EP3C25F324I7N vs EP3C25F324C8 Comparison

Detailed side-by-side comparison of EP3C25F324I7N by Intel and EP3C25F324C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324I7N EP3C25F324C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $58.20 $23.10
Family Cyclone III β€”
Logic Elements (LEs) 24,624 β€”
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) 608,256 bits
Embedded 18x18 Multipliers 66 β€”
Maximum User I/O Pins 215 β€”
LVDS Pairs 66 β€”
PLLs 4 4
Global Clock Networks 20 β€”
Process Technology 65 nm 65 nm CMOS, SRAM-based
Core Voltage 1.2 V 1.2 V
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) β€”
Package 324-ball FBGA (Fine-Pitch BGA) 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Operating Temperature -40C to +100C (Industrial) 0 Β°C to +85 Β°C (commercial)
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) β€”
Speed Grade 7 (slower speed grade, lower power) 8 (commercial)
RoHS Status Compliant Non-compliant (per Lisleapex listing; original part number without 'N' suffix)
Lead-Free Yes β€”
MSL Level 3 (168 hours) β€”
Series β€” Cyclone III
Logic Elements β€” 24,624 LE
Logic Array Blocks β€” 1,539 LABs
Embedded Multipliers β€” 66 (18 x 18)
User I/Os β€” 215
Mounting Type β€” Surface Mount (BGA)
Maximum Internal Clock β€” 402 MHz

Datasheets & Resources

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