EP3C40F780C8N vs EP3C40F780C6N Comparison
Detailed side-by-side comparison of EP3C40F780C8N by Intel and EP3C40F780C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C8N | EP3C40F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $64.85 | $172.00 |
| Series | Cycloneยฎ III | โ |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | โ |
| Total Memory Bits | 1,161,216 bits | โ |
| Number of LABs/CLBs | 2,475 | โ |
| Embedded Memory Blocks | M9K x 126 | โ |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | โ |
| Number of PLLs | 4 | โ |
| Maximum User I/Os | 535 | โ |
| Number of I/O Banks | 9 | โ |
| Core Voltage | 1.15V to 1.25V | 1.2 V |
| Operating Temperature | 0ยฐC to +85ยฐC (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 8 (C8) | 6 (commercial) |
| Package | 780-ball FBGA, 1.0mm pitch | 780-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (FBGA) |
| Process Technology | 65nm TSMC low-power | 60 nm CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | โ |
| RoHS Status | Compliant | Compliant |
| Logic Elements | โ | 39,600 |
| Embedded Memory Bits | โ | 1,161,216 |
| Embedded Memory (Kbytes) | โ | 113 |
| M9K Memory Blocks | โ | 126 |
| Logic Array Blocks (LABs) | โ | 4,065 |
| Maximum User I/O Pins | โ | 535 |
| PLLs | โ | 4 |
| Package Dimensions | โ | 29 x 29 mm |
| Ball Pitch | โ | 1.0 mm |
| Package Height | โ | 2.6 mm |
| Lead Free | โ | Yes |
| Configuration Method | โ | SRAM, JTAG via USB-Blaster |