EP3C55F780C7N vs EP3C55F780I8N Comparison
Detailed side-by-side comparison of EP3C55F780C7N by Intel and EP3C55F780I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55F780C7N | EP3C55F780I8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $138.31 | $52.90 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | β |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | β |
| Embedded Memory Blocks | 312 M9K blocks | β |
| Embedded Multipliers | 156 (18 x 18) | β |
| User I/O Count | 377 | β |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | β |
| Process Technology | 65 nm low-power CMOS | Low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | β |
| Operating Temperature | 0C to +85C (commercial, C7 speed grade) | β |
| Package | 780-ball FineLine BGA | 780-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Speed Grade | 7 | β |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LEs) | β | 55,856 |
| Logic Array Blocks (LABs) | β | 3,491 |
| Embedded Memory (M9K blocks) | β | 234 Kbits total |
| Embedded 18x18 Multipliers | β | 156 |
| Maximum User I/Os | β | 377 |
| Core Supply Voltage | β | 1.15 V to 1.25 V (nominal 1.2 V) |
| Mounting Type | β | Surface Mount |
| Operating Temperature (Industrial) | β | -40C to +100C |
| Configuration Method | β | JTAG / Active Serial / Passive Serial / Fast Passive Parallel |