EP3C5F256C6 vs EP3C5F256C8N Comparison
Detailed side-by-side comparison of EP3C5F256C6 by Intel and EP3C5F256C8N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256C6 | EP3C5F256C8N |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.40 | $19.85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | β |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | β |
| Total Memory Bits | 423,936 bits | β |
| Embedded Memory | M9K blocks (per Cyclone III family) | 423,936 bits |
| Embedded 18x18 Multipliers | 23 | 23 |
| User I/Os | 182 | 182 |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | β |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | β |
| Process Technology | 65 nm CMOS, low-k | 65 nm CMOS, SRAM-based |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | β |
| Package | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA-256) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | 0Β°C to +85Β°C (TJ) |
| Configuration Modes | AS, PS, JTAG | AS, PS, JTAG, Fast Passive Parallel |
| RoHS Status | Compliant (lead-free per FBGA package) | Compliant |
| Device Type | β | FPGA (Field-Programmable Gate Array) |
| Logic Elements (LEs) | β | 5,136 |
| Core Supply Voltage | β | 1.15 V to 1.25 V |
| I/O Standards Supported | β | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| MSL Level | β | [DATA_NEEDED: MSL moisture sensitivity level] |