EP3C40F780C8N vs EP3C40F780I7 Comparison
Detailed side-by-side comparison of EP3C40F780C8N by Intel and EP3C40F780I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C8N | EP3C40F780I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $64.85 | $52.40 |
| Series | Cycloneยฎ III | โ |
| Family | Cyclone III | Cycloneยฎ III |
| Logic Elements (LE) | 39,600 | โ |
| Total Memory Bits | 1,161,216 bits | โ |
| Number of LABs/CLBs | 2,475 | โ |
| Embedded Memory Blocks | M9K x 126 | โ |
| Embedded 18x18 Multipliers | 126 (up to 396 9x9) | โ |
| Number of PLLs | 4 | โ |
| Maximum User I/Os | 535 | 535 |
| Number of I/O Banks | 9 | โ |
| Core Voltage | 1.15V to 1.25V | โ |
| Operating Temperature | 0ยฐC to +85ยฐC (Commercial) | -40C to +100C (industrial, I7) |
| Speed Grade | 8 (C8) | โ |
| Package | 780-ball FBGA, 1.0mm pitch | 780-ball FineLine BGA (F780) |
| Mounting Type | Surface Mount (BGA) | โ |
| Process Technology | 65nm TSMC low-power | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, FPP, JTAG | โ |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LEs) | โ | 39,600 |
| Embedded Memory Bits | โ | 1,161,216 bits |
| M9K Memory Blocks | โ | 234 |
| MLAB Memory Bits | โ | 112,500 bits |
| Embedded Multipliers (18x18) | โ | 126 |
| 9-bit Multiplier Elements | โ | 535 |
| PLLs | โ | 4 |
| Maximum Operating Frequency | โ | 472.5 MHz |
| Core Voltage (VCCINT) | โ | 1.2 V |
| Package Dimensions | โ | [DATA_NEEDED: package dimensions in mm] |
| Configuration Method | โ | JTAG / Active Serial / Passive Serial |
| Toolchain | โ | Quartus II / Quartus Prime |