2.048 / 19.44 MHz reference inputs with deterministic phase alignment. Embedded memory supports elastic buffering for clock-rate adaptation between TDM and packet domains. The 65 nm low-power process keeps board thermal rise under 10 W for fanless rack deployments. Designers use the JTAG port for in-system programming and field firmware upgrades.
Recommended
Automotive Infotainment and Driver-Assistance Subsystems
Automotive infotainment head units, rear-seat entertainment modules, and entry-level ADAS sensor fusion boards use the EP3C25F256I7N as a flexible logic aggregator. The device bridges LVDS camera inputs to MIPI-CSI display panels, implements CAN-FD protocol stacks, and runs audio DSP pre-processing (echo cancellation, beamforming) using its 66 embedded 18x18 multipliers. The industrial -40 C to +125 C temperature rating meets cabin and engine-bay edge placement requirements. Designers implement H.264 encode assist or surround-view stitching within the 24,624-LE logic budget. The 256-FBGA package suits compact ECU form factors. Note that AEC-Q100 qualification is not stated for this part; confirm with the manufacturer for safety-critical ADAS deployments.
Recommended
Low-Cost Software-Defined Radio Front-Ends
Low-cost software-defined radio platforms (HF/VHF receivers, narrow-band telemetry demodulators, academic SDR kits) deploy the EP3C25F256I7N for digital down-conversion, FIR filtering, and protocol demodulation. Its 66 18x18 multipliers implement 16-tap FIR filters and quadrature demodulators at sample rates up to 156 MSPS, while 608 Kbits of embedded memory buffer ADC samples between FFT stages. The four PLLs generate precisely-tuned LO clocks from a single 10 MHz TCXO reference. Quartus II DSP Builder and open-source Verilog FIR cores target the Cyclone III multiplier architecture efficiently. The 256-FBGA footprint pairs naturally with high-speed ADC daughter-cards.
Recommended
Portable Medical Instrumentation and Patient Monitors
Portable medical instrumentation such as multi-parameter patient monitors, pulse oximetry front-ends, and entry-level ultrasound beamformers use the EP3C25F256I7N to aggregate sensor data, run digital signal conditioning, and drive a TFT-LCD display. Its four PLLs generate the clocks needed for both the analog front-end ADC and the parallel RGB display interface, while 156 user I/Os accommodate multiple sensor channels and a capacitive touch controller. The 65 nm low-power process extends battery runtime in handheld form factors, and the industrial temperature rating supports ambulance and bedside deployment. Designers implement ECG/EEG FIR filters and pulse-rate algorithms within the 66-multiplier DSP budget.
Recommended
Recommended Products Summary
Engineering reference data for EP3C25F256I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C25F256C8N | EP3C16F256I7N | EP3C10F256I7N | EP3C16U256C8N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Logic Elements | 24,624 | 24,624 - same die | 15,408 (-37.5%) | 10,320 (-58.1%) | 15,408 (-37.5%) |
| Embedded Memory (bits) | 608,256 (66 M9K) | 608,256 - same | 516,096 | 423,936 | 516,096 |
| 18x18 Multipliers | 66 | 66 - same | 56 | 46 | 56 |
| Maximum User I/O | 156 | 156 - same | 168 | 182 | 168 |
| Temperature Range | -40 C to +125 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +125 C (Industrial) | -40 C to +125 C (Industrial) | 0 C to +85 C (Commercial) |
| RoHS / Lead-Free | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Process / Core Voltage | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V | 65 nm / 1.2 V |
Key Differentiators
- Industrial temperature grade with lead-free / RoHS compliance (vs EP3C25F256C8N)
- Highest logic density in the 256-FBGA Cyclone III family (vs EP3C16F256I7N)
- Full Cyclone III feature set with all four PLLs (vs EP3C10F256I7N)
Design Notes
The EP3C25F256I7N requires a 1.2 V core supply and one or more 2.5 V / 3.3 V auxiliary supplies for the I/O banks and configuration circuitry. Power-on sequencing requires VCCINT (1.2 V) to ramp before or simultaneously with VCCAUX and VCCIO per the Cyclone III handbook; failure to observe sequencing can trigger latch-up. Estimated: a fully-utilized EP3C25 at 50% toggle rate and 156 I/O switching draws approximately 0.8-1.2 W core plus I/O power; budget 5 W total board dissipation with a 1 square-inch copper pour and verify with the Quartus II PowerPlay early power estimator.
Place decoupling capacitors as close as possible to every VCC and GND ball. Use 0.1 uF and 0.01 uF ceramic capacitors in parallel within 100 mils of each supply pin per the Cyclone III Device Handbook reference design. The 256-FBGA package requires microvia or via-in-pad PCB technology for proper signal and power fan-out; standard 8 mil drilled vias typically require dog-bone fan-outs that consume excessive routing channels on inner layers. Plan a 4-layer or 6-layer stackup with continuous GND planes beneath the BGA to control return paths and provide thermal spreading.
Do not confuse the EP3C25F256I7N (industrial -40 to +125 C) with the EP3C25F256C8N (commercial 0 to +85 C) - the part numbers share the same die but differ in qualification. Ensure your Quartus II pin assignment file matches the bank-voltage configuration of every I/O bank, since mixing 2.5 V and 3.3 V standards within a single bank is forbidden. The configuration mode (AS, PS, JTAG, or FPP) must be selected via MSEL pins before power-up; dynamic reconfiguration between modes requires full power cycling.
Route high-speed differential pairs (LVDS, DDR) with 100 ohm differential impedance and length-matching within 20 mils across the P and N traces. The EP3C25F256I7N's PLL analog supply pins (VCCA_PLL) require dedicated filtering: a ferrite bead plus 0.1 uF and 10 uF capacitors per PLL, isolated from the digital supply plane to minimize jitter injection. Place clock input pins near PLL pins to minimize trace length and stub reflections. Reference the Cyclone III device handbook chapter 6 for the complete pinout guidelines and bank restrictions.
Compliance Information
RoHS compliant per N suffix in the part number. Lead-free 256-FBGA balls. AEC-Q100 qualification is not stated on the manufacturer product page; for safety-critical automotive applications, contact Intel directly for automotive-grade device variants. Halogen-free status not explicitly documented in the verified web data.
