EP3CLS100U484C8 vs EP3CLS100F484C7N Comparison
Detailed side-by-side comparison of EP3CLS100U484C8 by Intel and EP3CLS100F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS100U484C8
EP3CLS100U484C8 - Cyclone III LS FPGA 100K LE U484 BGA | Intel
EP3CLS100U484C8 β ActiveIntel
EP3CLS100F484C7N
EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N β ActiveSpecification Comparison
| Parameter | EP3CLS100U484C8 | EP3CLS100F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $395.00 | $495.80 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 100,448 | β |
| Number of Logic Blocks / CLBs | 100,448 | β |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 |
| Maximum User I/O | 278 | β |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | β |
| Core Voltage | 1.2 V | β |
| Process Technology | 65 nm CMOS | 65 nm low-power (TSMC) |
| Maximum Internal Frequency | 402 MHz | β |
| Embedded Multipliers (18 x 18) | 66 | β |
| PLLs | 4 | 4 |
| Package | UFBGA-484 (U484, 19 x 19 mm, 0.8 mm pitch) | 484-ball FineLine BGA (FBGA-484) |
| Configuration Modes | PS, FPP, JTAG | β |
| Security Features | AES-256 bitstream encryption, JTAG protection, tamper detection | Bitstream encryption, JTAG tamper protection |
| Operating Temperature | Commercial (0C to +85C), part suffix C8 | β |
| Speed Grade | C8 (commercial, 8) | C7 |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant (lead-free, N suffix) |
| Logic Elements | β | 100,448 |
| User I/O Pins | β | 278 |
| DSP Blocks (18x18 multipliers) | β | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | β | [DATA_NEEDED: global clock count] |
| Core Supply Voltage | β | 1.2 V |
| Operating Temperature (junction) | β | 0Β°C to +85Β°C (commercial) |
| Ball Pitch | β | 1.0 mm |
| Package Dimensions | β | [DATA_NEEDED: package body dimensions] |
| Configuration Method | β | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Design Software | β | Quartus II / Intel Quartus Prime |