Intel

EP3CLS100U484C8 - Cyclone III LS FPGA 100K LE U484 BGA | Intel

MPN: EP3CLS100U484C8 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss UFBGA-484 (U484, 19 x 19 mm, 0.8 mm pitch) Package 402 MHz Speed 4,451,328 Memory
From $395 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $548.47 $548.47
10 $520 $5,200.00
100 $472 $47,200.00
500 $430 $215,000.00
1,000 $395 $395,000.00
ℹ️ All prices are in USD

EP3CLS100U484C8 Overview

The Intel (formerly Altera) EP3CLS100U484C8 is a Cyclone® III LS family low-power FPGA delivering 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 maximum user I/O pins in a 484-ball UFBGA (19 x 19 mm, 0.8 mm pitch) package. It is fabricated on a 65 nm CMOS process and operates from a 1.2 V core supply. The Cyclone III LS family adds dedicated security features such as bitstream encryption, JTAG protection, and advanced tamper detection, making this device especially suited for safety- and security-conscious embedded designs.

An FPGA (Field Programmable Gate Array) is a programmable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O cells. Unlike an ASIC, an FPGA's function is defined by user-loaded configuration data, allowing hardware re-programmability. The Cyclone III LS family sits in the Intel FPGA hierarchy as follows: FPGA -> programmable logic device -> SRAM-based FPGA -> low-power FPGA with hardware security -> Cyclone series -> Cyclone III LS, optimized for industrial, automotive, and communications applications where both low static power and IP protection are required.

Key features of the EP3CLS100U484C8 include up to 100,448 logic elements, 4,451,328 bits of embedded RAM (M9K blocks), 66 embedded 18 x 18 multipliers, four PLLs, and 278 maximum user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and integrates dedicated hard IP for PCI Express (x1, x2, x4 Gen1) and external memory interfaces for DDR/DDR2/QDRII SRAM. Maximum internal operating frequency is specified at 402 MHz by manufacturer data.

The Cyclone III LS architecture combines a fine-grained 4-input LUT fabric with dedicated routing, on-chip termination (OCT), and a security co-processor for AES-256 bitstream encryption. Compared to the original Cyclone III family, the LS variant adds configuration bitstream authentication and active tamper-detection pins, allowing secure field upgrades and protection against cloning. Static power consumption is markedly reduced versus Cyclone III, enabling fan-less industrial designs.

Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive driver-assistance ECUs, secure communications equipment, and portable medical instrumentation. Its security block also makes it suitable for payment terminals and IP-protected embedded controllers.

When designing with this FPGA, follow the Intel Cyclone III LS Device Handbook recommended decoupling scheme (typically 100 uF + 10 uF + 100 nF per power rail) and respect the 0.8 mm BGA pitch constraints by using at least 6-layer PCB stack-up with microvia-in-pad for breakout routing.

This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP3CLS100U484C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3CLS100U484C8 (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Operating Temperature.

Intel
Package: 484-ball FineLine BGA (FBGA-484)
Speed Grade: C7
Process Technology: 65 nm low-power (TSMC)
Compare with EP3CLS100U484C8 →
Altera
Speed Grade: 8 (from C8 ordering code)
Process Technology: 65 nm
RoHS Status: unknown
Compare with EP3CLS100U484C8 →
Intel
Speed Grade: C8 (commercial, fastest)
Process Technology: TSMC 65 nm low-power (LP)
RoHS Status: Compliant (Pb-free, 'N' suffix)
Compare with EP3CLS100U484C8 →
Intel
Package: 484-ball FBGA (FineLine BGA)
Process Technology: TSMC 65 nm low-power (LP)
Compare with EP3CLS100U484C8 →
Intel
Package: 484-ball FBGA (F484)
Speed Grade: 7 (medium)
Compare with EP3CLS100U484C8 →
Intel
Package: 484-ball UFBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch
Operating Temperature: Commercial (0C to +85C)
Compare with EP3CLS100U484C8 →
Altera
Package: 484-ball FBGA (UBGA)
Speed Grade: 7 (commercial)
Process Technology: 65 nm TSMC low-power
Compare with EP3CLS100U484C8 →
Intel
Package: 484-ball FineLine BGA (UBGA-484)
Speed Grade: C8 (commercial)
Process Technology: 60 nm low-K CMOS
Compare with EP3CLS100U484C8 →
Intel
Package: 484-ball UFBGA (U484), 19 x 19 mm
Speed Grade: C8 (commercial, 8 ns)
Compare with EP3CLS100U484C8 →
Altera
Package: 484-FBGA (U484) FineLine BGA, 19x19 mm
Speed Grade: 8 (commercial)
Process Technology: TSMC 65 nm Low-Power (LP)
Compare with EP3CLS100U484C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3CLS100U484C8N

✅ Drop-In
Intel
📦 UFBGA-484 (U484)
FPGA (Field Programmable Gate Array) · Cyclone III LS · 100,448 · 4,451 · 100,448 · 4,451,328 bits (~4.4 Mbit) · 278 · 4

✓ In Stock

$109.4 / Unit

View Datasheet →

EP3CLS100U484C7N

✅ Drop-In
Altera
📦 UFBGA-484 (U484)
Cyclone III LS · 100,448 · 4,451,328 bits (4.4 Mbit) · 278 · 484-ball FBGA (UBGA) · 65 nm TSMC low-power · 1.2 V · 7 (commercial)

✓ In Stock

$412.65 / Unit

View Datasheet →

EP3CLS100U484C7

✅ Drop-In
Intel
📦 UFBGA-484 (U484)
Cyclone III LS · 100,448 · 4,451,328 · 278 · 65 nm CMOS

✓ In Stock

$520 / Unit

View Datasheet →

EP3CLS100F484I7N

✅ Drop-In
Intel
📦 FBGA-484 (F484)
Cyclone III LS · FPGA - Field Programmable Gate Array · 100,448 · 6,278 · 4,451,328 bits (M9K blocks) · 278 · 294 · 4

✓ In Stock

$67.9 / Unit

View Datasheet →

EP3CLS100F484I7

✅ Drop-In
Intel
📦 FBGA-484 (F484)
Cyclone III LS · 100,448 · 278 · 4,451,328 bits · 610 (per datasheet family) · 66 · 16 dedicated · 4

✓ In Stock

$113.6 / Unit

View Datasheet →

EP3CLS100F484C8N

✅ Drop-In
Intel
📦 FBGA-484 (F484)
Cyclone® III LS · Cyclone III LS · 100,448 · 4,451,328 bits · 278 (maximum user I/O) · 47 (logic blocks reported by DigChip snapshot) · FBGA-484 (FineLine BGA, lead-free) · 484

✓ In Stock

$115.4 / Unit

View Datasheet →

EP3CLS100F484C8

✅ Drop-In
Altera
📦 FBGA-484 (F484)
FPGA - Field Programmable Gate Array · Cyclone III LS · 100448 · 4451328 bits · 278 · 1.2 V · 65 nm · 402 MHz

✓ In Stock

$148.45 / Unit

View Datasheet →

EP3CLS100F484C7N

✅ Drop-In
Intel
📦 FBGA-484 (F484)
Cyclone III LS · 100,448 · 4,451,328 · 278 · 4 · 65 nm low-power (TSMC)

✓ In Stock

$495.8 / Unit

View Datasheet →

EP3CLS100U484C8 Maximum Ratings & Electrical Characteristics

Family Cyclone III LS
Logic Elements (LE) 100,448
Number of Logic Blocks / CLBs 100,448
Embedded Memory (bits) 4,451,328
Maximum User I/O 278
Core Voltage 1.2 V
Process Technology 65 nm CMOS
Maximum Internal Frequency 402 MHz
Embedded Multipliers (18 x 18) 66
PLLs 4
Package UFBGA-484 (U484, 19 x 19 mm, 0.8 mm pitch)
Configuration Modes PS, FPP, JTAG
Security Features AES-256 bitstream encryption, JTAG protection, tamper detection
Operating Temperature Commercial (0C to +85C), part suffix C8
Speed Grade C8 (commercial, 8)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

EP3CLS100U484C8 ufbga-484 (u484, 19 x 19 mm, 0.8 mm pitch) Pin Configuration Guide

Pin configuration for EP3CLS100U484C8 (ufbga-484 (u484, 19 x 19 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

ufbga-484 (u484, 19 x 19 mm, 0.8 mm pitch) package pinout diagram for EP3CLS100U484C8

No detailed pinout data available for EP3CLS100U484C8.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3CLS100U484C8 is suitable for 6 applications: Industrial Motor Control & Factory Automation, Video Surveillance & Image Processing, Automotive Driver-Assistance ECUs, Secure Communications Equipment, Portable Medical Instrumentation, Payment Terminals & Secure Embedded Controllers.

🏭

Industrial Motor Control & Factory Automation

The EP3CLS100U484C8 fits industrial motor control and factory automation because it combines 100K logic elements, 66 embedded 18 x 18 multipliers, and four PLLs in a single device, replacing multiple MCUs or DSPs in multi-axis servo loops. Its 278 user I/Os at 0.8 mm BGA pitch comfortably drive simultaneous quadrature encoder inputs, PWM outputs to IGBT gate drivers, and EtherCAT / PROFINET side-band signals. The 65 nm low-power process keeps the device below 0.5 W static dissipation, enabling fan-less cabinet designs at 0-85C ambient. The 402 MHz internal fabric runs closed-loop current-control state machines at sub-microsecond update rates while leaving headroom for safety logic.

🎥

Video Surveillance & Image Processing

The EP3CLS100U484C8 is well suited to video surveillance and image processing pipelines because its 4,451,328 bits of embedded RAM store line buffers, frame headers, and look-up tables for real-time color-space conversion. The 66 dedicated 18 x 18 hardware multipliers accelerate Sobel, Laplacian, and motion-estimation kernels without consuming logic-element resources, while the four PLLs generate the pixel clock, memory clock, and DDR2 controller clock from a single 50 MHz reference. The LVDS I/O banks support direct interfacing to CMOS image sensors and HDMI/DVI sinks, eliminating external bridge chips. AES-256 bitstream encryption prevents firmware cloning in security-camera deployments.

🚗

Automotive Driver-Assistance ECUs

The EP3CLS100U484C8 supports automotive driver-assistance (ADAS) electronic control units because the Cyclone III LS family integrates a hardware security co-processor with AES-256 bitstream encryption and active tamper-detection pins that satisfy OEM IP-protection requirements. Its 100K logic elements and 66 multipliers perform sensor fusion across multiple camera, radar, and lidar streams in parallel, while the four PLLs lock low-jitter clocks to CAN-FD and FlexRay transceivers. Designers pair it with industrial-temperature variants (e.g., EP3CLS100F484I7N) for underhood mounting. Note that for fully automotive-qualified AEC-Q100 designs, Cyclone IV or Cyclone V devices are typically required.

🌐

Secure Communications Equipment

The EP3CLS100U484C8 suits secure communications equipment because its 278 user I/Os and built-in PCIe hard IP enable direct bridging to host processors over PCI Express x1/x2/x4 Gen1, while the four PLLs generate jitter-clean clocks for SERDES-style backplanes. AES-256 bitstream encryption plus JTAG access lockout prevent reverse engineering of the radio, baseband, or crypto-acceleration IP loaded into the fabric. The 4.4 Mbit embedded RAM is partitioned to maintain packet queues and FEC tables without external SRAM. The UFBGA-484 package provides the thermal headroom needed for sustained DSP workloads at full fabric utilization.

💊

Portable Medical Instrumentation

The EP3CLS100U484C8 fits portable medical instrumentation because its 65 nm low-power process delivers full FPGA functionality at sub-500 mW static dissipation, extending battery runtime in handheld ultrasound, patient monitor, and point-of-care diagnostic devices. The 100K logic elements implement front-end DSP (FIR, decimation, envelope detection) and back-end HMI rendering in one device, eliminating a separate processor. The 484-ball BGA's compact 19 x 19 mm footprint fits small enclosures, while the four PLLs synchronize to USB, Bluetooth, and display refresh clocks. Cyclone III LS security features protect HIPAA-sensitive patient data stored in external memory.

🧩

Payment Terminals & Secure Embedded Controllers

The EP3CLS100U484C8 is well matched to payment terminals and secure embedded controllers because its hardware AES-256 engine encrypts configuration bitstreams at load time, while active tamper-detection pins can trigger zeroization on enclosure breach. The 4.4 Mbit embedded RAM is sufficient for transaction-pipeline buffers without exposing sensitive material to external DRAM. PCI-PTS-compliant firmware fits comfortably within 100K logic elements along with TRNG, RSA/ECC acceleration, and secure-key storage state machines. The 0.8 mm UFBGA package supports compact terminal form factors, and four PLLs generate clocks for contactless (NFC) and contact (EMV) smart-card interfaces.

Recommended Products Summary

EP3CLS100F484I7N Intel Used in: Industrial Motor Control & Factory Automation, Automotive Driver-Assistance ECUs EP4CE100F23I7N Cyclone IV E modern replacement with similar density Used in: Industrial Motor Control & Factory Automation MT48LC16M16A2TG External SDRAM for frame buffer Used in: Video Surveillance & Image Processing EP3CLS100U484C8N Intel Used in: Video Surveillance & Image Processing, Secure Communications Equipment, Portable Medical Instrumentation, Payment Terminals & Secure Embedded Controllers TLE9250VSJ CAN-FD transceiver companion Used in: Automotive Driver-Assistance ECUs EP3CLS200F484I7N Intel Used in: Secure Communications Equipment ADS1271IPW Companion 24-bit ADC for medical signals Used in: Portable Medical Instrumentation ST25R3916 NFC reader companion IC Used in: Payment Terminals & Secure Embedded Controllers
What is the logic element count of the EP3CLS100U484C8?
The EP3CLS100U484C8 contains 100,448 logic elements (LEs), 4,451,328 bits of embedded RAM, and 66 embedded 18 x 18 hardware multipliers. According to the Intel Cyclone III LS Device Handbook, the device integrates 100,448 four-input LUTs arranged as combinational and registered logic blocks, along with 4 M9K memory blocks per LAB region. The high LE density makes it well suited for parallel datapaths, glue-logic consolidation, and DSP pre-processing.
What package does the EP3CLS100U484C8 ship in?
The EP3CLS100U484C8 ships in a 484-ball UFBGA (UBGA-484) measuring 19 x 19 mm with a 0.8 mm ball pitch. This is Intel/Altera's U484 package code. The package is a wire-bond plastic BGA suitable for surface-mount assembly using reflow soldering. Due to the fine 0.8 mm pitch, manufacturer recommendations call for microvia-in-pad PCB stack-ups and ENIG or OSP surface finishes for reliable manufacturing.
What is the difference between EP3CLS100U484C8 and EP3CLS100U484C7?
The EP3CLS100U484C8 (speed grade 8) is slower than the EP3CLS100U484C7 (speed grade 7) in internal timing closure. Both parts share the same U484 BGA package, identical logic and memory resources, and pin-compatible ball maps. According to Altera/Intel device ordering nomenclature, a lower speed-grade number indicates a faster silicon speed bin, so the C7 version typically achieves higher Fmax at the cost of higher unit price.
What is the difference between EP3CLS100U484C8 and EP3CLS100U484C8N?
The 'N' suffix denotes a lead-free, RoHS-compliant version of the same silicon. The EP3CLS100U484C8N shares identical logic, memory, multiplier, PLL, and pinout resources with the EP3CLS100U484C8, differing only in lead-free terminal finish. According to the FindIC cross-reference, the N variant is described as a 'completely replace' drop-in part for the original, requiring no PCB or firmware changes.
Where can I buy the EP3CLS100U484C8 online?
The EP3CLS100U484C8 is currently stocked by authorized distributors including DigiKey, Mouser, Heisener, Ampheo, Vyrian, and Excesschip. Pricing as of 2026-09-09 starts at approximately $548.47 per unit at qty 1 (Heisener). Lead time for larger orders should be confirmed directly with the distributor, as Altera/Intel Cyclone III LS parts are mature products with shrinking distributor inventory.
What is the price of the EP3CLS100U484C8?
The EP3CLS100U484C8 unit price starts at approximately $548.47 at qty 1 as of 2026-09-09, with typical distributor pricing falling in the $395-$548 range depending on quantity break. Volume orders of 1,000 pieces typically negotiate to the $395 region. Pricing fluctuates with inventory availability because Cyclone III LS production is mature; request a formal quote for current pricing on bulk orders.
What is the lead time for the EP3CLS100U484C8?
The EP3CLS100U484C8 typically has a lead time of 4-6 weeks when ordered through authorized distributors as of 2026-09-09, although Heisener lists an estimated delivery window of Nov 27 - Dec 2 for current orders. Third-party brokers may ship from immediate stock but at premium pricing. For volume production, Intel's authorized distributors should be the primary sourcing channel.
Is the EP3CLS100U484C8 in stock?
As of 2026-09-09, Heisener reports approximately 3,376 pieces in stock for the EP3CLS100U484C8. Mouser and DigiKey historically list stock for this part but availability varies week-to-week. For the latest stock position, check each distributor's live inventory or request a quotation, as Cyclone III LS parts are mature and occasionally flagged for last-time-buy.
EP3CLS100U484C8 vs EP3CLS200F484I7N - which should I choose?
The EP3CLS200F484I7N offers 200K logic elements (vs 100K), industrial temperature grade (-40C to +100C), and the F484 package; the EP3CLS100U484C8 offers 100K logic elements in the U484 UFBGA package. According to the ETEI comparison database, both are Cyclone III LS parts but differ in LE count, temperature grade, and ball-map prefix. Choose the F484 variant when you need higher density or industrial temperature range; choose the U484 C8 for lower cost in commercial-temperature designs.
When should I choose EP3CLS100U484C8 over EP3C100U484C8?
Choose the EP3CLS100U484C8 (Cyclone III LS) over the EP3C100U484C8 (Cyclone III) when your design requires AES-256 bitstream encryption, JTAG access protection, or active tamper-detection pins. Both share the 100K LE density and U484 package. The LS variant adds a security co-processor that prevents bitstream cloning and unauthorized JTAG reads, which is critical for IP protection, payment terminals, and safety-conscious industrial designs.
What is the best drop-in replacement for the EP3CLS100U484C8?
The best drop-in replacement for the EP3CLS100U484C8 is the EP3CLS100U484C8N, which is the lead-free / RoHS-compliant equivalent of the same silicon die. Both share the U484 BGA footprint, identical logic and memory resources, and pin-compatible ball maps, so no PCB or firmware change is required. The N suffix only indicates terminal finish, making it a fully compatible substitute for the original non-N version.
Where can I download the EP3CLS100U484C8 datasheet PDF?
The EP3CLS100U484C8 datasheet can be downloaded as a PDF from the Intel Cyclone III Device Handbook page at intel.com or from the Altera/Intel legacy documentation archive. Third-party mirrors such as pdf.datasheet.live and findic.us also host the Cyclone III LS datasheet. The handbook contains full pin tables, electrical characteristics, and timing specifications for all U484 BGA Cyclone III LS parts.
Where can I find the pinout for the EP3CLS100U484C8?
The full U484 BGA pinout for the EP3CLS100U484C8 is provided in the Intel Cyclone III LS Device Handbook, Chapter 9 (device pin information). Ball coordinates and signal names are listed in the U484 pin table, organized by I/O bank and special-function group (clock, JTAG, configuration, power). The handbook PDF is the authoritative reference; signal integrity simulation should use the IBIS model from the Intel FPGA download center.
Hey Google, what are the key specifications of the EP3CLS100U484C8?
The EP3CLS100U484C8 is a Cyclone III LS FPGA with 100,448 logic elements, 4,451,328 bits of embedded memory, 66 embedded 18 x 18 multipliers, four PLLs, 278 maximum user I/Os, and a 402 MHz maximum internal operating frequency. It comes in a 484-ball UFBGA package (19 x 19 mm, 0.8 mm pitch), operates from a 1.2 V core supply, and is fabricated on a 65 nm low-power CMOS process. The LS suffix adds AES-256 bitstream encryption and tamper detection.
What is the best Intel equivalent for the EP3CLS100U484C8 from a different family?
Cross-brand drop-in equivalents for the EP3CLS100U484C8 are uncommon because the Cyclone III LS is a proprietary Altera/Intel architecture. Designers migrating to a different family should consider the Intel Cyclone IV E (EP4CE100) in the F484 package as a same-brand modern replacement with similar logic density and pin-compatible footprint, though toolchain and bitstream migration are required. Confirm pin-by-pin compatibility before committing to a cross-family swap.

Engineering reference data for EP3CLS100U484C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3CLS100U484C8 when you need a 100K-logic-element Cyclone III LS FPGA in the U484 UFBGA package for commercial-temperature (0-85C) applications where cost is a priority and lead-free compliance is not strictly required. Choose the EP3CLS100U484C8N for RoHS-compliant or lead-free manufacturing requirements - it is a fully compatible drop-in substitute. Choose the EP3CLS100U484C7N/C7 when you need a faster speed grade (C7 vs C8) for higher Fmax designs. Choose the F484 variants (e.g., EP3CLS100F484I7N) when your PCB layout uses the F484 footprint or requires industrial temperature range. All alternatives share identical silicon resources and require no firmware or PCB changes when migrating within the same package family.

Comparison with Alternatives

Parameter This Product EP3CLS100U484C8N EP3CLS100U484C7N EP3CLS100U484C7 EP3CLS100F484I7N EP3CLS100F484I7 EP3CLS100F484C8N EP3CLS100F484C8 EP3CLS100F484C7N
Brand Intel Intel Intel Intel Intel Intel Intel Intel Intel
Package UFBGA-484 (U484) UFBGA-484 (U484) UFBGA-484 (U484) UFBGA-484 (U484) FBGA-484 (F484) - different pinout FBGA-484 (F484) - different pinout FBGA-484 (F484) - different pinout FBGA-484 (F484) - different pinout FBGA-484 (F484) - different pinout
Logic Elements 100,448 100,448 100,448 100,448 100,448 100,448 100,448 100,448 100,448
Embedded Memory (bits) 4,451,328 4,451,328 4,451,328 4,451,328 4,451,328 4,451,328 4,451,328 4,451,328 4,451,328
Max User I/O 278 278 278 278 278 278 278 278 278
Speed Grade C8 C8 C7 C7 I7 I7 C8 C8 C7
Temperature Grade Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C)
Lead-Free / RoHS Non-N (original) Yes (lead-free) Yes (lead-free) No Yes (lead-free) No Yes (lead-free) No Yes (lead-free)

Key Differentiators

  • Lower entry price than lead-free N variant in commercial channel (vs EP3CLS100U484C8N)
  • U484 UFBGA package option with different ball map than F484 (vs EP3CLS100F484C8N)
  • Commercial temperature grade at lowest cost point (vs EP3CLS100F484I7N)

Design Notes

Decouple each Cyclone III LS power rail (VCCINT 1.2V, VCCA 2.5V, VCCIO 1.2-3.3V bank-dependent, VCCPD 2.5/3.3V) with a 100 uF bulk capacitor, 10 uF ceramic, and 100 nF high-frequency bypass placed as close to the BGA balls as the layout allows. Estimated: at typical Cyclone III LS core current of approximately 250-400 mA at 100 MHz fabric activity, the 1.2V rail alone draws 0.3-0.5 W. Use a four-layer PCB with dedicated power and ground planes for return-path integrity.

The UFBGA-484 package at 0.8 mm pitch requires microvia-in-pad PCB technology for reliable breakout routing. Use at least a 6-layer stack-up (signal-GND-signal-PWR-signal-GND) and place signal vias on a 0.4-0.5 mm pitch grid. The package's 19 x 19 mm body should have a keep-out zone of at least 0.5 mm around the BGA to allow for package warpage compensation during reflow. Apply ENIG surface finish to ensure reliable solder joint formation on BGA balls.

Do not confuse the U484 UFBGA package with the F484 FBGA package - they have different ball maps and pin assignments even though both are 484-ball BGA. The 'U' prefix designates the Ultra BGA with different mechanical dimensions than the 'F' standard BGA. Mixing the two packages will result in incorrect connections. Always verify the exact package code in the device ordering information before PCB layout. The pinout table in Chapter 9 of the Cyclone III LS Device Handbook is the authoritative reference.

Estimated: under typical operation at 25C ambient with moderate fabric utilization (~30-50%), the EP3CLS100U484C8 junction-to-ambient thermal resistance theta_JA is approximately 15-20 C/W for the UFBGA-484 package with a properly designed thermal pad footprint. At 0.5 W core dissipation, junction temperature rise above ambient is approximately 8-10 C. For designs operating at industrial temperature grades or with high sustained activity, follow the thermal management guidelines in the Cyclone III LS Device Handbook and consider adding thermal vias under the package center.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

The non-N variant is not lead-free; the N suffix variant is lead-free/RoHS-compliant. AEC-Q100 not qualified - for automotive designs, consider Cyclone IV or Cyclone V families. RoHS/REACH compliance status not explicitly stated in the verified distributor data.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP3CLS100U484C8 EP3CLS100U484C8N EP3CLS100U484C7N EP3CLS100U484C7 EP3CLS100F484I7N FPGA Field Programmable Gate Array Cyclone III LS Cyclone series logic element LE CLB configurable logic block embedded RAM M9K memory block DSP block 18 x 18 multiplier PLL phase-locked loop UFBGA UBGA BGA ball grid array PCI Express LVDS AES-256 bitstream encryption tamper detection JTAG RoHS lead-free AEC-Q100 65 nm CMOS SRAM-based FPGA low-power FPGA industrial motor control factory automation video surveillance image processing secure communications payment terminal medical instrumentation
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