EP3C25F324C8 vs EP3C25F256I7N Comparison

Detailed side-by-side comparison of EP3C25F324C8 by Intel and EP3C25F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3C25F324C8

EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel

EP3C25F324C8 Nrnd

Specification Comparison

Parameter EP3C25F324C8 EP3C25F256I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $23.10 $48.90
Series Cyclone III β€”
Logic Elements 24,624 LE β€”
Logic Array Blocks 1,539 LABs β€”
Embedded Memory 608,256 bits β€”
Embedded Multipliers 66 (18 x 18) β€”
User I/Os 215 β€”
PLLs 4 4
Process Technology 65 nm CMOS, SRAM-based 65 nm low-power
Core Voltage 1.2 V 1.2 V
Speed Grade 8 (commercial) 7
Operating Temperature 0 Β°C to +85 Β°C (commercial) β€”
Package 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch β€”
Mounting Type Surface Mount (BGA) Surface Mount
Maximum Internal Clock 402 MHz β€”
RoHS Status Non-compliant (per Lisleapex listing; original part number without 'N' suffix) Lead-Free / RoHS Compliant (per F suffix, 7N suffix)
Family β€” Cyclone III
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements (LEs) β€” 24,624
Logic Array Blocks (LABs) β€” 1,539
Embedded Memory Bits β€” 608,256 (66 M9K blocks)
Embedded Multipliers (18x18) β€” 66
Maximum User I/O Pins β€” 156
Package Type β€” 256-LBGA / 256-FBGA (17x17 mm)
Operating Temperature Range β€” -40 C to +125 C (Industrial)

Datasheets & Resources

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