EP3C40F780C8N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel
MPN: EP3C40F780C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87.5 | $875.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $71.4 | $35,700.00 |
| 1,000 | $64.85 | $64,850.00 |
EP3C40F780C8N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can re-program in the field to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven processors: unlike ASICs they require no fabrication mask, and unlike microcontrollers they execute logic in dedicated hardware rather than sequential firmware. Cyclone III belongs to Intel's low-cost, low-power FPGA family, succeeding Cyclone II with a 65nm process that drops static power roughly 50% and dynamic core power roughly 25%, while adding hardware multipliers and a richer memory hierarchy.
Key features include 126 embedded 18x18 multipliers (up to 396 9x9 multipliers), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM, QDRII SRAM, and RLDRAM II. The device offers 20 global clock networks, 535 maximum user I/Os arranged in 9 I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, plus configuration via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes.
Architecturally the EP3C40F780C8N uses a 65nm TSMC low-power process, an M9K memory block tile of 9 Kbit each (with parity), and dedicated hardware multiplier blocks routed through adjacent logic array blocks (LABs) of 16 LEs each. The C8 speed bin is the slowest commercial Cyclone III grade and trades fMAX for cost reduction in non-timing-critical designs.
Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, automotive infotainment subsystems, low-cost software-defined radio front-ends, and consumer display controllers. The combination of hardware multipliers and embedded memory makes it well suited to digital signal processing (DSP) and protocol bridging tasks.
When designing with the EP3C40F780C8N, ensure 1.15V-1.25V core and 2.5V/3.3V I/O supplies are properly decoupled with 100nF + 10uF ceramic caps near each supply pin, route all global clocks through PLL outputs where possible, and confirm PCB BGA escape routing supports 1.0mm ball pitch microvia stacks.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III/IV family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP3C40F780C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40F780C8N (same form factor and footprint) — differing in Process Technology, Speed Grade, Package, Operating Temperature, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40F780C7N
✅ Drop-In✓ In Stock
$145.4 / Unit
View Datasheet →EP3C40F780I7N
✅ Drop-In✓ In Stock
$92.5 / Unit
View Datasheet →EP3C40F780C6N
✅ Drop-In✓ In Stock
$172 / Unit
View Datasheet →EP3C40F780C8
✅ Drop-In✓ In Stock
$99.95 / Unit
View Datasheet →EP3C120F780C8N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP4CE40F780C8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C40F780C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone® III |
| Family | Cyclone III |
| Logic Elements (LE) | 39,600 |
| Total Memory Bits | 1,161,216 bits |
| Number of LABs/CLBs | 2,475 |
| Embedded Memory Blocks | M9K x 126 |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) |
| Number of PLLs | 4 |
| Maximum User I/Os | 535 |
| Number of I/O Banks | 9 |
| Core Voltage | 1.15V to 1.25V |
| Operating Temperature | 0°C to +85°C (Commercial) |
| Speed Grade | 8 (C8) |
| Package | 780-ball FBGA, 1.0mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | 65nm TSMC low-power |
| Configuration Modes | AS, PS, FPP, JTAG |
| RoHS Status | Compliant |
EP3C40F780C8N 780-ball fbga, 1.0mm pitch Pin Configuration Guide
Pin configuration for EP3C40F780C8N (780-ball fbga, 1.0mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40F780C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40F780C8N is suitable for 7 applications: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Front-End, Automotive Infotainment Subsystem, Industrial Communication Protocol Bridging, Consumer Display Controller, Test and Measurement Instrumentation.
Industrial Motor Control
The EP3C40F780C8N fits industrial motor control with 39,600 LEs enough for multi-axis FOC field-oriented control loops, 126 hardware 18x18 multipliers accelerating Clarke/Park transforms and SVPWM modulators, and 4 PLLs for synchronized PWM carrier generation. With 535 user I/Os the device handles QEI encoder inputs, resolver feedback, gate driver signals, and Modbus/CAN interfaces in a single chip. The commercial 0-85C grade suits enclosure environments with derating, and the 780-FBGA enables compact inverter PCBs. Designers pair this FPGA with TI C2000 DSP migration paths when algorithmic flexibility outweighs the DSP throughput limit.
Recommended
Video Surveillance and Image Processing
The EP3C40F780C8N is well suited to video surveillance and image processing pipelines because the 126 hardware 18x18 multipliers run Sobel, Laplacian, and FFT operations in real time at VGA/720p resolution, and 1.16 Mbit embedded memory provides line buffers for deinterlacing and noise reduction. The 535 I/Os accept parallel BT.656, LVDS, and MIPI-CSI (with external bridge) sensor inputs while supporting HDMI/DVI output through TMDS. The Cyclone III C8 grade is fast enough for 30 fps processing at moderate pixel rates, and the 780-FBGA packages fit compact camera PCBAs. Designers use the Video and Image Processing Suite (VIP) IP for accelerated 2D convolution.
Recommended
Software-Defined Radio Front-End
The EP3C40F780C8N powers low-cost software-defined radio front-ends where 39,600 LEs implement digital down-conversion (DDC), CIC and FIR filter cascades, and packet framing, while 126 18x18 multipliers handle FFT butterfly computation for spectrum display. The 4 PLLs derive the ADC sampling clock from an external reference and the DAC interpolation clock independently, simplifying dual-domain clocking. With 535 I/Os the device interfaces to high-speed ADCs like the AD9644 and DACs like the AD9122 in LVDS mode. The commercial temp range suits indoor/base-station deployment, and the 780-FBGA ball map supports dense multi-channel PCBAs.
Recommended
Automotive Infotainment Subsystem
The EP3C40F780C8N addresses automotive infotainment subsystems by implementing LVDS display bridges, MOST network controllers, and rear-seat entertainment routing in 39,600 LEs, with 1.16 Mbit memory buffering decoded video frames. The 535 I/Os accept touch-panel inputs, GPS module UART, BT audio I2S, and parallel RGB/TTL display outputs simultaneously. Designers note the C8 commercial 0-85C grade does not meet AEC-Q100 requirements - for true automotive grade the EP3C40 industrial variant or migration to Cyclone V must be specified. The 780-FBGA package suits head-unit mainboards with controlled thermal management.
Recommended
Industrial Communication Protocol Bridging
The EP3C40F780C8N handles multi-protocol industrial bridging - converting between PROFINET, EtherCAT, EtherNet/IP, Modbus TCP, and CANopen - within 39,600 LEs, while the 4 PLLs provide independent clock domains for each physical interface. The 535 I/Os accommodate multi-port MII/RGMII PHY connections, RS-485 transceivers, and CAN controllers simultaneously. The M9K memory blocks queue packets per protocol and the 126 multipliers accelerate CRC and checksum computation. The 780-FBGA enables compact industrial gateway PCBs and the commercial temp range suits factory enclosure environments with air cooling.
Recommended
Consumer Display Controller
The EP3C40F780C8N implements consumer display controllers for digital signage and kiosk applications where 39,600 LEs run HDMI receivers, multi-layer alpha compositors, and frame-rate conversion logic at 1080p60. The 535 I/Os interface to DDR2 SDRAM frame buffers, support parallel LVDS panel outputs, and provide touch-screen I2C/SPI channels. Designers use the 1.16 Mbit embedded memory for sprite caches and lookup tables, and the 4 PLLs derive pixel clocks at 148.5 MHz. The commercial 0-85C range fits kiosk enclosures and the 780-FBGA enables slim mainboard designs.
Recommended
Test and Measurement Instrumentation
The EP3C40F780C8N drives test and measurement instrumentation including protocol analyzers, logic analyzer capture cards, and arbitrary waveform generators where 39,600 LEs implement stimulus generation, response capture, and protocol decoding. The 126 hardware multipliers accelerate FFT-based spectrum analysis and digital filtering at sample rates up to 200 MSPS. The 535 I/Os accept parallel probe data from multiple channels while driving high-speed DACs for stimulus. The 4 PLLs generate multiple precise test frequencies and the commercial temp range suits benchtop equipment. Designers note that for production a quote-based price should be requested.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40F780C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40F780C7N | EP3C40F780I7N | EP3C40F780C6N | EP3C40F780C8 | EP3C120F780C8N | EP4CE40F780C8N |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE | 39,600 LE | 119,088 LE | 39,600 LE |
| Memory Bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 3,888,096 bits | 2,340 Kbits |
| Maximum User I/Os | 535 | 535 | 535 | 535 | 535 | 535 | 532 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | C8 (slowest) | C7 (faster) | I7 (faster) | C6 (fastest) | C8 (same) | C8 (same) | C8 (same) |
| Temperature Grade | Commercial 0°C to +85°C | Commercial | Industrial -40°C to +100°C | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 65nm | 65nm | 65nm | 65nm | 65nm | 65nm | 60nm |
| Series | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone IV E |
Key Differentiators
- Lowest-cost Cyclone III speed grade in same footprint (vs EP3C40F780C7N)
- Identical pin map but 3x logic in same 780-FBGA (vs EP3C120F780C8N)
- Cyclone IV E migration path with same package (vs EP4CE40F780C8N)
Design Notes
Estimated: The EP3C40F780C8N requires four separate supply rails - VCCINT (1.15-1.25V core), VCCAUX (2.5V PLL/auxiliary), VCCIO (1.2V-3.3V I/O banks, each bank independently configurable), and a 3.3V or 2.5V configuration supply. Total quiescent power at 100% resource utilization in a typical 25°C ambient is approximately 1.5W-2.5W. Designers should place 100nF ceramic decoupling caps within 5mm of every supply pin and at least one 10uF bulk cap per rail. Failure to properly decouple the VCCAUX rail causes PLL jitter, the most common power-related design flaw.
The 780-FBGA package uses 1.0mm ball pitch, which requires microvia or via-in-pad PCB technology for inner-layer escape routing. Outer-layer escape uses 0.5mm-wide traces between pads. Layer stackup should be at least 8 layers: signal-GND-signal-signal-PWR-signal-signal-GND-signal, with thin dielectric (0.1mm) between adjacent signal layers to maintain 50-ohm controlled impedance. Differential pairs for LVDS/DQS must be length-matched within 50 mil. Use 0201 or 0402 size decoupling caps to fit between BGA balls.
Estimated: Three common pitfalls for the EP3C40F780C8N are (1) tying nCONFIG low during configuration - it must be pulled high to VCCIO of the configuration bank; (2) leaving JTAG TCK floating - must be pulled to a defined logic level through 1-10 kohm; (3) attempting AS configuration without a properly sized EPCS serial flash - EPCS4 (4 Mbit) supports up to 4 Mbit bitstream while larger designs need EPCS16/EPCS64. Misconfigured dual-purpose pins default to inputs but float until enabled - always use the Quartus pin planner to set the correct pin function before place-and-route.
Clock trace layout: route PLL clock input pins (CLK[0..3]) with 50-ohm microstrip or stripline, keep traces shorter than 25mm, and isolate from switching signals with a GND guard trace. Differential DQS groups for DDR memory must be length-matched to within 50 mil between the DQ and DQS lines. Use IBIS models to simulate signal integrity before tape-out - Cyclone III 8 mA drive strength works for most LVTTL/LVCMOS applications but for LVDS, always use the dedicated true-LVDS buffers, not emulated LVDS via resistor networks.
Compliance Information
RoHS compliant per Cyclone III Device Handbook. The Cyclone III family is not AEC-Q100 qualified; for automotive applications, consider the Cyclone V family which provides AEC-Q100 grades. Halogen-free status not explicitly stated in datasheet excerpts - assumed standard for 780-FBGA packaging.
