EP3CLS200F484C8 vs EP3CLS200F484C7N Comparison
Detailed side-by-side comparison of EP3CLS200F484C8 by Intel and EP3CLS200F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS200F484C8
EP3CLS200F484C8 - Cyclone III LS FPGA 198K LE | Intel | 484-BGA
EP3CLS200F484C8 β ActiveIntel
EP3CLS200F484C7N
EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel
EP3CLS200F484C7N β ActiveSpecification Comparison
| Parameter | EP3CLS200F484C8 | EP3CLS200F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $118.00 | $1,650.00 |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone III LS (low-power Cyclone III) | β |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 20,5056 (approx) | 12,404 |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | 8,211,456 bits |
| Embedded 18x18 Multipliers | 210 | 210 |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | β |
| I/O Banks | 8 | β |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Package | 484-pin FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | β |
| Configuration Modes | AS, PS, FPP, JTAG | AS, PS, JTAG (IEEE 1149.1) |
| Security | Design encryption / bitstream AES | β |
| Operating Temperature | 0C to +85C (commercial, 'C' suffix) | 0C to +85C (commercial) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| User I/O | β | 226 |
| I/O Standards | β | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | β | 8 |
| Hot Socketing | β | Supported |