EP3C5F256I7N - Cyclone III FPGA, 5K LEs, 256-FBGA | Intel
MPN: EP3C5F256I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $37.67 | $37.67 |
| 10 | $33.9 | $339.00 |
| 100 | $30.13 | $3,013.00 |
| 500 | $26.75 | $13,375.00 |
| 1,000 | $24 | $24,000.00 |
EP3C5F256I7N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that engineers can re-program after manufacture to implement custom digital logic. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), and are distinguished from ASICs by their in-system re-programmability, faster prototyping cycles, and lower upfront NRE costs. The Cyclone III family targets cost-sensitive, high-volume applications where traditional FPGAs were too expensive or power-hungry.
Key technical features include 66 embedded 9-bit multipliers (configurable as 26 18x18 multipliers), 423,936 total RAM bits organized as M9K memory blocks, two PLLs per quadrant for fine-grained clock management, and 1.0V/1.2V core operation with LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports up to 472.5 MHz internal operation and is qualified for industrial temperature range (-40C to +125C).
The Cyclone III architecture separates logic, routing, and dedicated DSP/memory resources into four quadrants, allowing predictable timing closure. Hard IP blocks (PLLs, multipliers, M9K RAMs) reduce logic-element usage and lower power compared to soft implementations, making EP3C5F256I7N well suited to motor control, video processing, and industrial protocol bridging where deterministic performance and low static power are required.
Typical applications include industrial motor control and encoder interfacing, video surveillance image preprocessing, low-cost protocol bridges (UART/SPI/I2C to Ethernet), automotive infotainment sub-systems, and LED display controllers. The 256-FBGA package provides high I/O density in 17x17 mm, suitable for compact PCBs requiring up to 182 user I/Os.
When designing with EP3C5F256I7N, ensure the Quartus II / Quartus Prime toolchain version matches the silicon revision, and follow Intel's recommended decoupling scheme (100 nF + 10 uF per power pin). For multi-rail sequencing, the device does not include an internal POR - use an external supervisor IC. The 256-FBGA requires 1.0 mm pitch, NSMD land pads with 0.4 mm diameter for reliable reflow.
This page synthesizes distributor pricing, drop-in same-package alternatives (all in the 256-FBGA footprint), and practical Quartus toolchain guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP3C5F256I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5F256I7N (same form factor and footprint) β differing in Package, Process Technology, Configuration Modes, RoHS Status, Logic Array Blocks (LABs).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
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View Datasheet βEP3C5F256I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements | 5,136 |
| Total Memory Bits | 423,936 bits |
| Embedded Multipliers (18x18) | 26 |
| PLLs | 2 |
| Maximum User I/Os | 182 |
| Package | 256-FBGA (FineLine BGA) |
| Operating Temperature | -40C to +125C (Industrial) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) |
| Process Technology | TSMC 65nm low-power |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Mounting Type | Surface Mount (BGA) |
EP3C5F256I7N 256-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3C5F256I7N (256-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C5F256I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C5F256I7N is suitable for 7 applications: Industrial Motor Control, Video Surveillance Image Preprocessing, Protocol Bridge / Industrial IoT Gateway, LED Display Controller, Automotive Infotainment Sub-Processor, Medical Patient Monitoring Interface, Software Defined Radio Baseband.
Industrial Motor Control
The EP3C5F256I7N is well suited for industrial motor control applications including BLDC, stepper, and AC induction motor drives. Its 5,136 logic elements are sufficient to implement FOC (Field-Oriented Control) loops, PWM generators, and encoder interfaces such as EnDat or BISS. The 26 embedded 18x18 multipliers accelerate Park/Clarke transforms without consuming logic fabric, while the 182 user I/Os handle multiple encoder channels, Hall sensors, and PWM outputs. The industrial -40C to +125C temperature range matches factory-floor operating conditions. Two PLLs allow precise generation of switching frequencies up to 100 kHz for IGBT gate drivers, with deterministic phase alignment critical for minimizing torque ripple.
Recommended
Video Surveillance Image Preprocessing
The EP3C5F256I7N can perform real-time video preprocessing for IP surveillance cameras, including noise reduction, edge enhancement, and motion detection. Its 5,136 LEs handle 720p video at 30 fps using pipelined architectures, while the 26 multipliers support Sobel edge detection and DCT-based compression previews. The 182 user I/Os accommodate parallel video input from image sensors, DDR memory interfaces for frame buffering, and Ethernet PHY connectivity. The LVDS I/O support enables direct connection to modern CMOS image sensors without external transceivers. Industrial temperature rating supports outdoor camera installations.
Recommended
Protocol Bridge / Industrial IoT Gateway
The EP3C5F256I7N excels as a protocol bridge between industrial fieldbuses (Modbus, Profibus, CAN) and Ethernet/IP networks. Its logic capacity implements multiple UART, SPI, and I2C controllers simultaneously, with the 26 multipliers available for CRC calculation and AES-128 encryption. The 423,936 bits of embedded RAM buffer Ethernet frames and protocol payload data. Two PLLs generate precise clocks for Ethernet PHY at 25 MHz or 50 MHz while maintaining separate timing domains for legacy fieldbus interfaces. Industrial temperature qualification supports cabinet-mounted IoT gateway deployments.
Recommended
LED Display Controller
The EP3C5F256I7N serves as a scan controller for large LED video walls and dot-matrix displays. With 182 user I/Os, the device can drive up to 24 high-current shift register chains in parallel, refreshing 1024+ RGB LEDs per chain. The 5,136 LEs implement gamma correction, color space conversion, and refresh-rate compensation. The 26 hardware multipliers accelerate LED pixel remapping for irregular display geometries. Industrial temperature rating supports outdoor billboard installations. Configuration via JTAG allows in-field firmware updates without removing the display panel from service.
Recommended
Automotive Infotainment Sub-Processor
The EP3C5F256I7N can serve as a sub-processor in automotive infotainment systems, handling audio DSP, CAN bus interface, and rear-seat entertainment display rendering. The 5,136 LEs implement audio mixing and equalization for 4-6 channel systems, while the 26 multipliers support AAC and MP3 decoding. LVDS I/Os connect directly to LCD panels with low EMI. The automotive-qualified EP3C5F256A7N variant shares the same die/package. Low static power consumption (typical 50 mW quiescent) supports always-on infotainment standby modes without draining the vehicle battery.
Recommended
Medical Patient Monitoring Interface
The EP3C5F256I7N provides signal conditioning and data acquisition for portable patient monitoring devices such as pulse oximeters and ECG monitors. Its logic elements implement digital filters for biosignal denoising, while the 26 multipliers accelerate FFT-based heart rate variability analysis. The 182 user I/Os connect to multiple analog front-ends (AFE4490, ADS1292) and a color TFT display. Industrial temperature range supports ambulance and emergency-room environments. Low power consumption extends battery life in portable home-care monitors. The embedded M9K memory blocks store patient data buffers before wireless transmission.
Recommended
Software Defined Radio Baseband
The EP3C5F256I7N implements digital baseband processing for software-defined radio (SDR) platforms operating below 100 MHz bandwidth. The 26 embedded 18x18 multipliers execute FIR filters, channelizers, and digital down-converters for narrowband protocols. Its 5,136 LEs support simple modulation schemes (BPSK, QPSK, FSK) and packet framing. The 423,936 bits of embedded RAM buffer IQ sample streams. Two PLLs generate precise sample clocks for ADC interfaces. The 182 user I/Os accommodate parallel ADC connections, DAC outputs, and host processor interfaces. Industrial temperature range suits outdoor PMR radio deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5F256I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5F256I7 | EP3C5F256C8N | EP3C5F256C7N | EP3C5F256C6N | EP3C5F256A7N | EP3C10F256I7N | EP3C25F256I7N |
|---|---|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Intel | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 10,320 | 24,624 |
| Operating Temperature | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | Automotive | -40C to +125C (Industrial) | -40C to +125C (Industrial) |
| Speed Grade | -7 | -7 | -8 | -7 | -6 | -7 | -7 | -7 |
| Embedded Memory (bits) | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 | 414,720 | 594,432 |
| Embedded 18x18 Multipliers | 26 | 26 | 26 | 26 | 26 | 26 | 46 | 66 |
| Maximum User I/Os | 182 | 182 | 182 | 182 | 182 | 182 | 182 | 156 |
| RoHS Compliance | Yes (Pb-free) | No (SnPb) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Lower-power 65nm process vs older Cyclone II 90nm (vs EP2C5F256I8N (Cyclone II predecessor))
- Highest I/O count in Cyclone III 256-BGA family (vs EP3C16F256I7N (10,320 LEs, same package))
- Lower unit cost than higher-density same-package Cyclone III variants (vs EP3C25F256I7N (24,624 LEs))
Design Notes
The EP3C5F256I7N requires three supply rails: VCCINT (1.2V core, ~250 mA typical), VCCIO (1.2V-3.3V I/O banks, bank-dependent current), and VCCPD (2.5V or 3.3V pre-driver). Per Intel Cyclone III Handbook recommendation, place 100 nF ceramic decoupling within 50 mils of each power pin, plus bulk 10 uF X5R ceramic on each rail within 0.5 inch of the device. Power-on reset (POR) requires VCCINT to reach 0.8V within 100 ms; failure to meet this may corrupt configuration. Use an external TPS3808 voltage supervisor if the upstream regulator has soft-start ramp time exceeding 50 ms.
The 256-FBGA package uses 1.0 mm ball pitch and requires NSMD (Non-Solder Mask Defined) land pads of 0.4 mm diameter on the PCB. Per IPC-7351, the solder mask opening should be 0.55 mm with 0.05 mm mask expansion tolerance. The BGA requires 4-6 mil (0.10-0.15 mm) trace and space rules for signal escape routing on inner layers. Use microvia (0.1 mm laser via) technology for inner-row ball fan-out. Maintain 50-ohm controlled impedance for clock signals (REFCLK, CLK0-CLK15). Reflow profile must follow JEDEC J-STD-020 MSL3 preconditioning at 250C peak temperature.
Do not leave unused I/O pins floating - configure them as inputs with weak pull-up enabled in Quartus to prevent excessive current draw and crosstalk. The configuration mode pins MSEL[3:0] must match the selected configuration scheme (e.g., 0110 for Active Serial EPCS). Cyclone III requires a minimum 2 ms delay between nCONFIG rising edge and CONF_DONE assertion; failure to wait causes configuration timeout. The JTAG TCK pin must not be driven faster than 33 MHz or chain integrity may fail. LVDS I/O requires 100-ohm differential termination at the receiver, not the FPGA pin.
Estimated: At full utilization (90% LEs, 100% multipliers, all I/O toggling at 100 MHz), the EP3C5F256I7N dissipates approximately 1.2W. The 256-FBGA has theta_JA of approximately 22 C/W (with 4-layer JEDEC test board), resulting in a 26C junction temperature rise above ambient. For industrial -40C to +125C operation with 85C ambient, this leaves adequate thermal headroom. In enclosed chassis above 60C ambient, add thermal vias under the central BGA balls and consider forced-air cooling. Do not rely on the FBGA package's plastic mold for heatsink attachment - use the central thermal balls (if exposed pad variant) or PCB copper pour for heat dissipation.
Place the EP3C5F256I7N at least 5 mm from board edges to minimize stress during depanelization. Route all eight global clock networks (CLK0-CLK15) on inner signal layers with ground reference plane above and below for 50-ohm controlled impedance. Avoid routing high-speed signals (DDR, LVDS) over the BGA shadow area on inner layers to minimize via stubs. Keep PLL analog supply (VCCA_PLL) filtered with a ferrite bead and 10 uF + 100 nF capacitor network within 25 mm of the pin. The configuration clock DCLK should be routed away from user I/O to prevent crosstalk during configuration.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified - choose EP3C5F256A7N for automotive applications. JEDEC MSL3 (168 hours floor life) per J-STD-020.
