EP3CLS200F484C7N vs EP3CLS100F484C7N Comparison
Detailed side-by-side comparison of EP3CLS200F484C7N by Intel and EP3CLS100F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS200F484C7N
EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel
EP3CLS200F484C7N β ActiveIntel
EP3CLS100F484C7N
EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N β ActiveSpecification Comparison
| Parameter | EP3CLS200F484C7N | EP3CLS100F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,650.00 | $495.80 |
| Series | Cyclone III LS | β |
| Logic Elements (LE) | 198,464 | β |
| Logic Array Blocks (LAB) | 12,404 | β |
| Embedded Memory | 8,211,456 bits | β |
| Embedded 18x18 Multipliers | 210 | β |
| User I/O | 226 | β |
| Package | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FineLine BGA (FBGA-484) |
| Core Voltage | 1.2 V | β |
| Operating Temperature | 0C to +85C (commercial) | β |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power (TSMC) |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | β |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | β |
| Number of I/O Banks | 8 | β |
| Hot Socketing | Supported | β |
| PLLs | 4 | 4 |
| RoHS Status | Compliant | Compliant (lead-free, N suffix) |
| Mounting Type | Surface Mount | Surface Mount |
| Family | β | Cyclone III LS |
| Logic Elements | β | 100,448 |
| Embedded Memory (bits) | β | 4,451,328 |
| User I/O Pins | β | 278 |
| DSP Blocks (18x18 multipliers) | β | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | β | [DATA_NEEDED: global clock count] |
| Core Supply Voltage | β | 1.2 V |
| Operating Temperature (junction) | β | 0Β°C to +85Β°C (commercial) |
| Speed Grade | β | C7 |
| Ball Pitch | β | 1.0 mm |
| Package Dimensions | β | [DATA_NEEDED: package body dimensions] |
| Configuration Method | β | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Security Features | β | Bitstream encryption, JTAG tamper protection |
| Design Software | β | Quartus II / Intel Quartus Prime |