EP3C40F780C8 vs EP3C40F780I8N Comparison

Detailed side-by-side comparison of EP3C40F780C8 by Intel and EP3C40F780I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C40F780C8 EP3C40F780I8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $99.95 $192.00
Family Cyclone III Cyclone III
Series EP3C40 β€”
Logic Elements 39,600 β€”
Total Memory Bits 1,161,216 bits (1134 Kbit) β€”
Embedded Memory M9K blocks, 486 Kbit total (per family datasheet) β€”
Embedded 18x18 Multipliers 126 β€”
General Purpose PLLs 4 β€”
Global Clock Networks 20 β€”
Maximum User I/O Pins 535 β€”
Process Technology 65 nm low-power CMOS TSMC 65 nm low-power CMOS
Package 780-ball FBGA (FineLine BGA) 780-ball FBGA (F780)
Speed Grade C8 (commercial, -40C to +85C operating range per 'C' designator family convention) β€”
User I/O Banks [DATA_NEEDED: user I/O bank count] β€”
Supported Memory Interfaces DDR, DDR2, QDRII SRAM (via dedicated PHY) β€”
Configuration Serial (AS) / Parallel (AP) / JTAG β€”
RoHS Status Compliant Compliant
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Device Logic Elements β€” 39,600
Logic Array Blocks (LABs/CLBs) β€” 2,475
Embedded Memory (bits) β€” 1,161,216
Embedded Memory (Kbits) β€” 1,134
Embedded Multipliers (18x18) β€” 126
Number of PLLs β€” 4
User I/O Pins β€” 535
I/O Banks β€” 20
Nominal Core Supply Voltage β€” 1.2 V (1.15 V to 1.25 V)
Package Ball Pitch β€” 1.0 mm
Operating Temperature Grade β€” Industrial (-40 Β°C to +100 Β°C junction)
Configuration Modes β€” Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel
MSL Level β€” 3

Datasheets & Resources

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