EP3CLS100F780C7 - Cyclone III LS FPGA 100K LE 780-FBGA | Intel
MPN: EP3CLS100F780C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $781.6 | $781.60 |
| 10 | $745.5 | $7,455.00 |
| 100 | $695.2 | $69,520.00 |
| 250 | $660 | $165,000.00 |
| 500 | $632.4 | $316,200.00 |
EP3CLS100F780C7 Overview
What is a Cyclone III LS FPGA? Cyclone III LS is the low-power, security-enhanced member of the Cyclone III generation of SRAM-based FPGAs. Compared with the original Cyclone III family, Cyclone III LS devices add advanced bitstream encryption, design separation with side-channel resistance, and improved power efficiency at the same logic capacity. Positioned in the broader Altera/Intel FPGA taxonomy, Cyclone III LS sits below Cyclone IV and Cyclone V but above legacy Cyclone II in capability and below modern Cyclone 10 in process node.
Key features of the EP3CLS100F780C7 include 100,448 logic elements organized into columns and rows of logic array blocks (LABs), 4,451,328 total RAM bits distributed across M9K memory blocks, and 66 dedicated 18x18 hardware multipliers capable of supporting DSP operations at FPGA fabric speeds. The 780-FBGA (FineLine BGA) package measures 29 mm x 29 mm with a 1.0 mm ball pitch, enabling dense PCB routing while remaining compatible with standard 4-layer FR-4 stack-ups. Core supply is 1.2 V with separate VCCIO bank supplies for mixed-voltage I/O.
The device uses a 4-input LUT-based logic element architecture with embedded memory and DSP blocks wired through a multi-track interconnect. Configuration is stored in external SRAM and loaded via active serial (AS), passive serial (PS), or JTAG modes, with on-chip AES-128 bitstream decryption and a design-security block that protects against tamper and side-channel attacks. The Cyclone III LS family is engineered for sub-watt static power, allowing fan-less operation in many use cases.
Typical applications include industrial motor control, video surveillance and image processing bridges, automotive telematics and driver-assist subsystems, communications protocol bridging, and low-cost ASIC prototyping. With 100K logic elements and 4.4 Mbits of RAM, the EP3CLS100F780C7 comfortably implements mid-complexity SoC-class designs including custom RISC-V peripherals, RGMII Ethernet MACs, and LCD/HDMI bridge logic.
When designing with this FPGA, plan power sequencing carefully: 1.2 V core must come up before VCCIO banks, and configuration should not be initiated until all rails are stable. Use Altera Quartus II (or the Intel Quartus Prime Cyclone III device support) for synthesis, place-and-route, and bitstream generation. The 1.0 mm BGA pitch requires NSMD land pattern and ENIG surface finish for reliable reflow.
This page synthesizes distributor pricing across 14 sources, Cyclone III LS family alternatives within the same 780-FBGA footprint, and design notes distilled from the Cyclone III Device Handbook and Cyclone III LS Device Data Sheet - context not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for EP3CLS100F780C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS100F780C7 (same form factor and footprint) β differing in Package, Speed Grade, Logic Elements, Process Technology, Device Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3C120F780C7N
β Drop-Inβ In Stock
$162 / Unit
View Datasheet βEP3C55F780C7N
β Drop-Inβ In Stock
$138.31 / Unit
View Datasheet βEP3C40F780C7N
β Drop-Inβ In Stock
$145.4 / Unit
View Datasheet βEP3C120F780C8N
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP3CLS100F780C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements (LEs) | 100,448 |
| Total RAM Bits | 4,451,328 |
| Embedded Memory | M9K blocks (488 total, 4,451,328 bits) |
| Embedded 18x18 Multipliers | 66 |
| Maximum User I/O Pins | 413 |
| Package | 780-ball FineLine BGA (FBGA-780) |
| Package Dimensions | 29 mm x 29 mm |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage (VCCINT) | 1.2 V |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) |
| Operating Junction Temperature | 0C to +85C (commercial, 'C' grade) |
| RoHS Status | Compliant (lead-free FBGA) |
| Speed Grade | 7 (C7) |
EP3CLS100F780C7 29 mm x 29 mm Pin Configuration Guide
Pin configuration for EP3CLS100F780C7 (29 mm x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS100F780C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS100F780C7 is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing Bridge, Automotive Infotainment and Driver-Assist Subsystems, Communications Protocol Bridge and Custom PHY, Low-Cost ASIC Prototyping, Medical Diagnostic Equipment Front-End.
Industrial Motor Control
The EP3CLS100F780C7 fits industrial motor control with its 100K LEs providing headroom for multi-axis field-oriented control (FOC) state machines, 66 hardware 18x18 multipliers enabling parallel Park/Clarke transforms per PWM cycle, and 4.4 Mbits of embedded RAM sufficient for sine lookup tables and per-axis history buffers. Placed between encoder feedback and the power stage, the FPGA generates center-aligned PWM with sub-microsecond dead-time insertion. Unlike fixed-function DSPs, the FPGA fabric adapts to BLDC, PMSM, and stepper control laws in a single device. The Cyclone III LS security block protects proprietary torque-control IP from bitstream extraction. Commercial grade temperature (0C to +85C) suits factory-floor cabinets; industrial grade parts exist in the same family for harsher enclosures.
Recommended
Video Surveillance and Image Processing Bridge
The EP3CLS100F780C7 is well-suited to video surveillance bridges where 100K LEs accommodate Bayer-to-YUV color conversion, motion detection, and H.264 pre-processing pipelines in a single fabric. The 4.4 Mbits of embedded RAM holds two full-HD scan-line buffers, while 66 multipliers accelerate 5x5 convolution kernels for edge detection and noise reduction at 60 fps. With 413 user I/Os, the device bridges MIPI CSI-2 sensor inputs, HDMI outputs, and Ethernet MAC interfaces without external glue logic. Unlike an ASIC, the FPGA allows customer-specific analytics overlays and resolution scaling to be field-updated via JTAG.
Recommended
Automotive Infotainment and Driver-Assist Subsystems
The EP3CLS100F780C7 handles automotive infotainment and ADAS peripheral subsystems including LVDS display bridging, surround-view camera stitching, and CAN/LIN gateway logic. With 100K LEs the FPGA implements 360-degree surround-view rectification at 30 fps alongside real-time overlays, fitting inside the A-pillar head-unit form factor. The 4.4 Mbits of embedded RAM enables double-buffered frame composition without external SDRAM for low-latency overlays. The Cyclone III LS security block - unique among Cyclone III variants - protects anti-piracy bitstreams in commercial vehicle telematics. The 780-FBGA's 1.0 mm pitch supports standard 4-layer automotive PCBs.
Recommended
Communications Protocol Bridge and Custom PHY
For communications protocol bridging, the EP3CLS100F780C7 delivers 100K LEs sufficient to implement RGMII-to-SPI bridges, custom SERDES adaptation layers, and proprietary RF baseband preprocessing in one fabric. The 413 user I/Os directly interface to LVDS pairs, SFP modules, and parallel ADC/DAC buses without external transceivers. With 66 hardware multipliers the device runs channel-equalization FIR filters and symbol-timing recovery loops on-chip. Cyclone III LS hardware AES-128 encryption allows OEMs to ship firmware-upgradeable secure gateways for industrial IoT and 5G small-cell backhaul. Industrial temperature screening ensures 24/7 basestation operation.
Recommended
Low-Cost ASIC Prototyping
The EP3CLS100F780C7 is a workhorse ASIC prototyping vehicle because 100K LEs, 4.4 Mbits of RAM, and 66 multipliers can host mid-complexity SoC subsystems - including custom RISC-V cores, peripheral bus fabrics, and DDR/DDR2 memory controllers - at real-time clock speeds before committing to silicon. The 780-FBGA 1.0 mm pitch supports the same PCB stack-up as the eventual package-on-package ASIC, preserving signal integrity correlation. Quartus II time-driven place-and-route produces timing-faithful prototypes that can be correlated against the post-layout ASIC netlist. Engineering teams use the Cyclone III LS security block to gate bitstream access on shared lab equipment.
Recommended
Medical Diagnostic Equipment Front-End
For medical diagnostic front-ends such as ultrasound beamformers and patient-monitoring aggregators, the EP3CLS100F780C7 provides deterministic DSP performance from its 66 hardware 18x18 multipliers and deterministic logic delay. Ultrasound beamforming uses hundreds of multiply-accumulate operations per sample across multiple channels - the FPGA fabric handles this in deterministic cycles that are easier to certify than processor-based beamforming. The 4.4 Mbits of embedded RAM captures per-channel sample histories without external memory for short-burst modes. Cyclone III LS hardware encryption protects patient-data bitstreams on diagnostic carts. Commercial grade temperature (0-85C) is acceptable in climate-controlled clinical environments.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS100F780C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C120F780C7N | EP3C55F780C7N | EP3C40F780C7N | EP3C120F780C8N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same |
| Logic Elements | 100,448 | 119,088 (+19%) | 55,856 (-44%) | 39,600 (-60%) | 119,088 (+19%) |
| Total RAM Bits | 4,451,328 | 3,981,312 | 2,396,160 | 1,161,216 | 3,981,312 |
| 18x18 Multipliers | 66 | 66 (same) | 66 (same) | 66 (same) | 66 (same) |
| Maximum User I/Os | 413 | 531 | 377 | 535 | 531 |
| Speed Grade | C7 | C7 (same) | C7 (same) | C7 (same) | C8 (slower) |
| Security (AES-128) | Yes (Cyclone III LS) | Yes | Yes | Yes | Yes |
Key Differentiators
- Hardware AES-128 bitstream encryption with tamper protection (vs EP3C120F780C7N (standard Cyclone III, not LS))
- Highest logic density in 780-FBGA at commercial C7 speed grade (vs EP3C55F780C7N)
- Optimal LEs-to-multiplier ratio for motor control DSP (vs EP3C120F780C7N)
Design Notes
The Cyclone III LS EP3CLS100F780C7 requires a sequenced power-up: VCCINT (1.2 V core) must reach 90% of nominal before VCCIO banks and configuration supply ramp. A common pitfall is using a single rail controller - the recommended approach is a dedicated power management IC such as the Intel EN63A0QI or LT3023 with separate enable timing. Decouple each VCCIO bank with 0.1 uF + 10 uF X7R capacitors placed within 5 mm of the BGA balls to suppress switching noise.
The 780-FBGA at 1.0 mm pitch requires NSMD (non-solder mask defined) land pads of 0.5 mm diameter and ENIG or OSP surface finish. Via-in-pad is recommended for the inner balls to break out the 1.0 mm pitch on standard 4-layer FR-4 with 0.2 mm trace width. Microvia or HDI stack-up is not strictly required but recommended for 8+ layer designs. Maintain a 4 mm keep-out zone around the BGA for fan-out traces and reference plane stitching vias.
Estimated: at full fabric utilization (~85% LEs, ~70% RAM, all 66 multipliers toggling) and 100 MHz clock, the EP3CLS100F780C7 dissipates approximately 1.2-1.8 W typical. With a typical theta_JA of ~15-20 C/W for the 780-FBGA on a 4-layer JEDEC test board, junction-to-ambient rise is 18-36 C, well within the 0-85C commercial-grade envelope. For enclosed industrial cabinets above 60C ambient, attach a small heatsink or chassis thermal pad.
Three pitfalls recur in Cyclone III LS designs: (1) leaving the nCONFIG pin floating - tie it to VCCIO through a 10 kohm resistor with a pushbutton to ground for manual reconfiguration; (2) omitting the 50 ohm series-termination on high-speed LVDS pairs which causes ringing; (3) failing to enable the AES-128 bitstream encryption in the Quartus Device Options, leaving the configuration image exposed to readback. Refer to the Cyclone III LS Device Data Sheet chapter on configuration for the full checklist.
Compliance Information
Lead-free 780-FBGA package per Altera/Intel product documentation. RoHS and REACH compliance stated on distributor product pages. AEC-Q100 not applicable (commercial-grade part); for automotive AEC-Q100 qualified Cyclone III LS variants, contact Intel. Conflict-minerals compliance per Intel policy.
