EP3C55F484C8 vs EP3C55F484C6 Comparison

Detailed side-by-side comparison of EP3C55F484C8 by Intel and EP3C55F484C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C55F484C8 EP3C55F484C6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $138.40 $222.00
Device Family Cycloneยฎ III โ€”
Logic Elements (LEs) 55,856 โ€”
Logic Array Blocks (LABs) 3,491 โ€”
Embedded Memory Bits 2,396,160 bits โ€”
Embedded 18x18 Multipliers 312 56
User I/Os 327 โ€”
PLLs 4 โ€”
Global Clock Networks 20 20
Maximum Core Frequency 472.5 MHz โ€”
Process Technology 65 nm low-power CMOS 65 nm low-power CMOS
Package 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height 484-FBGA (F484)
Speed Grade C8 (commercial, -8) 6 (commercial)
Operating Temperature Commercial (0C to +85C) 0C to +85C (commercial)
Configuration Modes JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) โ€”
Lead-Free / RoHS Yes (Pb-free FBGA) โ€”
Supply Voltage Core 1.2 V typical, I/O bank dependent โ€”
I/O Standards Supported LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others โ€”
Family โ€” Cyclone III
Series โ€” EP3C55
Logic Elements โ€” 55,856 LE
Embedded Memory โ€” 2,396,160 bits (2.4 Mbit)
Maximum User I/O โ€” 327
Core Voltage โ€” 1.2 V
Number of PLLs โ€” 4
I/O Banks โ€” 8
Supported I/O Standards โ€” LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration โ€” JTAG, AS (EPCS), PS, FPP
Mounting Type โ€” Surface Mount (BGA)
RoHS Status โ€” Compliant

Datasheets & Resources

Browse All Products Create BOM Request Quote