EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel
MPN: EP3CLS200F484C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2034.7 | $2,034.70 |
| 10 | $1950 | $19,500.00 |
| 100 | $1850 | $185,000.00 |
| 500 | $1750 | $875,000.00 |
| 1,000 | $1650 | $1,650,000.00 |
EP3CLS200F484C7N Overview
A Field Programmable Gate Array (FPGA) is a programmable logic IC that lets designers configure arbitrary digital logic, memory blocks, and DSP pipelines through a hardware description language (HDL) flow. FPGAs sit within the programmable logic family, alongside CPLDs and structured ASICs, and form a critical layer between fixed-function microcontrollers and fully-masked ASICs in the semiconductor taxonomy. The Cyclone III LS family is positioned as the low-power, security-enhanced variant of the Cyclone III generation, targeting cost-sensitive, high-volume digital designs.
Key features of the EP3CLS200F484C7N include 484 user I/O pins distributed across eight I/O banks, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and integrated configuration circuitry supporting JTAG (IEEE 1149.1) and Active Serial (AS) modes. The device also integrates configuration bit-stream encryption and a robust Cyclone III LS security feature set aimed at preventing design theft and cloning, which is uncommon in low-cost FPGA families.
Technically, the EP3CLS200F484C7N uses a low-k, 65 nm TSMC process to deliver low dynamic and static power consumption. Logic is arranged as 12,404 Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). The embedded memory supports single-port, dual-port, and FIFO modes, and the 210 18x18 multipliers provide DSP throughput for filters, FFTs, and video pipelines.
Typical applications include industrial motor and motion control, factory automation, video processing and display controllers, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. Its combination of logic density, embedded memory, and security features also makes it well-suited for medical imaging front-end and telecom interface designs.
When designing with this part, ensure the configuration scheme (AS, PS, JTAG) and clocking topology are defined up front, and review the pin migration guide if you intend to step up or down within the Cyclone III LS family. Thermal management is generally straightforward because of low static power, but worst-case dynamic-power analysis should still be run.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically found in the manufacturer datasheet.
Drop-in alternatives for EP3CLS200F484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS200F484C7N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Maximum Operating Frequency, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS200F484C8N
✅ Drop-In✓ In Stock
$1245 / Unit
View Datasheet →EP3CLS200F484C7
✅ Drop-In✓ In Stock
$1720 / Unit
View Datasheet →EP3CLS150F484C7N
✅ Drop-In✓ In Stock
$102.75 / Unit
View Datasheet →EP3CLS100F484C7N
✅ Drop-In✓ In Stock
$495.8 / Unit
View Datasheet →EP3C120F484C7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP3CLS200F484C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III LS |
| Logic Elements (LE) | 198,464 |
| Logic Array Blocks (LAB) | 12,404 |
| Embedded Memory | 8,211,456 bits |
| Embedded 18x18 Multipliers | 210 |
| User I/O | 226 |
| Package | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Core Voltage | 1.2 V |
| Operating Temperature | 0C to +85C (commercial) |
| Process Technology | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | 8 |
| Hot Socketing | Supported |
| PLLs | 4 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP3CLS200F484C7N 484-ball fbga (fineline bga, 23x23 mm) Pin Configuration Guide
Pin configuration for EP3CLS200F484C7N (484-ball fbga (fineline bga, 23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS200F484C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS200F484C7N is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Controllers, Software-Defined Radio (SDR) Baseband, Factory Automation Controllers, ASIC Prototyping and Emulation, Medical Imaging Front-End.
Industrial Motor Control
The EP3CLS200F484C7N is well-suited to multi-axis industrial motor and motion-control drives because its 198,464 logic elements and 210 embedded 18x18 multipliers can host multiple encoder interfaces, FOC (field-oriented control) loops, and current-sense ADCs in parallel. With 226 user I/Os across 8 banks, designers can simultaneously interface to Hall sensors, incremental encoders, RS-485 fieldbus, and isolated gate drivers without external logic. The 4 on-chip PLLs provide jitter-clean clocks for high-resolution PWM generation up to hundreds of kHz, and the security-enabled bit-stream of the Cyclone III LS family protects proprietary motor-control IP from cloning.
Recommended
Video Processing and Display Controllers
The 198K logic elements, 8.2 Mbit of embedded memory, and 226 I/Os of the EP3CLS200F484C7N make it a strong fit for mid-range video pipelines - HDMI splitters, multi-channel surveillance DVRs, and LCD/LED display controllers. The 210 dedicated 18x18 multipliers handle real-time deinterlacing, scaling, and color-space conversion, while the M9K memory blocks buffer several full video lines at 1080p. Its LVDS-capable I/Os pair cleanly with FlatLink or Channel-Link panels, and the bit-stream encryption prevents reverse engineering of custom video watermarking algorithms.
Recommended
Software-Defined Radio (SDR) Baseband
Software-defined radio baseband designs benefit from the EP3CLS200F484C7N's combination of 198K logic elements and 210 DSP-friendly 18x18 multipliers, which together can implement digital down-conversion (DDC), FIR filtering, and FFT pipelines for narrowband and wideband receivers. The 4 PLLs generate the multiple clock domains required for ADC sample rates and DSP clocks, while the 226 user I/Os interface to high-speed ADC/DAC pairs via LVDS. The Cyclone III LS security feature set is valuable for protecting proprietary modulation or demodulation IP in commercial SDR products.
Recommended
Factory Automation Controllers
The EP3CLS200F484C7N is commonly used as the logic core of programmable logic controllers (PLCs) and distributed I/O gateways in factory automation, where 226 user I/Os can interface directly to multi-voltage industrial sensors and actuators. The 12,404 LABs and 198K LEs support ladder-logic or IEC 61131-3 soft-CPU implementations alongside custom high-speed control loops, while M9K memory blocks buffer deterministic process data. Bit-stream encryption of the Cyclone III LS family protects OEM machine logic from unauthorized duplication, and the device's commercial 0C-85C temperature range fits most indoor cabinet environments.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping teams use the EP3CLS200F484C7N as a fast-turnaround emulation platform for designs in the 100K-200K ASIC-gate range. The 198K logic elements, 8.2 Mbit of embedded memory, and 226 I/Os are sufficient to map entire sub-systems of mid-complexity SoCs, and the Quartus Prime tool flow supports rapid recompile cycles during bring-up. The Cyclone III LS device is offered in commercial and industrial grades, allowing the same board design to be used for both lab validation and field trials, while bit-stream encryption lets the design house share prototype hardware without exposing the underlying netlist.
Recommended
Medical Imaging Front-End
Medical imaging front-end boards - ultrasound beamformers, endoscopy controllers, and patient-monitoring DSP - use the EP3CLS200F484C7N to consolidate sensor acquisition, digital filtering, and display pipeline in a single device. The 210 18x18 multipliers implement real-time FIR and decimation filters on multi-channel ADC streams, while M9K memory blocks line-buffer full ultrasound frames. The 226 I/Os interface to LVDS ADC pairs and FlatLink displays simultaneously, and the security-enhanced bit-stream of the Cyclone III LS family protects proprietary clinical algorithms from IP theft during manufacturing.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS200F484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS200F484C8N | EP3CLS200F484C7 | EP3CLS150F484C7N | EP3CLS100F484C7N | EP3C120F484C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 198,464 | 198,464 | 198,464 | 150,848 | 100,448 | 119,088 |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits | 8,211,456 bits | 6,135,552 bits | 3,888,096 bits | 3,981,312 bits |
| Embedded 18x18 Multipliers | 210 | 210 | 210 | 160 | 88 | 288 |
| User I/O | 226 | 226 | 226 | 210 | 198 | 284 |
| Series / Family | Cyclone III LS (security) | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III (non-LS) |
| Bit-Stream Encryption | Yes | Yes | Yes | Yes | Yes | No |
| Speed Grade | C7 | C8 | C7 | C7 | C7 | C7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- Bit-stream encryption and IP security features (vs EP3C120F484C7N (Cyclone III, non-LS))
- Highest logic density in the 484-ball FBGA package code (vs EP3CLS150F484C7N (150K LE))
- Faster speed grade option for tight timing closure (vs EP3CLS200F484C7 (C7 speed grade))
Design Notes
The 484-ball FBGA at 1.0 mm ball pitch requires 4-6 layer PCB stack-up with microvia or via-in-pad technology for reliable BGA assembly. Per the Cyclone III LS package guidelines, the PCB land pattern should follow the JEDEC MS-026 footprint with non-solder-mask-defined (NSMD) pads to ensure consistent solder joint formation and to reduce the risk of head-in-pillow defects during reflow.
Cyclone III LS core voltage is 1.2 V; PLL analog supply VCC_PLL must be powered from a low-noise LDO or filtered rail, not directly from a switching converter. Decoupling per the Cyclone III LS pin connection guidelines requires multiple 0.1 uF and 0.01 uF capacitors placed within 100 mils of each VCCINT/VCCIO ball pair. Neglecting PLL supply filtering typically manifests as elevated jitter on clock outputs.
Differential-pair routing for LVDS must maintain 100 ohm differential impedance and length-matching within the tolerances listed in the Cyclone III LS I/O features chapter. Series-source termination near the FPGA pin is recommended for source-synchronous interfaces longer than a few inches, and unused I/O pins should be configured as tri-stated inputs with weak pull-ups to minimize supply-current transients.
Configuration mode pins MSEL[3:0] must be hardwired to the correct logic level for the chosen scheme (AS, PS, JTAG). A common mistake is leaving MSEL floating, which results in an unconfigured device at power-up. Also, the nCONFIG, nSTATUS, and CONFIG_DONE pins should be pulled to their inactive states per the configuration handbook to ensure clean configuration hand-off.
Compliance Information
RoHS-compliant per Altera/Intel product page; AEC-Q100 qualification not applicable as this is a commercial-grade FPGA. Designers needing industrial temperature grade (-40C to +100C) should order the EP3CLS200F484I7N variant.
