EP3C25F324C8 vs EP3C25F324C7N Comparison

Detailed side-by-side comparison of EP3C25F324C8 by Intel and EP3C25F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3C25F324C8

EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel

EP3C25F324C8 Nrnd
Intel
EP3C25F324C7N

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N βœ“ Active

Specification Comparison

Parameter EP3C25F324C8 EP3C25F324C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $23.10 $0.00
Series Cyclone III β€”
Logic Elements 24,624 LE β€”
Logic Array Blocks 1,539 LABs β€”
Embedded Memory 608,256 bits 608,256 bits
Embedded Multipliers 66 (18 x 18) β€”
User I/Os 215 β€”
PLLs 4 β€”
Process Technology 65 nm CMOS, SRAM-based 65 nm
Core Voltage 1.2 V 1.2 V
Speed Grade 8 (commercial) β€”
Operating Temperature 0 Β°C to +85 Β°C (commercial) β€”
Package 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch 324-ball FBGA
Mounting Type Surface Mount (BGA) Surface Mount
Maximum Internal Clock 402 MHz β€”
RoHS Status Non-compliant (per Lisleapex listing; original part number without 'N' suffix) [DATA_NEEDED: RoHS status]
Product Type β€” Field Programmable Gate Array (FPGA)
Device Family β€” Cyclone III
Logic Cells β€” 24,624 cells
Available I/O Pins β€” 215 I/O
Maximum Listed Frequency β€” 437.5 MHz
Terminal Count β€” 324 terminals
Terminal Form β€” Ball
Package Code β€” BGA
Package Shape β€” Rectangular
Temperature Grading β€” Other
Programmability β€” Field programmable
REACH Status β€” [DATA_NEEDED: REACH status]
AEC-Q100 Qualification β€” [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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