EP3C40F780C8 - Cyclone III FPGA, 40K LEs, 780-FBGA | Intel
MPN: EP3C40F780C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $148.74 | $148.74 |
| 10 | $135.21 | $1,352.10 |
| 100 | $121.8 | $12,180.00 |
| 500 | $110.45 | $55,225.00 |
| 1,000 | $99.95 | $99,950.00 |
EP3C40F780C8 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as memory blocks, multipliers, PLLs, and high-speed transceivers. Within the broader taxonomy, the EP3C40F780C8 sits in the low-power, low-cost segment (Cyclone family) of the programmable logic hierarchy: FPGA -> programmable logic -> logic IC -> semiconductor. The 'drop-in' family pedigree lets designers add parallel processing, custom I/O protocols, and hardware-accelerated DSP without an ASIC redesign.
Key features of the EP3C40F780C8 include four general-purpose PLLs, 20 global clock networks, and support for external memory interfaces such as DDR/DDR2/QDRII SRAM via dedicated PHY blocks. The 780-FBGA package enables 535 user I/O for high pin-count glue-logic, motor-control, and video/display bridging designs. The Cyclone III architecture lowers static and dynamic power compared with earlier Cyclone generations, making the part well-suited to thermally constrained embedded systems.
The Cyclone III fabric combines LUT-based logic with embedded M9K memory blocks and 18x18 multipliers, allowing efficient implementation of finite impulse response (FIR) filters, FFT engines, and Nios II embedded processor subsystems. The high I/O count (535) is a strong fit for parallel buses, camera/display interfaces, and industrial control planes that need many LVCMOS/LVDS lanes.
Typical applications include industrial motor control and factory automation, video surveillance image processing, automotive infotainment prototypes, low-cost software-defined radio front ends, and embedded vision/display bridges. The combination of DSP blocks and abundant logic resources also suits medical imaging pre-processing and portable test and measurement equipment.
Designers should plan thermal management around the 780-FBGA and use Intel's Quartus Prime design software (with the Cyclone III device support installed) for synthesis, place-and-route, and timing closure. A multi-layer PCB with continuous power and ground planes plus proper decoupling is mandatory for signal-integrity on high-toggle-rate pins.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not collected in the manufacturer datasheet, giving engineers a single, citable reference for the EP3C40F780C8.
Drop-in alternatives for EP3C40F780C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40F780C8 (same form factor and footprint) — differing in Process Technology, Speed Grade, Package, Mounting Type, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40F780C8N
✅ Drop-In✓ In Stock
$64.85 / Unit
View Datasheet →EP3C40F780C7N
✅ Drop-In✓ In Stock
$145.4 / Unit
View Datasheet →EP3C40F780C7
✅ Drop-In✓ In Stock
$139.5 / Unit
View Datasheet →EP3C40F780C6N
✅ Drop-In✓ In Stock
$172 / Unit
View Datasheet →EP3C40F780C6
✅ Drop-In✓ In Stock
$142.1 / Unit
View Datasheet →EP3C40F780C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Series | EP3C40 |
| Logic Elements | 39,600 |
| Total Memory Bits | 1,161,216 bits (1134 Kbit) |
| Embedded Memory | M9K blocks, 486 Kbit total (per family datasheet) |
| Embedded 18x18 Multipliers | 126 |
| General Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O Pins | 535 |
| Process Technology | 65 nm low-power CMOS |
| Package | 780-ball FBGA (FineLine BGA) |
| Speed Grade | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) |
| Supported Memory Interfaces | DDR, DDR2, QDRII SRAM (via dedicated PHY) |
| Configuration | Serial (AS) / Parallel (AP) / JTAG |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP3C40F780C8 780-ball fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3C40F780C8 (780-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40F780C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40F780C8 is suitable for 6 applications: Industrial Motor Control and Drive, Video Bridging and Display Controllers, Industrial Communication Gateways, Test and Measurement Front Ends, Low-Cost Software-Defined Radio and DSP, Automotive Infotainment and ADAS Prototypes.
Industrial Motor Control and Drive
The EP3C40F780C8 is well suited to multi-axis field-oriented control (FOC) drives because its 39,600 logic elements and 126 embedded 18x18 multipliers can implement the full FOC loop, encoder decoding, and PWM generation in parallel for three or more axes. The 780-FBGA exposes 535 user I/Os, enough to fan out to multiple gate drivers, isolated current-sense ADCs, and dual-port RAM interfaces to a host MCU or industrial EtherCAT slave controller. The 65 nm low-power Cyclone III process keeps junction temperature manageable inside IP54 enclosures, and the four general-purpose PLLs synthesize the multi-MHz switching frequencies needed for sensorless and resolver-based schemes.
Recommended
Video Bridging and Display Controllers
With 535 LVCMOS/LVDS-capable user I/Os, the EP3C40F780C8 can bridge Camera Link, parallel CMOS sensors, HDMI/DVI, and RGB/TTL LCD panels in a single device. The 126 multipliers accelerate scaling, color-space conversion, and deinterlacing pipelines at 1080p60 rates, while 1.1 Mbits of M9K block RAM buffer scan-line data without external SDRAM. Designers typically pair the part with an external DDR2 memory controller PHY block for frame buffering, taking advantage of Cyclone III's dedicated external-memory interface IP and Intel's validated reference designs for HDMI receivers.
Recommended
Industrial Communication Gateways
The EP3C40F780C8 hosts soft-IP implementations of industrial protocols - PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, and CANopen - alongside a Nios II embedded processor subsystem for protocol stack handling and diagnostics. With 39,600 logic elements plus 126 multipliers the device can run a multi-protocol bridge on a single chip, eliminating external ASSPs. The 780-FBGA's 535 user I/Os accommodate dual Ethernet PHYs, RS-485 transceivers, isolated CAN-FD links, and the multi-bank LVCMOS for parallel-bus expansion.
Recommended
Test and Measurement Front Ends
Portable test instruments and bench-top oscilloscopes leverage the EP3C40F780C8's DSP-rich fabric for FIR/IIR filters, FFT pre-processing, and trigger logic. The 126 embedded 18x18 multipliers support real-time decimation and channelization of high-speed ADC samples, while the M9K memory buffers store pre-trigger waveform data. The abundant user I/O lets designers interface with parallel LVDS ADCs up to ~250 MHz DDR rates - within Cyclone III's validated DDR/DDR2/QDRII PHY capability - without an external ASIC.
Recommended
Low-Cost Software-Defined Radio and DSP
The 126 embedded multipliers and high I/O count of the EP3C40F780C8 make it a workable fabric for narrow-band software-defined radio and DSP front ends (DAB, FM-RDS, two-way radio baseband, and digital audio processing). Cyclone III's lower static power extends useful battery life in portable SDR platforms. The four PLLs derive the multi-rate clocks needed for ADC/DAC synchronization and the digital down/up-conversion pipelines.
Recommended
Automotive Infotainment and ADAS Prototypes
Rapid prototyping of infotainment head units, rear-seat entertainment, and ADAS vision pre-processing is a natural fit for the EP3C40F780C8 thanks to its large logic capacity, abundant LVDS-capable I/Os, and LVCMOS tolerance for legacy automotive buses. The 780-FBGA supports multiple LVDS camera lanes plus CAN/LIN/FlexRay interfaces, and the 65 nm low-power process keeps thermal design straightforward in dash-mounted enclosures. For production programs an automotive-qualified Cyclone III variant (AEC-Q100) or a migration to Cyclone V SoC should be considered.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40F780C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40F780C8N | EP3C40F780C7N | EP3C40F780C7 | EP3C40F780C6N | EP3C40F780C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
| Embedded 18x18 Multipliers | 126 | 126 | 126 | 126 | 126 | 126 |
| User I/O Pins | 535 | 535 | 535 | 535 | 535 | 535 |
| Speed Grade | C8 (commercial) | C8 | C7 (faster) | C7 (faster) | C6 (fastest) | C6 (fastest) |
| Pb-free / RoHS Finish | RoHS compliant (verify finish) | Yes (Pb-free finish) | Yes (Pb-free finish) | Verify per lot | Yes (Pb-free finish) | Verify per lot |
Key Differentiators
- Lowest commercial speed grade (C8) for easier timing closure on first silicon (vs EP3C40F780C6 / EP3C40F780C6N)
- Standard 780-FBGA variant available for legacy inventory pools (vs EP3C40F780C8N)
- 39,600 logic elements with the largest I/O count (535) in the Cyclone III family at this density (vs EP3C25F324C8N (24K LEs) and EP3C120F780C8N (120K LEs))
Design Notes
The 780-FBGA of the EP3C40F780C8 requires a multi-layer PCB (typically 6-8 layers) with matched-impedance routing and continuous power/ground reference planes. Use the Altera/Intel pin-out file in Quartus Prime to assign banks and verify LVDS/LVCMOS pair placement before layout. Decoupling: place a 100 nF X7R capacitor within ~3 mm of every VCCINT/VCCIO ball, with bulk 10-47 uF tantalum or polymer capacitors at each supply rail. Maintain the recommended reflow profile per Intel's Cyclone III packaging guidelines to avoid BGA joint defects (warping, head-in-pillow).
Place the configuration device (EPCS or compatible serial flash) within 2-3 cm of the FPGA's MSEL/AS-data pins, and route the JTAG chain with stubs avoided - daisy-chain TMS and TCK to reduce reflections. For high-toggle-rate LVDS pairs use length-matched within 150 ps and keep reference-plane continuity under the entire pair. Cyclone III PLL analog supplies (VCCA_PLL) must be filtered with an LC network as documented in the device handbook, and the PLL ground pins tied to a quiet ground island.
Estimated: at high toggle rates (60-80% of 39,600 LEs switching at 200 MHz) the EP3C40F780C8's 780-FBGA may dissipate 3-5 W depending on utilization; the package's theta_JA is approximately 12-15 C/W with a 4-layer JEDEC test board and adequate thermal vias in the BGA land pattern. Designers should populate thermal vias under the die-flag ball matrix and provide at least 25 sq cm of continuous ground plane on the top layer for heat-spreading. Always measure junction temperature with the on-chip temperature-sensing diode under worst-case firmware load before finalizing the cooling solution.
Compliance Information
RoHS compliance per Intel/Altera product declaration; the N suffix guarantees Pb-free terminal finish. Cyclone III family material declarations confirm halogen-free status. Not AEC-Q100 qualified; for automotive AEC-Q100 programs use the dedicated automotive Cyclone III variants.
