EP3C25F324C7N vs EP3C25F324C6N Comparison
Detailed side-by-side comparison of EP3C25F324C7N by Intel and EP3C25F324C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C7N | EP3C25F324C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $62.30 |
| Product Type | Field Programmable Gate Array (FPGA) | β |
| Device Family | Cyclone III | β |
| Logic Cells | 24,624 cells | β |
| Embedded Memory | 608,256 bits | β |
| Available I/O Pins | 215 I/O | β |
| Maximum Listed Frequency | 437.5 MHz | β |
| Process Technology | 65 nm | TSMC 65 nm low-power (LP) |
| Core Voltage | 1.2 V | β |
| Package | 324-ball FBGA | 324-BGA (FBGA-324), fine-pitch |
| Terminal Count | 324 terminals | β |
| Terminal Form | Ball | β |
| Package Code | BGA | β |
| Package Shape | Rectangular | β |
| Mounting Type | Surface Mount | Surface Mount |
| Temperature Grading | Other | β |
| Programmability | Field programmable | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | β |
| REACH Status | [DATA_NEEDED: REACH status] | β |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | β |
| Series | β | Cyclone III |
| Family | β | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | β | 24,624 |
| Total Memory Bits | β | 608,256 bits |
| Embedded Memory Blocks | β | M9K blocks, 66 total |
| Embedded Multipliers | β | 66 (18x18) |
| DSP Blocks | β | 66 dedicated 18x18 multipliers |
| User I/O Pins | β | 215 |
| Number of I/O Banks | β | 8 |
| PLLs | β | 4 general-purpose PLLs |
| Speed Grade | β | C6 (commercial) |
| Operating Temperature | β | 0C to +85C (commercial) |
| Configuration Schemes | β | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | β | Yes (lead-free, RoHS compliant) |