EP3C40F780C8 vs EP3C40F780C7 Comparison
Detailed side-by-side comparison of EP3C40F780C8 by Intel and EP3C40F780C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C8 | EP3C40F780C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $99.95 | $139.50 |
| Family | Cyclone III | Cyclone III |
| Series | EP3C40 | β |
| Logic Elements | 39,600 | β |
| Total Memory Bits | 1,161,216 bits (1134 Kbit) | 1,161,216 bits |
| Embedded Memory | M9K blocks, 486 Kbit total (per family datasheet) | β |
| Embedded 18x18 Multipliers | 126 | 126 |
| General Purpose PLLs | 4 | β |
| Global Clock Networks | 20 | β |
| Maximum User I/O Pins | 535 | β |
| Process Technology | 65 nm low-power CMOS | 60 nm TSMC low-power CMOS |
| Package | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F780) |
| Speed Grade | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) | C7 |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | β |
| Supported Memory Interfaces | DDR, DDR2, QDRII SRAM (via dedicated PHY) | β |
| Configuration | Serial (AS) / Parallel (AP) / JTAG | Active Serial / Passive Parallel (JTAG) |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | β |
| Logic Elements (LE) | β | 39,600 |
| Number of Logic Cells | β | 39,600 |
| Number of PLLs | β | 4 |
| User I/O Count | β | 535 |
| I/O Banks | β | 8 |
| Package Dimensions | β | 29 x 29 mm |
| Ball Pitch | β | 1.0 mm |
| Core Voltage (VCCINT) | β | 1.2 V |
| I/O Voltage (VCCIO) | β | 1.2 V to 3.3 V |
| Operating Temperature | β | 0C to +85C (Commercial) |
| MSL Level | β | 3 (168 hours) |