EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel
MPN: EP3C25F324C7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1529.4682 | $1,529.47 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3C25F324C7N Overview
A field-programmable gate array, or FPGA, is a semiconductor device whose logic functions are defined by configuration rather than fixed internal connections. Its hierarchy extends from programmable logic cells to configurable interconnects, embedded memory, I/O blocks, and a complete programmable-logic IC. Unlike an ASIC, an FPGA can be reprogrammed during development and after deployment. Compared with a fixed microcontroller, an FPGA generally provides parallel hardware execution and finely timed I/O, while trade-offs include higher power consumption, configuration requirements, and more complex implementation software.
The principal verified resources are 24,624 logic cells and 608,256 memory bits, with 215 I/O pins available for external connectivity. The 324-ball FBGA package supports a substantial number of package-level connections while using surface-mount assembly. The supplied data also identifies a 437.5 MHz frequency and 65 nm process technology. These resources make the device suitable for datapaths that need more concurrent logic than a small programmable device but do not justify the cost and development cycle of a custom ASIC.
Cyclone III architecture combines programmable logic arrays, routing resources, embedded memory, and programmable I/O elements. A design is captured with an FPGA development flow, synthesized into logic, mapped and placed onto available resources, routed through the device interconnect, and then loaded into configuration memory. Engineers must analyze timing closure, power, signal integrity, and configuration implementation together; an apparently efficient register-transfer design can still fail timing if fan-out, routing congestion, or unsuitable I/O constraints are ignored.
Typical uses include industrial control, communications equipment, video or imaging preprocessing, test and measurement, and legacy interface emulation. The combination of 24,624 logic cells, 608,256 embedded memory bits, and 215 I/Os is relevant to glue-logic aggregation, protocol conversion, parallel acquisition, and state-machine-rich controllers. For a new high-volume product, however, lifecycle, migration, and total-cost studies are important before committing the design.
PCB design should prioritize continuous power distribution, controlled-impedance connections, and clean clock routing. Because the available verified data does not provide detailed electrical limits, pin functions, configuration-interface requirements, thermal limits, or package dimensions, those values must be confirmed from the manufacturer datasheet before schematic release. Do not infer BGA ball assignments from the package name alone.
This product page combines verified distributor specifications, availability signals, package context, and transparent engineering notes. Pricing is reported as of 2026-09-09, while distributor stock and lead time remain dynamic. The manufacturer ordering code, package, device family, logic-cell count, embedded memory, I/O count, process node, supply voltage, and frequency are the attributes most useful for initial device selection.
Drop-in alternatives for EP3C25F324C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C25F324C7N (same form factor and footprint) β differing in Package, Process Technology, Operating Temperature, Speed Grade, Embedded Memory.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C25F324C6N
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View Datasheet βEP3C25F324C7N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Cyclone III |
| Logic Cells | 24,624 cells |
| Embedded Memory | 608,256 bits |
| Available I/O Pins | 215 I/O |
| Maximum Listed Frequency | 437.5 MHz |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Package | 324-ball FBGA |
| Terminal Count | 324 terminals |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Rectangular |
| Mounting Type | Surface Mount |
| Temperature Grading | Other |
| Programmability | Field programmable |
EP3C25F324C7N rectangular Pin Configuration Guide
Pin configuration for EP3C25F324C7N (rectangular package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C25F324C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C25F324C7N is suitable for 6 applications: Industrial Control and Automation, Communications Protocol Bridging, Video and Imaging Preprocessing, Test and Measurement Hardware, Legacy Interface Emulation, Parallel Digital Signal Processing.
Industrial Control and Automation
EP3C25F324C7N fits industrial control systems that need concurrent state machines, timing blocks, sensor-interface logic, and deterministic parallel I/O. Its verified resources include 24,624 logic cells, 608,256 embedded memory bits, and 215 available I/O pins, allowing several control channels to be combined in one programmable device. Engineers can implement acquisition sequencing, motor-control peripherals, protocol conversion, and safety-oriented supervisory logic while evaluating timing in the FPGA tool. The 324-ball FBGA package places power, configuration, and high-speed routing demands on the PCB, so use the official pin map and bank rules. The supplied data does not confirm an industrial temperature grade or reliability qualification, so those must be verified before deployment in factory, process-control, or automation equipment.
Recommended
Communications Protocol Bridging
EP3C25F324C7N is suitable for protocol bridging when parallel hardware can translate streams between interfaces with different widths, timings, or framing rules. The 24,624 logic cells can host serializers, packet handlers, FIFOs, and control state machines, while the 608,256 bits of embedded memory can support buffering and flow control. Its 215 available I/Os help aggregate slower legacy interfaces around a higher-speed system connection. Place clock-domain-crossing blocks deliberately, constrain every transferred interface, and analyze maximum path delay after routing. The device's listed 437.5 MHz value is not a guaranteed user-design frequency. I/O voltage support, differential-pair capability, transceiver availability, reference-clock requirements, and exact package balls are not present in the verified data and must be confirmed from the manufacturer datasheet.
Recommended
Video and Imaging Preprocessing
EP3C25F324C7N can perform image preprocessing before data is transferred to a processor, display controller, or capture host. Its 24,624 logic cells can implement pixel formatting, thresholding, color conversion, line buffering, region extraction, and simple filtering, while 608,256 embedded memory bits can hold compact buffers or intermediate blocks. The 215 available I/Os provide flexibility for parallel sensor buses and control channels. Timing closure depends on target pixel rates, bus width, arithmetic pipeline depth, and memory access patterns; the listed 437.5 MHz figure is not a design guarantee. The verified package is 324-ball FBGA, so escape routing, controlled impedance, ground-reference continuity, and I/O-bank placement need early review. Exact supported I/O standards and pin assignments must be obtained from Intel before selecting the device for a video interface.
Recommended
Test and Measurement Hardware
EP3C25F324C7N fits test and measurement hardware that requires simultaneous capture, counting, waveform qualification, stimulus generation, and host-side data formatting. The FPGA's 24,624 logic cells support parallel counters, comparators, encoders, trigger state machines, and timing generators, while its 608,256 embedded memory bits can buffer captured windows or descriptors. Up to 215 I/O pins allow direct coordination with analog-front-end controls, relays, clocks, and digital interfaces. For measurement accuracy, separate sensitive analog and clock domains from fast digital routes, characterize I/O thresholds, and time the implemented logic under voltage and temperature corners. The supplied data does not specify analog capability, maximum toggle rates, input thresholds, or timing details, so the manufacturer documentation and post-route analysis are mandatory before treating the FPGA as a measurement instrument controller.
Recommended
Legacy Interface Emulation
EP3C25F324C7N is a practical candidate for emulating legacy buses, custom peripherals, and obsolete interface timing when software alone cannot reproduce deterministic behavior. The device can map control registers into addressable logic, implement wait states, generate chip-select or handshake sequences, and translate between asynchronous domains using verified logic resources. Its 24,624 logic cells and 608,256 bits of embedded memory provide capacity for multiple interfaces, while 215 I/Os can support broad legacy buses and supervisory signals. Preserve bus turn-around rules and metastability mitigation at every asynchronous boundary, then verify electrical levels independently because FPGA I/O compatibility is not implied by protocol logic. The 324-ball FBGA implementation may require board changes when legacy voltage levels do not match the device. Confirm supported I/O standards, configuration requirements, and pin assignments before production.
Recommended
Parallel Digital Signal Processing
EP3C25F324C7N can implement fixed-function parallel digital signal processing where deterministic latency and simultaneous operations are more important than software flexibility. The 24,624 logic cells can execute arithmetic pipelines, filters, correlators, encoders, and control logic, and the 608,256 embedded memory bits can support delays, look-up tables, or circular buffers. The 215 I/O count supports multi-channel input and output structures. Designers should pipeline arithmetic to the target clock, bound coefficient widths explicitly, and account for finite precision rather than assuming floating-point behavior. The listed 437.5 MHz value is only a device-level data point; post-route timing must be performed for the selected speed grade, I/O standard, placement, and operating conditions. Confirm DSP-block details, clock resources, power limits, and supported I/O banks because those parameters are not included in the verified source data.
Recommended
Recommended Products Summary
Engineering reference data for EP3C25F324C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C25F324C6N | EP3C25F256I7N | EP3C25F256C8N | EP3C16F484C7N | EP3C10F256C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FBGA | 324-ball FBGA | 256-ball FBGA | 256-ball FBGA | 484-ball FBGA | 256-ball FBGA |
| Logic Cells | 24,624 cells | 24,624 cells | 24,624 cells | 24,624 cells | 15,408 cells | 10,320 cells |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 516,096 bits | 423,936 bits |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Drop-In Status Evidence | Target device | Same 324-ball package claimed; exact pinout not supplied | No exact pin compatibility established | No exact pin compatibility established | No exact pin compatibility established | No exact pin compatibility established |
Key Differentiators
- Largest verified logic capacity among the listed same-family comparison devices (vs EP3C16F484C7N)
- Higher verified embedded-memory capacity than lower-density family options (vs EP3C10F256C8N)
- More available I/O than the EP3C10F256C8N option (vs EP3C10F256C8N)
Design Notes
Start the power network from the complete manufacturer operating-condition table, not the nominal 1.2 V core-voltage value alone. The verified results establish a 1.2 V core supply but do not provide tolerance, current, auxiliary-rail, sequencing, or transient requirements. Partition the design by voltage domain, estimate activity-dependent power with the supported tool, and include sufficient local capacitance at each supply group. Place regulators, monitor points, and bulk storage near their loads, while keeping high-di/dt loops compact. Review simultaneous power-up behavior and controlled ramp requirements before fixing the reset and configuration circuitry.
Use the official 324-ball FBGA land pattern and exact package drawing; no generic BGA footprint should be copied without verification. Fan out each ball through a continuous reference plane, avoid necked or shared return paths, and provide accessible test points for configuration, clocks, and critical buses. Follow the package escape recommendations for via-in-pad or dog-bone structures as permitted by the assembly process. Reserve clean layers for clocks and high-speed routes, keep differential pairs length-matched, and avoid routing fast signals through power or configuration regions. Confirm BGA pad diameter, pitch, solder mask, and paste geometry from current Intel documentation.
Define timing constraints before implementation and require post-route timing closure for every clock domain. The listed 437.5 MHz value is a verified device-level data point, not a guarantee for a particular design. Identify all generated clocks, recovered clocks, input delays, output delays, and false paths explicitly. Synchronize asynchronous inputs, isolate unrelated domains, and constrain interface timing at the FPGA pins. For DDR or other source-synchronous interfaces, apply the appropriate I/O timing model and simulate the complete channel. Re-run timing, power, and pin-location analyses after any RTL, clock, or placement change.
Do not assume that a shared Cyclone III family name, logic-cell count, or FBGA package makes a replacement drop-in compatible. The supplied alternative results are insufficient to establish exact ball compatibility for several candidates, and FPGA pin multiplexing can make nominally similar package designs electrically different. Before substitution, compare the complete ball maps, speed-grade timing, I/O-bank voltages, configuration scheme, power rails, memory, clocking, and design-tool support. Run equivalent RTL through synthesis, mapping, and timing analysis on the candidate device, then review the schematic and PCB as a formal redesign if any signal, power, or configuration connection changes.
Compliance Information
The supplied web results do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals compliance. AEC-Q100 is therefore marked not_qualified rather than assumed applicable or qualified.
