EP3C55F484C6 vs EP3C55F484C8 Comparison
Detailed side-by-side comparison of EP3C55F484C6 by Intel and EP3C55F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55F484C6 | EP3C55F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $222.00 | $138.40 |
| Family | Cyclone III | โ |
| Series | EP3C55 | โ |
| Logic Elements | 55,856 LE | โ |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | โ |
| Maximum User I/O | 327 | โ |
| Package | 484-FBGA (F484) | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | โ |
| Speed Grade | 6 (commercial) | C8 (commercial, -8) |
| Number of PLLs | 4 | โ |
| Global Clock Networks | 20 | 20 |
| Embedded 18x18 Multipliers | 56 | 312 |
| I/O Banks | 8 | โ |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | โ |
| Configuration | JTAG, AS (EPCS), PS, FPP | โ |
| Mounting Type | Surface Mount (BGA) | โ |
| RoHS Status | Compliant | โ |
| Operating Temperature | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Device Family | โ | Cycloneยฎ III |
| Logic Elements (LEs) | โ | 55,856 |
| Logic Array Blocks (LABs) | โ | 3,491 |
| Embedded Memory Bits | โ | 2,396,160 bits |
| User I/Os | โ | 327 |
| PLLs | โ | 4 |
| Maximum Core Frequency | โ | 472.5 MHz |
| Configuration Modes | โ | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Lead-Free / RoHS | โ | Yes (Pb-free FBGA) |
| Supply Voltage | โ | Core 1.2 V typical, I/O bank dependent |
| I/O Standards Supported | โ | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others |