EP3CLS200F484C8 vs EP3CLS70F484C8 Comparison

Detailed side-by-side comparison of EP3CLS200F484C8 by Intel and EP3CLS70F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3CLS200F484C8

EP3CLS200F484C8 - Cyclone III LS FPGA 198K LE | Intel | 484-BGA

EP3CLS200F484C8 βœ“ Active
Intel
EP3CLS70F484C8

EP3CLS70F484C8 - Cyclone III LS FPGA, 70K LE, 484-FBGA | Intel

EP3CLS70F484C8 βœ“ Active

Specification Comparison

Parameter EP3CLS200F484C8 EP3CLS70F484C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $118.00 $198.00
Series Cyclone III LS β€”
Family Cyclone III LS (low-power Cyclone III) Cyclone III LS
Logic Elements (LE) 198,464 β€”
Logic Array Blocks (LAB) 20,5056 (approx) β€”
Embedded Memory 8,211,456 bits (approx 8 Mbit) β€”
Embedded 18x18 Multipliers 210 β€”
PLLs 4 4
Maximum User I/O 304 β€”
I/O Banks 8 β€”
Core Voltage 1.2 V β€”
Process Technology 65 nm low-power CMOS 65 nm TSMC low-power
Package 484-pin FBGA (FineLine BGA) 484-ball FineLine BGA (FBGA-484)
Package Dimensions 23 mm x 23 mm, 1.0 mm ball pitch β€”
Configuration Modes AS, PS, FPP, JTAG β€”
Security Design encryption / bitstream AES β€”
Operating Temperature 0C to +85C (commercial, 'C' suffix) β€”
Mounting Type Surface Mount β€”
RoHS Status Compliant Compliant
Logic Elements β€” 70,208
Logic Array Blocks (LABs) β€” 278
Total Embedded Memory Bits β€” 3,068,928
Embedded Memory Blocks β€” M9K (4 Kbit each)
Embedded Multipliers (18x18) β€” 300
Maximum User I/O Pins β€” 278
Global Clock Networks β€” 20
Core Supply Voltage β€” 1.2 V
Operating Junction Temperature β€” 0C to +85C (commercial)
Bitstream Encryption β€” AES-256 (Cyclone III LS feature)
Configuration Mode β€” Active serial, passive serial, JTAG, fast passive parallel
Lead-Free β€” Yes

Datasheets & Resources

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