EP3CLS100F780C7 vs EP3C40F780C7N Comparison

Detailed side-by-side comparison of EP3CLS100F780C7 by Intel and EP3C40F780C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS100F780C7 EP3C40F780C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $632.40 $145.40
Family Cyclone III LS Cyclone III
Logic Elements (LEs) 100,448 β€”
Total RAM Bits 4,451,328 1,161,216 bits
Embedded Memory M9K blocks (488 total, 4,451,328 bits) β€”
Embedded 18x18 Multipliers 66 β€”
Maximum User I/O Pins 413 β€”
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count for EP3CLS100] β€”
Package 780-ball FineLine BGA (FBGA-780) 780-ball FBGA (FineLine BGA)
Package Dimensions 29 mm x 29 mm β€”
Ball Pitch 1.0 mm β€”
Core Supply Voltage (VCCINT) 1.2 V β€”
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) β€”
Process Technology 60 nm low-power CMOS β€”
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG β€”
Bitstream Encryption AES-128 (Cyclone III LS security feature) β€”
Operating Junction Temperature 0C to +85C (commercial, 'C' grade) β€”
RoHS Status Compliant (lead-free FBGA) β€”
Speed Grade 7 (C7) 7 (C7, commercial)
Logic Elements β€” 39,600 LE
Embedded Multipliers β€” 126 (18x18)
User I/Os β€” 535
Process Node β€” 65 nm TSMC low-power
Operating Temperature β€” 0C to +85C (commercial)
Supply Voltage (Core) β€” 1.2 V
Configuration Method β€” JTAG, Active Serial, Passive Serial
PLLs β€” 4
Global Clock Networks β€” 20
Lead-Free / RoHS β€” Yes (N suffix)
Moisture Sensitivity Level β€” MSL3 (per J-STD-020)

Datasheets & Resources

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