EP3C25F324C6N vs EP3C25F324C7N Comparison
Detailed side-by-side comparison of EP3C25F324C6N by Intel and EP3C25F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C6N | EP3C25F324C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.30 | $0.00 |
| Series | Cyclone III | β |
| Family | Cyclone III (low-power, low-cost FPGA) | β |
| Logic Elements (LE) | 24,624 | β |
| Total Memory Bits | 608,256 bits | β |
| Embedded Memory Blocks | M9K blocks, 66 total | β |
| Embedded Multipliers | 66 (18x18) | β |
| DSP Blocks | 66 dedicated 18x18 multipliers | β |
| User I/O Pins | 215 | β |
| Number of I/O Banks | 8 | β |
| PLLs | 4 general-purpose PLLs | β |
| Package | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA |
| Speed Grade | C6 (commercial) | β |
| Operating Temperature | 0C to +85C (commercial) | β |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | β |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | β |
| Mounting Type | Surface Mount | Surface Mount |
| Product Type | β | Field Programmable Gate Array (FPGA) |
| Device Family | β | Cyclone III |
| Logic Cells | β | 24,624 cells |
| Embedded Memory | β | 608,256 bits |
| Available I/O Pins | β | 215 I/O |
| Maximum Listed Frequency | β | 437.5 MHz |
| Core Voltage | β | 1.2 V |
| Terminal Count | β | 324 terminals |
| Terminal Form | β | Ball |
| Package Code | β | BGA |
| Package Shape | β | Rectangular |
| Temperature Grading | β | Other |
| Programmability | β | Field programmable |
| RoHS Status | β | [DATA_NEEDED: RoHS status] |
| REACH Status | β | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | β | [DATA_NEEDED: AEC-Q100 qualification] |