EP3C5F256I7N vs EP3C5F256C6 Comparison
Detailed side-by-side comparison of EP3C5F256I7N by Intel and EP3C5F256C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256I7N | EP3C5F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $24.00 | $21.40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | β |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded Multipliers (18x18) | 26 | β |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | β |
| Package | 256-FBGA (FineLine BGA) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +125C (Industrial) | β |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | β |
| Process Technology | TSMC 65nm low-power | 65 nm CMOS, low-k |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | AS, PS, JTAG |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | β |
| RoHS Status | Compliant | Compliant (lead-free per FBGA package) |
| MSL Level | 3 (168 hours) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | β | 5,136 |
| Logic Array Blocks (LABs) | β | 5136 / 342 (per ADatasheet summary) |
| Embedded Memory | β | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | β | 23 |
| User I/Os | β | 182 |
| Global Clock Networks | β | 20 |
| Core Voltage | β | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | β | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | β | 0C to +85C (per device suffix C6) |