EP3C25F324I7N - Cyclone III FPGA, 24,624 LEs, 324-FBGA | Intel
MPN: EP3C25F324I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $92.9 | $92.90 |
| 10 | $84.5 | $845.00 |
| 100 | $72.8 | $7,280.00 |
| 250 | $65.4 | $16,350.00 |
| 500 | $58.2 | $29,100.00 |
EP3C25F324I7N Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to implement arbitrary digital logic functions through configurable logic blocks (LBs/LEs), programmable routing, and dedicated hard IP blocks such as memory and DSP. In the programmable-logic taxonomy, FPGAs sit alongside CPLDs as the highest-density user-configurable devices, falling under digital ICs > programmable logic > FPGA > CPLD hierarchy. Cyclone III sits at the low-power, low-cost end of Intel's FPGA portfolio, optimized for ASIC-replacement, glue-logic consolidation, and parallel DSP workloads.
Key features include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and configuration via active serial (AS), passive serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The device operates from a 1.2 V core supply and supports I/O bank voltages of 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL). The 1.2 V core and 65 nm process deliver a typical power reduction of up to 50% versus the previous-generation Cyclone II family.
The architecture combines LABs (Logic Array Blocks) of 16 LEs each with M9K memory blocks (9 Kbits each) distributed across the fabric, enabling efficient implementation of FIFOs, shift registers, and small ROM/RAM functions. The hard 18x18 multipliers accelerate DSP algorithms such as FIR filters, FFTs, and motor-control loops without consuming general-purpose fabric. Cyclone III's deterministic routing fabric and Quartus II / Quartus Prime design flow support rapid design iteration and proven IP libraries.
Typical applications include industrial motor control and factory automation, video processing and image sensor bridging, automotive infotainment and driver-assistance subsystems, telecommunications line cards, and portable medical instrumentation. Its combination of low static power (~100 mW typical) and moderate logic density makes it a strong fit for volume designs where a low-cost CPLD would be too small and a high-end Stratix FPGA would be over-spec.
When designing with this device, validate signal-integrity and length-matching rules for DDR2/QSPI interfaces early, and ensure the 1.2 V core rail uses a low-noise LDO (such as an LDO from the LDO regulator family) to meet the core voltage tolerance. Confirm BGA fanout and via-in-pad manufacturing capability with the assembly house before committing the PCB layout.
This page synthesizes distributor pricing, drop-in alternatives, comparison data and practical design notes not found on any single manufacturer or distributor page, including a cross-reference comparison with EP3C25F256I7N and EP3C16F484I7N from the same Cyclone III family.
Drop-in alternatives for EP3C25F324I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C25F324I7N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C25F324C8N
✅ Drop-In✓ In Stock
$27.1 / Unit
View Datasheet →EP3C25F324C7N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP3C25F324C6N
✅ Drop-In✓ In Stock
$62.3 / Unit
View Datasheet →EP3C25F324I7
✅ Drop-In✓ In Stock
$64.8 / Unit
View Datasheet →EP3C25E144I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$66.99 / Unit
View Datasheet →XC3S250E-4FTG256C
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C25F324I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LEs) | 24,624 |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | 66 |
| Maximum User I/O Pins | 215 |
| LVDS Pairs | 66 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Package | 324-ball FBGA (Fine-Pitch BGA) |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Speed Grade | 7 (slower speed grade, lower power) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 (168 hours) |
EP3C25F324I7N 324-ball fbga (fine-pitch bga) Pin Configuration Guide
Pin configuration for EP3C25F324I7N (324-ball fbga (fine-pitch bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C25F324I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C25F324I7N is suitable for 6 applications: Industrial Motor Control and Drive, Video Processing and Image Sensor Bridging, Automotive Infotainment and Driver Assistance, Telecommunications Line Cards and Protocol Bridging, Portable Medical Instrumentation, Industrial IoT Gateways and Edge Controllers.
Industrial Motor Control and Drive
The EP3C25F324I7N is well suited to industrial motor-control and variable-frequency drive applications because its 66 embedded 18x18 multipliers and 4 PLLs handle field-oriented control (FOC), space-vector PWM, and encoder-feedback algorithms in a single device. With 24,624 LEs available, the FPGA can integrate the FOC loop, SVPWM modulator, current-signal conditioning glue logic, and a UART/CAN control interface without an external DSP. The industrial -40C to +100C temperature grade is required for cabinet-mounted drives and outdoor factory equipment. The 1.2 V core draws ~100 mW typical, keeping the total power budget compatible with 24 V industrial bus rails when paired with a switching pre-regulator and LDO post-regulation.
Recommended
Video Processing and Image Sensor Bridging
The EP3C25F324I7N can bridge image sensors (MIPI CSI-2, parallel CMOS, LVDS) to display or processor interfaces (BT.656, HDMI, parallel RGB) thanks to its 66 LVDS pairs and 215 user I/Os, which is enough headroom for parallel video buses plus control channels. The 66 M9K blocks of 9 Kbits each form 594 Kbits of line-buffer memory for deinterlacing or color-space conversion. Industrial temperature qualification suits outdoor surveillance and machine-vision enclosures. Compared with a DSP + ASIC approach, the FPGA collapses glue logic, scaler, and color-space converter into a single chip with proven IP cores.
Recommended
Automotive Infotainment and Driver Assistance
The EP3C25F324I7N fits automotive infotainment, rear-seat entertainment, and basic driver-assistance subsystems where moderate logic density and industrial temperature are required. Its 65 nm low-power process delivers the ~100 mW typical core power demanded by always-on automotive head units, and the 66 DSP multipliers handle audio DSP, voice-recognition preprocessing, and camera image-pipeline primitives. The 324-ball FBGA footprint integrates well with multi-layer automotive PCBs, and the Quartus Prime toolchain supports AUTOSAR-friendly IP and ASIL-aware design flows. Note: for full AEC-Q100 qualification, choose an automotive-grade Cyclone III variant or migrate to Cyclone V or Cyclone 10 LP.
Recommended
Telecommunications Line Cards and Protocol Bridging
Telecommunications equipment such as E1/T1 line cards, RS-485 repeaters, and protocol-conversion gateways benefit from the EP3C25F324I7N's combination of moderate logic density, 66 LVDS pairs for high-speed serial I/O, and 4 PLLs for clock synthesis. The FPGA can implement UART, SPI, I2C, HDLC, and custom telecom protocols in fabric while running the supervisory state machine in parallel. Industrial temperature operation handles outdoor cabinet and roadside installations. The 608 Kbits of embedded RAM accommodates packet buffering for low-latency protocol conversion.
Recommended
Portable Medical Instrumentation
The EP3C25F324I7N supports portable and bedside medical instrumentation including patient monitors, pulse-oximeter front-ends, and ultrasound beam-formers where its 66 embedded 18x18 multipliers accelerate FIR/IIR filter chains and FFT-based spectral analysis. The 1.2 V core voltage enables battery-powered operation when paired with a buck regulator and LDO; total core power around 100 mW is acceptable for handheld or wearable form factors. Industrial temperature operation ensures reliable performance in clinical and emergency-response environments. The 215 user I/Os accommodate multi-channel analog-front-end I/O, display interfaces, and wireless module connections.
Recommended
Industrial IoT Gateways and Edge Controllers
The EP3C25F324I7N serves as a flexible industrial-IoT gateway and edge-controller, aggregating Modbus, CAN, RS-485, and EtherCAT fieldbus traffic into a unified uplink (Ethernet, Wi-Fi, or cellular). The 24,624 LEs handle protocol stacks, sensor-data preprocessing, and local control loops in parallel; the 66 M9K blocks buffer transient network bursts; and the 4 PLLs generate the multiple clock domains required by mixed-speed interfaces. Industrial temperature grade and proven long-term supply make it suitable for factory-floor installations expected to run 10+ years. The 324-ball FBGA integrates cleanly with multi-rail industrial power designs.
Recommended
Recommended Products Summary
Engineering reference data for EP3C25F324I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C25F324C8N | EP3C25F324C7N | EP3C25F324C6N | EP3C25F324I7 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 324-ball FBGA (1.0 mm pitch) | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 |
| Embedded Memory | 608,256 bits (594 Kbits) | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 |
| User I/O Pins | 215 | 215 | 215 | 215 | 215 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| Speed Grade | 7 | 8 (slower) | 7 | 6 (slowest) | 7 |
Key Differentiators
- Same silicon as commercial-grade F324 variants but qualified for -40C to +100C industrial operation (vs EP3C25F324C7N)
- Speed grade 7 balances timing margin and power versus slower C8 and C6 bins (vs EP3C25F324C8N)
- Industrial temperature grade validated by Intel's I7 screening flow versus C7 commercial screen (vs EP3C25F324C6N)
- 324-ball FBGA maximizes user I/O density for high-pin-count designs (vs EP3C25E144I7N)
Design Notes
The EP3C25F324I7N requires a low-noise 1.2 V core supply capable of delivering up to ~500 mA during configuration and full logic utilization. Recommended approach: a switching buck regulator (such as a 3 A buck from the TPS54xxx family) followed by a low-dropout LDO such as the TPS7A4701 to filter switching ripple below 1 mVpp. Decoupling requires at least 10 x 100 nF 0402 ceramic capacitors plus 4 x 10 uF bulk caps placed within 5 mm of the FBGA balls. I/O bank voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) each need their own decoupling network.
The 324-ball FBGA at 1.0 mm pitch requires via-in-pad (VIP) or microvia manufacturing to escape the inner rows. Use 0.2 mm (8 mil) laser-drilled microvias and a 0.4 mm (16 mil) pad diameter for the BGA side. PCB stackup should be at least 6 layers with continuous ground planes on layers 2 and 5 to provide controlled impedance for LVDS pairs. Trace length matching within 150 mil for DDR2 byte lanes is mandatory - use the Quartus Prime TimeQuest report to validate timing after place-and-route.
Common mistakes to avoid: (1) Do not omit the external configuration memory - Cyclone III requires a serial configuration flash (EPCS4 or larger) for AS mode; (2) Do not float nCONFIG or nSTATUS - they need 4.7 kohm pull-ups to VCCIO of the configuration bank; (3) Do not share the JTAG chain with non-FPGA devices without buffering; (4) Do not exceed 215 user I/Os in pin assignments - the package limits you regardless of fabric availability; (5) Do not apply core voltage before I/O bank voltage - this can cause I/O latch-up; (6) Always use Quartus Prime's pin planner to validate pin assignments against the 324-ball FBGA ball map.
Compliance Information
RoHS compliant and lead-free per Intel product declaration. Industrial temperature grade (-40C to +100C) is per Intel's I7 screening flow; the part is NOT AEC-Q100 qualified - for full automotive qualification, contact Intel about automotive-grade Cyclone III variants or migrate to Cyclone V / Cyclone 10 LP. REACH compliance per EU SVHC declaration.
