EP3C25F324C7N vs EP3C25F324I7 Comparison
Detailed side-by-side comparison of EP3C25F324C7N by Intel and EP3C25F324I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C7N | EP3C25F324I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $64.80 |
| Product Type | Field Programmable Gate Array (FPGA) | β |
| Device Family | Cyclone III | β |
| Logic Cells | 24,624 cells | β |
| Embedded Memory | 608,256 bits | 608,256 bits (594 Kbits M9K blocks) |
| Available I/O Pins | 215 I/O | β |
| Maximum Listed Frequency | 437.5 MHz | β |
| Process Technology | 65 nm | TSMC 65 nm low-power CMOS |
| Core Voltage | 1.2 V | β |
| Package | 324-ball FBGA | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Terminal Count | 324 terminals | β |
| Terminal Form | Ball | β |
| Package Code | BGA | β |
| Package Shape | Rectangular | β |
| Mounting Type | Surface Mount | Surface Mount |
| Temperature Grading | Other | β |
| Programmability | Field programmable | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | β |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | β |
| Series | β | Cyclone III |
| Logic Elements (LEs) | β | 24,624 |
| Logic Array Blocks (LABs) | β | 1,539 |
| Embedded 18x18 Multipliers | β | 66 |
| PLLs | β | 4 |
| Global Clock Networks | β | 20 |
| Maximum User I/O | β | 215 |
| Core Voltage (VCCINT) | β | 1.2 V |
| I/O Voltage (VCCIO) | β | 1.2 V to 3.3 V (per bank) |
| Operating Junction Temperature | β | -40 Β°C to +100 Β°C (industrial) |
| Configuration Modes | β | Passive Serial (PS), Active Serial (AS), JTAG |