EP3CLS200F484C7 vs EP3CLS200F484C7N Comparison
Detailed side-by-side comparison of EP3CLS200F484C7 by Intel and EP3CLS200F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS200F484C7
EP3CLS200F484C7 - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
EP3CLS200F484C7 β ActiveIntel
EP3CLS200F484C7N
EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel
EP3CLS200F484C7N β ActiveSpecification Comparison
| Parameter | EP3CLS200F484C7 | EP3CLS200F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,720.00 | $1,650.00 |
| Family | Cyclone III LS | β |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,408 | β |
| Embedded Memory (RAM bits) | 8,211,456 | β |
| Maximum User I/Os | 226 | β |
| DSP Blocks | 396 (18x18 multipliers) | β |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | β |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | β |
| Package | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Process Technology | CMOS, low-power | 65 nm low-power CMOS |
| Operating Temperature | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial) |
| Configuration Method | JTAG, Passive Serial, Active Serial | β |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | β | Cyclone III LS |
| Logic Array Blocks (LAB) | β | 12,404 |
| Embedded Memory | β | 8,211,456 bits |
| Embedded 18x18 Multipliers | β | 210 |
| User I/O | β | 226 |
| Core Voltage | β | 1.2 V |
| Configuration Modes | β | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | β | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | β | 8 |
| Hot Socketing | β | Supported |