EP3C55F484C6 - 55K LE Cyclone III FPGA 484-FBGA | Intel / Altera
MPN: EP3C55F484C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $289.18 | $289.18 |
| 10 | $275.5 | $2,755.00 |
| 100 | $258 | $25,800.00 |
| 500 | $240 | $120,000.00 |
| 1,000 | $222 | $222,000.00 |
EP3C55F484C6 Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor containing an array of programmable logic blocks, embedded memory blocks, and programmable interconnect that engineers can customize after manufacturing. Cyclone III belongs to the low-cost FPGA family within Intel's programmable logic hierarchy (FPGA -> programmable logic -> programmable logic device -> semiconductor). It is positioned below higher-end Stratix families and above legacy Cyclone II in power efficiency and density, targeting cost-sensitive volume applications.
Key features of the EP3C55F484C6 include 55,856 logic elements for moderate-complexity digital designs, 2,396,160 bits (approximately 2.4 Mbit) of embedded SRAM organized as M9K blocks, 4 PLLs for clock management, 20 global clock networks, and 56 embedded 18x18 hardware multipliers that accelerate DSP operations. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and the F484 package exposes 327 user I/O balls for high pin-count applications.
Architecturally, Cyclone III FPGAs use a 65 nm TSMC low-power process with static core power of approximately 100 mW at 1.2 V, combined with on-chip voltage regulation and hot-socketing support. The four PLLs support frequency synthesis, phase shifting, and clock deskew across the 20 global networks, while the 18x18 multipliers enable DSP building blocks without consuming general logic resources.
Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment prototypes, communications infrastructure line cards, and consumer display controllers. The combination of moderate density, low power, and a high-I/O BGA package makes the EP3C55 well suited for designs that require substantial user I/O but do not justify the cost of a high-end Stratix device.
When designing with this device, plan I/O bank assignments carefully because the 484-FBGA provides 8 I/O banks with separate VCCIO rails. Decoupling must follow the Quartus II Pin Planner guidelines, and unused pins should be configured as inputs with weak pull-up to avoid floating inputs. JTAG configuration via the EPCS serial configuration device is recommended for volume production.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select between Cyclone III variants and migration paths within the Intel FPGA portfolio.
Drop-in alternatives for EP3C55F484C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F484C6 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, RoHS Status, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F484C7N
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →EP3C55F484C8N
✅ Drop-In✓ In Stock
$58.5 / Unit
View Datasheet →EP3C55F484I7N
✅ Drop-In✓ In Stock
$205.4 / Unit
View Datasheet →EP3C40F484C8N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C55F484C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Series | EP3C55 |
| Logic Elements | 55,856 LE |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) |
| Maximum User I/O | 327 |
| Package | 484-FBGA (F484) |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | 6 (commercial) |
| Number of PLLs | 4 |
| Global Clock Networks | 20 |
| Embedded 18x18 Multipliers | 56 |
| I/O Banks | 8 |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration | JTAG, AS (EPCS), PS, FPP |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Operating Temperature | 0C to +85C (commercial) |
EP3C55F484C6 484-fbga (f484) Pin Configuration Guide
Pin configuration for EP3C55F484C6 (484-fbga (f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55F484C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55F484C6 is suitable for 7 applications: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing, Automotive Infotainment Prototypes, Communications Line Card Bridging, Consumer Display Controllers, DSP and Software-Defined Instrumentation, Educational FPGA Development Platforms.
Industrial Motor Control and Factory Automation
The EP3C55F484C6 fits industrial motor control because its 55,856 logic elements and 56 embedded 18x18 multipliers handle multi-axis field-oriented control (FOC) algorithms and encoder interfaces in a single chip. The 327 user I/O in the F484 BGA package provides sufficient pins for multi-axis PWM outputs, quadrature decoder inputs, and EtherCAT or CANopen links, eliminating the need for an external DSP. The 1.2 V core and 65 nm low-power process keep dissipation under typical 100 mA core load, simplifying thermal design in enclosed control cabinets. Designers can use the four PLLs to derive multiple switching frequencies from a single crystal, and the M9K memory blocks absorb the line-buffer and lookup-table storage needed for sinusoidal commutation. Combined with commercial temperature grade and lead-free 484-FBGA packaging, the EP3C55F484C6 is a reliable, cost-optimized controller for servo drives, AC inverter stages, and PLC co-processors.
Recommended
Video Surveillance and Image Processing
The EP3C55F484C6 is well matched to multi-channel video surveillance because its 2.4 Mbit of embedded M9K SRAM stores at least one full D1 frame line per channel, while the 56 embedded 18x18 multipliers accelerate 2D convolution, motion estimation, and H.264 preprocessing in real time. The 327 user I/O balls accommodate parallel ITU-R BT.656 video buses from multiple camera decoders and a host processor interface. Designers typically instantiate DDR/DDR2 controllers in the FPGA fabric to handle frame buffering, leveraging the four PLLs for memory and pixel clock synthesis. The 1.2 V core and LVDS support simplify connection to megapixel image sensors, while the 484-FBGA package keeps the PCB footprint compact for dome-camera and DVR chassis designs.
Recommended
Automotive Infotainment Prototypes
The EP3C55F484C6 suits automotive infotainment prototypes where LVDS, LVCMOS, and parallel RGB display interfaces must coexist with CAN, LIN, and MOST network bridges. The 327 user I/O support multi-display output, touch-screen digitizer input, GPS UART links, and AM/FM tuner data paths within a single chip, reducing BOM cost. The four PLLs synthesize pixel clocks, audio clocks, and bus clocks from a common reference, eliminating external oscillator trees. The 65 nm process and 1.2 V core ensure low power dissipation suitable for always-on head-unit controllers, while the commercial temperature range is adequate for cabin-mounted prototypes. Designers migrating to production should consider the industrial EP3C55F484I7N variant for AEC-Q100-aligned thermal stress.
Recommended
Communications Line Card Bridging
The EP3C55F484C6 is used in communications line cards for protocol bridging, traffic shaping, and SERDES-light interconnects between backplanes and PHY devices. Its 56 multipliers and 2.4 Mbit embedded memory implement small packet buffers, CRC engines, and HDLC/PPP framers without external logic. The 327 I/O balls allow direct connection to multiple SGMII, GMII, or SPI-4.2 PHY interfaces, while the 20 global clock networks distribute the recovered clocks with low skew across the fabric. The 484-FBGA package supports high-density board layouts required for ATCA or microTCA line cards. Designers can use the configuration options (JTAG, AS, PS, FPP) to match the platform's boot requirements and pair the FPGA with EPCS serial configuration memory for in-system reprogrammability.
Recommended
Consumer Display Controllers
The EP3C55F484C6 fits consumer display controllers where it must drive multi-standard LCD or OLED panels from HDMI, DisplayPort, or LVDS sources. The device's LVDS and LVPECL support directly drives panel timing controllers without external drivers, and the 327 user I/O accommodate dual-channel LVDS, backlight PWM, I2C/SPI touch interfaces, and audio I2S buses in parallel. Designers use the four on-chip PLLs to derive pixel clocks from arbitrary input frame rates and to deskew source-synchronous data, while the M9K memory blocks implement line buffers and gamma correction LUTs. The 1.2 V core keeps active power low enough for fanless set-top box enclosures, and the Cyclone III device family has mature reference designs for full HD 1080p60 timing controllers.
Recommended
DSP and Software-Defined Instrumentation
The EP3C55F484C6 supports software-defined instrumentation because its 56 embedded 18x18 multipliers enable fixed-point FFT, FIR filtering, and digital down-conversion in the FPGA fabric, replacing dedicated DSP chips. The 2.4 Mbit embedded memory holds FFT windows and coefficient tables, while the 327 I/O pins stream digitized ADC data into the device at LVDS rates and forward processed results over USB or Ethernet. The four PLLs synthesize ADC sample clocks and IF clocks from a single reference, and the 20 global clock networks keep multi-channel sample alignment within sub-nanosecond skew. The 484-FBGA package supports compact bench-instrument form factors, and the Cyclone III family is supported by mature DSP Builder and Simulink HDL coder toolchains for rapid algorithm development.
Recommended
Educational FPGA Development Platforms
The EP3C55F484C6 is widely deployed in educational development boards because its 55,856 logic elements balance density and cost, allowing students to implement RISC-V cores, video pipelines, and custom peripherals in a single device. The 327 user I/O connect to on-board LEDs, switches, character LCDs, VGA or HDMI outputs, and PMOD expansion headers without external muxes. The 484-FBGA package fits the standard 19 mm x 19 mm board footprint used in most university lab kits, and the four PLLs drive any clock frequency the curriculum requires. Quartus II Web Edition (free) fully supports the Cyclone III family, allowing students to design, simulate, and program the device without licensing costs.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F484C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F484C7N | EP3C55F484C8N | EP3C55F484I7N | EP3C40F484C8N |
|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 55,856 LE | 55,856 LE (same die) | 55,856 LE (same die) | 55,856 LE (same die) | 39,600 LE (-29%) |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 1,161,216 bits (-51%) |
| Speed Grade | 6 (commercial) | 7 (commercial, faster) | 8 (commercial, fastest) | 7 (industrial) | 8 (commercial) |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Maximum User I/O | 327 | 327 (same) | 327 (same) | 327 (same) | 331 (+1%) |
| Embedded 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 56 (same) | 36 (-36%) |
Key Differentiators
- Mid-density sweet spot of the Cyclone III family (vs EP3C40F484C8N)
- Industrial-temperature drop-in available in identical F484 package (vs EP3C55F484I7N)
- Faster speed grade options in same footprint (vs EP3C55F484C8N)
Design Notes
The 484-FBGA FineLine BGA package uses a 1.0 mm ball pitch. PCB design requires 4-layer stack-up minimum with continuous ground plane under the BGA, microvia or via-in-pad for the breakout, and 0.5 mm trace width/spacing in the fanout region. Use the Intel/Altera Cyclone III F484 pin connection guidelines and the Quartus II Fitter pin planner to assign differential pairs before layout, since automatic placement may exceed skew budgets on LVDS pairs.
Cyclone III requires three supply rails: VCCINT (1.2 V core), VCCIO (per-bank, 1.2 V to 3.3 V), and VCCAUX (2.5 V). Decoupling must include 0.1 uF and 0.01 uF capacitors per power pin group, plus bulk capacitors (10 uF to 100 uF) at each regulator output. Power sequencing is not required, but VCCINT should rise monotonically. Estimated: at 100 MHz core clock, typical core current is approximately 500 mA, so plan thermal dissipation accordingly.
Do not leave JTAG TCK floating during configuration - tie to GND through a 1 kohm resistor if unused, otherwise noise can spuriously initiate configuration. Always set unused pins to 'As input tri-stated with weak pull-up' in the Quartus device options to avoid floating inputs drawing shoot-through current. Verify configuration mode (AS, PS, FPP, JTAG) matches the EPCS serial flash or external host before programming, otherwise the device will fail to configure silently.
Group I/O pins by bank before PCB layout to minimize VCCIO plane splits. Each of the 8 banks on the F484 has independent VCCIO rails; place the regulator for each bank within 25 mm of the bank power balls to avoid IR drop. Place the 50 MHz or 100 MHz reference crystal within 5 mm of the CLK input pins and route the differential clock traces with 50 ohm controlled impedance and length matching within 25 mils.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - choose EP3C55F484I7N for industrial temperature applications. Pb-free finish confirmed by 'N' suffix in C7N/C8N/I7N variants.
