EP3C55F780I8N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel
MPN: EP3C55F780I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $78.2 | $782.00 |
| 50 | $68.4 | $3,420.00 |
| 100 | $61.75 | $6,175.00 |
| 500 | $52.9 | $26,450.00 |
EP3C55F780I8N Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), embedded memory, and programmable interconnect. FPGAs sit within the broader hierarchy: programmable logic device (PLD) -> FPGA -> semiconductor -> integrated circuit. Compared with fixed-function ASICs, FPGAs offer hardware-level parallelism, in-system reconfigurability, and fast time-to-market, which is why they dominate prototyping, DSP, video processing, and industrial control designs.
Key features include up to 234 Kbits of embedded RAM (M9K blocks), up to 156 hardware multipliers (18x18) for DSP operations, four phase-locked loops (PLLs) for clock management, and 20 global clock networks. The device supports industry-standard I/O standards (LVDS, LVCMOS, SSTL) and exposes up to 377 user I/Os depending on package selection. Configuration is via JTAG or active/passive serial/parallel modes using the built-in decompression and encryption circuitry.
The Cyclone III architecture balances logic density, DSP throughput, and low static power. Its 1.2 V core, on-chip termination, and dynamic power gating enable designs to consume less than 100 mW in many typical configurations. The fabric is supported by Quartus II design software, which provides synthesis, place-and-route, timing analysis, and on-chip debug via SignalTap II.
Typical applications include industrial motor control, video surveillance and image processing, software-defined radio, automotive infotainment, medical instrumentation, and embedded DSP. With its combination of logic capacity and embedded multipliers, the EP3C55 can absorb multiple parallel processing functions onto a single device, replacing discrete DSPs and glue logic.
When designing, allocate I/O banks carefully to avoid mixing incompatible voltage standards on the same bank, and verify that the Quartus II fitter can close timing before committing the PCB layout. A JTAG header must be brought out to allow in-system programming.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Altera Cyclone III family, and practical design notes not all found in the manufacturer datasheet.
Drop-in alternatives for EP3C55F780I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F780I8N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Family, Embedded 18x18 Multipliers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F780I7N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP3C55F780C8N
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →EP3C55F780C7N
✅ Drop-In✓ In Stock
$138.31 / Unit
View Datasheet →EP3C120F780I7N
✅ Drop-In✓ In Stock
$198.45 / Unit
View Datasheet →EP3C55F780I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LEs) | 55,856 |
| Logic Array Blocks (LABs) | 3,491 |
| Embedded Memory (M9K blocks) | 234 Kbits total |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/Os | 377 |
| Core Supply Voltage | 1.15 V to 1.25 V (nominal 1.2 V) |
| Process Technology | Low-power CMOS |
| Package | 780-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature (Industrial) | -40C to +100C |
| Configuration Method | JTAG / Active Serial / Passive Serial / Fast Passive Parallel |
| RoHS Status | Compliant |
EP3C55F780I8N 780-ball fbga (fineline bga), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP3C55F780I8N (780-ball fbga (fineline bga), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55F780I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55F780I8N is suitable for 6 applications: Industrial Motor Control, Video Surveillance / Image Processing, Software Defined Radio (SDR) Baseband, Automotive Infotainment / Telematics, Medical Instrumentation / Patient Monitoring, Industrial Automation / PLC Backplane.
Industrial Motor Control
The EP3C55F780I8N's 156 18x18 hardware multipliers and 55,856 LEs are well matched to multi-axis field-oriented control (FOC) loops, where each motor axis typically consumes 20-30 multipliers for Park/Clarke transforms and PI regulators. Placing the FPGA between the MCU and the power stage, the device generates center-aligned PWMs at 10-20 kHz with programmable dead-time, samples up to 8 ADC channels for current/voltage feedback, and runs encoder or resolver decoding in hardware. The industrial -40C to +100C temperature grade supports factory-floor deployment. Power dissipation is dominated by dynamic switching at the I/O banks, not the core fabric, which keeps total board power well below 5 W with proper decoupling.
Recommended
Video Surveillance / Image Processing
The EP3C55F780I8N can ingest two parallel ITU-R BT.656 / parallel CMOS sensor streams at 1080p30, run Sobel/median filter pipelines in real time, and output HDMI or LVDS to a local display or Ethernet PHY. Each pipeline pixel at 148 MHz consumes roughly 1 LE per bit of internal datapath, and the 156 embedded multipliers accelerate 3x3 convolution and motion estimation kernels. The 377 user I/Os accommodate 24-bit RGB buses plus DDR2 memory interface for frame buffering. The 1.2 V core keeps dynamic power low enough to allow fanless operation in a sealed dome camera enclosure.
Recommended
Software Defined Radio (SDR) Baseband
The EP3C55F780I8N's 156 18x18 multipliers handle 16-bit complex multiplications needed for digital down-conversion (DDC) and digital up-conversion (DUC) at sample rates up to ~80 MSPS. Its 3,491 LABs are sufficient for FIR/CIC shaping filters and AGC loops, while the 234 Kbits of M9K memory buffer coefficient tables and intermediate samples. Typical use is a baseband chain between an ADC/DAC and a host processor: the FPGA does the math-intensive front-end, the MCU/Linux side does packet processing. Four PLLs derive the sample clocks and FPGA fabric clocks from a single external reference, simplifying PCB routing.
Recommended
Automotive Infotainment / Telematics
With 55K LEs, 156 multipliers, and an industrial-grade temperature rating, the EP3C55F780I8N handles CAN/LIN bridging, LVDS display processing, GPS baseband assistance, and audio mixing in mid-range head units. The four PLLs regenerate audio clocks (I2S 44.1/48 kHz family), video pixel clocks, and bus clocks from a single crystal, reducing BOM cost. AEC-Q100 is not formally listed for Cyclone III, so this part is best suited for non-safety automotive subsystems (infotainment, telematics) rather than ADAS or body controllers.
Recommended
Medical Instrumentation / Patient Monitoring
The EP3C55F780I8N integrates ECG/EEG front-end filtering, QRS detection, and USB/HMI bridging on a single chip, replacing multiple DSPs and CPLDs. The 156 multipliers run real-time biquad filter chains (typical 50-tap FIR + 6 biquads per channel), while the 234 Kbits of M9K memory buffer raw sample windows. Industrial temperature range supports operating-room ambient conditions, and the 1.2 V core keeps thermal rise low enough for sealed plastic enclosures. JTAG-based programming simplifies field firmware updates for clinical deployments.
Recommended
Industrial Automation / PLC Backplane
The EP3C55F780I8N can act as a soft-PLC or industrial Ethernet gateway (PROFINET, EtherCAT slave) on the factory floor, with the FPGA implementing real-time fieldbus protocols in hardware and exposing a parallel bus to an MCU host. The 377 user I/Os handle 32-bit digital I/O plus RS-485 transceivers, and the four PLLs derive independent clocks for each fieldbus segment. Industrial -40C to +100C operating range and the mature 780-FBGA footprint make this part a long-lifecycle choice for machine builders who need 10+ year parts continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F780I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F780I7N | EP3C55F780C8N | EP3C55F780C7N | EP3C120F780I7N |
|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 55,856 | 55,856 (same) | 55,856 (same) | 55,856 (same) | 119,088 (+113%) |
| Speed Grade | 8 (fastest) | 7 (one bin slower) | 8 (same) | 7 (one bin slower) | 7 (one bin slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (same) |
| Embedded Multipliers (18x18) | 156 | 156 (same) | 156 (same) | 156 (same) | 288 (+85%) |
| Embedded Memory | 234 Kbits (M9K) | 234 Kbits (same) | 234 Kbits (same) | 234 Kbits (same) | 388 Kbits (+66%) |
| PLLs | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
Key Differentiators
- Highest speed grade in the 55K-LE Cyclone III family (vs EP3C55F780I7N)
- Industrial temperature grade for harsh environments (vs EP3C55F780C8N)
- 156 18x18 multipliers vs only 56 in the smaller EP3C25 (vs EP3C25F324I7N)
Design Notes
The Cyclone III core requires a clean 1.2 V supply at up to ~500 mA depending on utilization and clock rate. Use a dedicated LDO or DC-DC converter with at least 20% current headroom, and place 10 uF + 100 nF decoupling within 5 mm of each VCCINT pin group. The I/O banks need separate supplies (VCCIO) per bank, set to 1.2/1.5/1.8/2.5/3.0/3.3 V as required. The analog PLL supply (VCCA_PLL) must be filtered with a ferrite bead and decoupled independently. Estimated: at 50% utilization and 200 MHz fMAX, plan for 350-500 mA on VCCINT; verify with the Quartus II PowerPlay early-estimator.
The 780-FBGA with 1.0 mm ball pitch requires 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Escape routing is tight - allow at least 0.8 mm between BGA pads and the first via. Reference the Intel Cyclone III pin connection guidelines (PCG-01001) before floorplanning, and avoid routing high-speed signals across the BGA's center rows where power/ground vias dominate. A continuous ground plane on layer 2 below the BGA improves signal integrity and thermal dissipation. Estimated: 780-FBGA footprint occupies roughly 20x20 mm with 0.4 mm pad-to-pad spacing inside.
Three common pitfalls with Cyclone III designs: (1) leaving JTAG TCK/TDO/TMS/TDI floating - always bring JTAG to a 2x5 header for in-system programming; (2) forgetting the configuration mode pull-ups (MSEL[3..0] must be tied to VCCIO or GND via 1kΩ resistors per the mode); (3) using the wrong I/O standard for clock inputs - clocks need to be on DIFFIO or DCLK-capable pins per the pin table. Use the Quartus II Pin Planner to validate every I/O assignment before tape-out. Failure to do so is the most common cause of first-PCB prototypes that do not configure.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 is not formally qualified for Cyclone III - use the part only in non-safety automotive subsystems. Halogen-free status not explicitly listed in the public Cyclone III datasheet.
