EP3C25F324I7N vs EP3C25F324I7 Comparison

Detailed side-by-side comparison of EP3C25F324I7N by Intel and EP3C25F324I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324I7N EP3C25F324I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $58.20 $64.80
Family Cyclone III β€”
Logic Elements (LEs) 24,624 24,624
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) 608,256 bits (594 Kbits M9K blocks)
Embedded 18x18 Multipliers 66 66
Maximum User I/O Pins 215 β€”
LVDS Pairs 66 β€”
PLLs 4 4
Global Clock Networks 20 20
Process Technology 65 nm TSMC 65 nm low-power CMOS
Core Voltage 1.2 V β€”
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) β€”
Package 324-ball FBGA (Fine-Pitch BGA) 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Operating Temperature -40C to +100C (Industrial) β€”
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) Passive Serial (PS), Active Serial (AS), JTAG
Speed Grade 7 (slower speed grade, lower power) β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
MSL Level 3 (168 hours) β€”
Series β€” Cyclone III
Logic Array Blocks (LABs) β€” 1,539
Maximum User I/O β€” 215
Core Voltage (VCCINT) β€” 1.2 V
I/O Voltage (VCCIO) β€” 1.2 V to 3.3 V (per bank)
Operating Junction Temperature β€” -40 Β°C to +100 Β°C (industrial)
Mounting Type β€” Surface Mount

Datasheets & Resources

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