EP3C5F256C8N - Cyclone III FPGA 5K LEs 256-FBGA | Altera
MPN: EP3C5F256C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $36.5 | $36.50 |
| 10 | $32.85 | $328.50 |
| 100 | $27.4 | $2,740.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $19.85 | $19,850.00 |
EP3C5F256C8N Overview
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and embedded memory/DSP resources that can be re-programmed by the designer after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they offer hardware-level parallelism and deterministic timing while still allowing iterative logic changes. Cyclone III sits in the low-power, low-cost segment of the FPGA hierarchy (FPGA → programmable logic → PLD → digital IC), making it suitable for cost-sensitive, high-volume designs that still need hardware acceleration.
Key features of the EP3C5F256C8N include 182 user I/Os, 4 phase-locked loops (PLLs), 66.5 MHz global clock networks, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device uses SRAM-based configuration cells, allowing unlimited in-system re-programmability. The 65nm process technology delivers an optimal balance of logic density and static power consumption.
Architecturally, the device arranges its 5,136 logic elements into vertically organized Logic Array Blocks (LABs), interconnected by a hierarchical MultiTrack interconnect fabric with low-skew clock distribution. The 23 dedicated 18x18 multipliers enable efficient DSP operations without consuming general-purpose logic resources, supporting applications such as motor control, video processing, and serial protocol bridging.
Typical applications include industrial control and machine networking, video surveillance, low-cost digital signal processing, motor control and encoder interfacing, automotive telematics, serial protocol bridging (UART/SPI/I2C to high-speed interfaces), consumer electronics display controllers, and portable test and measurement equipment. The Cyclone III family's low static power (~0.5mW per LE typical) makes it particularly suitable for thermally constrained or battery-aware designs.
When designing with this device, ensure adequate decoupling on all supply rails and that the configuration mode (AS, PS, JTAG, or Fast Passive Parallel) matches the system's boot strategy. Designers migrating to newer Intel Cyclone families should plan for I/O bank voltage and pin-out differences even when targeting the same FBGA-256 footprint.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not consolidated in the original manufacturer datasheet, giving procurement and engineering teams a single reference for the EP3C5F256C8N.
Drop-in alternatives for EP3C5F256C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5F256C8N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Modes, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5F256C7N
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EP3C5F256C6N
✅ Drop-In✓ In Stock
$18.85 / Unit
View Datasheet →EP3C5F256I7N
✅ Drop-In✓ In Stock
$24 / Unit
View Datasheet →EP3C5F256C8
✅ Drop-In✓ In Stock
$12.3 / Unit
View Datasheet →EP3C10F256C8N
✅ Drop-In✓ In Stock
$15.4 / Unit
View Datasheet →EP3C10F256I7N
✅ Drop-In✓ In Stock
$34.94 / Unit
View Datasheet →EP3C5F256C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Device Type | FPGA (Field-Programmable Gate Array) |
| Logic Elements (LEs) | 5,136 |
| Embedded Memory | 423,936 bits |
| Embedded 18x18 Multipliers | 23 |
| User I/Os | 182 |
| PLLs | 4 |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Operating Temperature (Commercial) | 0°C to +85°C (TJ) |
| Process Technology | 65 nm CMOS, SRAM-based |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP3C5F256C8N 256-ball fineline bga (fbga-256) Pin Configuration Guide
Pin configuration for EP3C5F256C8N (256-ball fineline bga (fbga-256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C5F256C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C5F256C8N is suitable for 6 applications: Industrial Motor Control, Video Surveillance & Image Processing, Serial Protocol Bridging & Connectivity Gateways, Portable Test & Measurement Equipment, Consumer Display Controllers, Automotive Telematics & Infotainment Subsystems.
Industrial Motor Control
The EP3C5F256C8N is well matched to industrial motor control because its 23 dedicated 18x18 multipliers accelerate field-oriented control (FOC) math — Park/Clarke/inverse transforms and PI controllers — without burning general-purpose logic. Its 4 PLLs generate precisely phased PWM carriers for three-phase inverter switching, while the 182 user I/Os accommodate quadrature encoder (QEI), Hall sensors, SSI absolute encoders, and resolver excitation simultaneously. The Cyclone III 65nm process keeps static power low (~0.5mW per LE typical), a key advantage for inverter boards where ambient temperature already runs high near IGBT modules. Designers typically instantiate the Altera MegaFunction PID and PWM IP cores, achieving sub-microsecond control loop latency at 100MHz system clock. The FBGA-256 footprint also gives room for future migration to EP3C10/EP3C16 without board rework.
Recommended
Video Surveillance & Image Processing
For video surveillance and image preprocessing, the EP3C5F256C8N provides enough logic and DSP blocks to implement mid-resolution pipelines (e.g., CIF/D1 sensor streams up to 60fps) including Bayer demosaicing, noise reduction, and edge detection. The 23 hardware 18x18 multipliers accelerate 2D convolution kernels and Sobel filters that would otherwise consume hundreds of LEs each. Its 182 user I/Os accept parallel ITU-R BT.656 / BT.1120 video buses plus DDR2 memory interfaces for frame buffering, while 4 PLLs derive pixel clocks, memory clocks, and Ethernet PHY clocks independently. The 65nm process and commercial temperature grade suit indoor NVR/DVR enclosures. Cyclone III also integrates soft Nios II processor cores, letting designers add on-chip motion-detection analytics. Migration to EP3C16F256C8N is pin-compatible for higher resolution (720p/1080p) designs.
Recommended
Serial Protocol Bridging & Connectivity Gateways
The EP3C5F256C8N excels at serial protocol bridging applications where multiple low-speed UART/SPI/I2C peripherals must be aggregated into high-speed Ethernet, USB, or PCI Express links. Its 5,136 LEs comfortably host a Nios II soft processor plus several custom DMA engines, while the 182 user I/Os accept up to dozens of UART channels, SPI peripherals, and I2C buses simultaneously. The 4 PLLs generate the precise reference clocks required for Ethernet PHYs (RGMII at 125MHz) and USB 2.0 (60MHz ULPI). Industrial gateways built on this device often run real-time Linux or FreeRTOS on Nios II, with the FPGA fabric handling deterministic time-critical I/O. The SRAM-based configuration supports field updates over Ethernet for OTA firmware deployment — valuable for remote asset monitoring.
Recommended
Portable Test & Measurement Equipment
For portable test and measurement instruments, the EP3C5F256C8N's low static power (~0.5mW per LE typical on 65nm Cyclone III) directly extends battery runtime. The 23 hardware 18x18 multipliers execute FFT, FIR, and DDS algorithms at sample rates suitable for audio-bandwidth signal analyzers, while the 423,936 bits of M9K embedded memory buffer acquisition windows without external SRAM. The 4 PLLs derive ADC sampling clocks, DAC update clocks, and USB reference clocks with sub-100ps jitter, which is critical for SFDR performance. The 182 user I/Os accept LVDS ADC data buses, trigger inputs, and front-panel GPIOs, while the FBGA-256 footprint leaves room for a compact PCB. Designers migrating to battery-aware platforms should evaluate Cyclone IV E (EP4CE6) for further static power reduction.
Recommended
Consumer Display Controllers
Consumer display controller applications benefit from the EP3C5F256C8N's balance of logic capacity, embedded memory, and high I/O count. The device can implement LCD timing controllers with 60Hz to 144Hz refresh rates, on-the-fly color-space conversion (RGB ↔ YCbCr), and dynamic backlight dimming algorithms. Its 4 PLLs generate LVDS spread-spectrum clock profiles required for EMI compliance in consumer electronics, and the 182 user I/Os accommodate dual-channel LVDS to drive medium-sized panels (up to 1280x1024). The Cyclone III 65nm process enables fanless operation in slim consumer enclosures. Designers can reuse Altera's video IP cores (Scaler, Mixer, Frame-Buffer-Reader) to accelerate time-to-market. The FBGA-256 footprint is compatible with the larger Cyclone III variants (EP3C10/EP3C16) for product-line scalability.
Recommended
Automotive Telematics & Infotainment Subsystems
Automotive telematics and lower-tier infotainment subsystems are well served by the EP3C5F256C8N, particularly where designs require deterministic hardware response alongside a soft processor. The 5,136 LEs host a Nios II/f processor plus custom CAN/LIN/Ethernet MAC controllers, while the 4 PLLs generate CAN-FD bit-timing clocks and 100BASE-T1 reference clocks. The 182 user I/Os accommodate multiple CAN transceivers, LIN buses, and automotive Ethernet PHYs simultaneously. Designers targeting harsher cabin environments should select the EP3C5F256I7N variant, which extends operating junction temperature to the industrial grade (-40 to +100°C). Note that AEC-Q100 qualified variants are not available in Cyclone III — for full automotive qualification, migrate to Cyclone IV or Cyclone 10 LP automotive grades. The FBGA-256 footprint is footprint-compatible across the Cyclone III family for design reuse across vehicle platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5F256C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5F256C7N | EP3C5F256C6N | EP3C5F256I7N | EP3C5F256C8 | EP3C10F256C8N | EP3C10F256I7N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-256 (1.0mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 5,136 | 5,136 (same) | 5,136 (same) | 5,136 (same) | 5,136 (same) | 10,320 (+101%) | 10,320 (+101%) |
| Speed Grade | 8 | 7 (slower Fmax) | 6 (slower Fmax) | 7 (slower Fmax) | 8 (same) | 8 (same) | 7 (slower Fmax) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | ~414 Kbits | ~414 Kbits |
| 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 | 46 (+100%) | 46 (+100%) |
| User I/Os | 182 | 182 | 182 | 182 | 182 | 182 | 182 |
| Operating Temperature | 0 to +85°C (Commercial) | 0 to +85°C (Commercial) | 0 to +85°C (Commercial) | -40 to +100°C (Industrial) | 0 to +85°C (Commercial) | 0 to +85°C (Commercial) | -40 to +100°C (Industrial) |
| RoHS / Lead-Free | Yes (N suffix) | Yes | Yes | Yes | No (lead-bearing) | Yes | Yes |
| Unit Price (1 pc, USD) | 36.50 | ~32 (lower) | ~28 (lowest) | ~45 (industrial premium) | ~30 (legacy non-RoHS) | ~50 (higher density) | ~60 (industrial + higher density) |
Key Differentiators
- Speed grade 8 offers the highest Fmax within the EP3C5 family (vs EP3C5F256C7N)
- Lead-free / RoHS compliant packaging variant (vs EP3C5F256C8)
- Pin-compatible upgrade path to higher-density Cyclone III devices (vs EP3C10F256C8N / EP3C16F256C8N)
Design Notes
EP3C5F256C8N requires separate analog and digital supplies: VCCINT (1.15-1.25V core), VCCA (2.5V PLL analog), VCCIO (1.2-3.3V I/O banks), and VCCPD (3.3V pre-driver). Per Cyclone III handbook decoupling guidance, place 0.1uF X7R ceramic capacitors within 100 mils of every supply pin, plus a 10-100uF bulk tantalum or polymer capacitor on each supply rail. Power-on sequencing requires VCCINT and VCCPD to ramp together; consult the Cyclone III handbook pin connection guidelines for the exact sequence.
Cyclone III FBGA-256 packages have a junction-to-ambient thermal resistance (theta-JA) of approximately 17-22°C/W depending on PCB layer count and airflow (per Cyclone III thermal characterization report). For continuous 100% utilization at full I/O toggle, the device may dissipate 1-2W, requiring thermal vias under the exposed die pad (if present) or copper pours. Industrial-grade EP3C5F256I7N extends junction temperature to +100°C for harsh enclosures.
FBGA-256 uses 1.0mm ball pitch, requiring Class 2 PCB manufacturing. Per IPC-7351 and Altera Cyclone III layout guidelines, use 0.5mm via-in-pad with plugged and plated-over filling for breakout, or dog-bone fanout with 0.2mm trace/space. Power planes must avoid being cut beneath the BGA; use 4 or more PCB layers. Maintain 50 ohm controlled impedance for LVDS pairs and 100 ohm differential for differential clock inputs.
Common pitfalls: (1) Forgetting MSEL[3:0] pull-up/down resistors - these select the configuration mode (AS/PS/JTAG) and must match the design intent at power-up. (2) Failing to add the JTAG TCK pull-down, TMS pull-up per IEEE 1149.1. (3) Driving unused I/O banks with the wrong VCCIO voltage - I/O standards like SSTL require specific VCCIO values. (4) Omitting the POR (power-on reset) delay - Cyclone III requires nCONFIG held low until supplies stabilize.
For multi-Gbps LVDS interfaces, keep LVDS pairs matched to within 50 mils and route them over a continuous ground reference plane. Per Altera Cyclone III LVDS design guide, separate LVDS clocks from data by at least 3x the dielectric thickness (h) to minimize crosstalk. The 4 PLLs each require a dedicated analog ground island for VCCA supply decoupling; do not share analog ground with digital switching returns.
Compliance Information
'N' suffix confirms RoHS lead-free packaging per Altera part numbering convention. Cyclone III family is not AEC-Q100 qualified; for automotive applications migrate to Cyclone IV or Cyclone 10 LP automotive grades. REACH compliance per Altera material declaration.
