EP3C25F324I7N vs EP3C25F324C6N Comparison

Detailed side-by-side comparison of EP3C25F324I7N by Intel and EP3C25F324C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324I7N EP3C25F324C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $58.20 $62.30
Family Cyclone III Cyclone III (low-power, low-cost FPGA)
Logic Elements (LEs) 24,624 β€”
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) β€”
Embedded 18x18 Multipliers 66 β€”
Maximum User I/O Pins 215 β€”
LVDS Pairs 66 β€”
PLLs 4 4 general-purpose PLLs
Global Clock Networks 20 β€”
Process Technology 65 nm TSMC 65 nm low-power (LP)
Core Voltage 1.2 V β€”
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) β€”
Package 324-ball FBGA (Fine-Pitch BGA) 324-BGA (FBGA-324), fine-pitch
Operating Temperature -40C to +100C (Industrial) 0C to +85C (commercial)
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) β€”
Speed Grade 7 (slower speed grade, lower power) C6 (commercial)
RoHS Status Compliant β€”
Lead-Free Yes β€”
MSL Level 3 (168 hours) β€”
Series β€” Cyclone III
Logic Elements (LE) β€” 24,624
Total Memory Bits β€” 608,256 bits
Embedded Memory Blocks β€” M9K blocks, 66 total
Embedded Multipliers β€” 66 (18x18)
DSP Blocks β€” 66 dedicated 18x18 multipliers
User I/O Pins β€” 215
Number of I/O Banks β€” 8
Configuration Schemes β€” Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS β€” Yes (lead-free, RoHS compliant)
Mounting Type β€” Surface Mount

Datasheets & Resources

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