EP3C25F324I7 vs EP3C25F324I7N Comparison
Detailed side-by-side comparison of EP3C25F324I7 by Intel and EP3C25F324I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3C25F324I7N
EP3C25F324I7N - Cyclone III FPGA, 24,624 LEs, 324-FBGA | Intel
EP3C25F324I7N β ActiveSpecification Comparison
| Parameter | EP3C25F324I7 | EP3C25F324I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $64.80 | $58.20 |
| Series | Cyclone III | β |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Logic Array Blocks (LABs) | 1,539 | β |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | 66 | 66 |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Maximum User I/O | 215 | β |
| Process Technology | TSMC 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | β |
| Operating Junction Temperature | -40 Β°C to +100 Β°C (industrial) | β |
| Package | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (Fine-Pitch BGA) |
| Mounting Type | Surface Mount | β |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| RoHS Status | Compliant | Compliant |
| Family | β | Cyclone III |
| Maximum User I/O Pins | β | 215 |
| LVDS Pairs | β | 66 |
| Core Voltage | β | 1.2 V |
| I/O Bank Voltage Range | β | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Operating Temperature | β | -40C to +100C (Industrial) |
| Speed Grade | β | 7 (slower speed grade, lower power) |
| Lead-Free | β | Yes |
| MSL Level | β | 3 (168 hours) |